Abstract: A semiconductor device includes a substrate, a dielectric region, a plurality of conductive regions, a first conductive rail and a conductive structure. The dielectric region is situated on the substrate. The plurality of conductive regions are situated on the dielectric region. The first conductive rail is situated within the dielectric region, and is electrically connected to a first conductive region of the plurality of conductive regions. The conductive structure is arranged to penetrate through the substrate and formed under the first conductive rail. The conductive structure is electrically connected to the first conductive rail.

Abstract: In some embodiments, the present disclosure relates to an integrated chip having a lower power rail continuously extending over a plurality of gate structures. A first set of connection pins straddle a first edge of the lower power rail, and a second set of connection pins straddle a second edge of the lower power rail, which is opposite the first edge. The first set of connection pins and the second set of connection pins are electrically coupled to the lower power rail. An upper power rail is over the lower power rail and is electrically coupled to the first set of connection pins and the second set of connection pins. The first set of connection pins are arranged at a first pitch and the second set of connection pins arranged with respect to the first set of connection pins at a second pitch less than the first pitch.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a source region and a drain region separated by a channel region within a substrate. A middle-end-of-the-line (MEOL) structure is over the drain region and a gate structure is over the channel region. The MEOL structure is vertically disposed between the drain region and a plane extending along an upper surface of the gate structure. A first interconnect wire is connected to the MEOL structure by a first conductive contact that is directly over the drain region and that extends between the first interconnect wire and the MEOL structure. A conductive strap is located over the first interconnect wire. The conductive strap connects the first interconnect wire to a power rail having a larger width than the first interconnect wire.

Abstract: Gate structures extending continuously above a first active region, a second active region and a non-active region of a substrate of a semiconductor structure are arranged. At least one local interconnect over the non-active region and between two of the gate structures is selectively arranged, to couple at least one of contacts that is arranged above the first active region to at least one of the contacts that is arranged above the second active region.

Abstract: Examples of an integrated circuit a having an advanced two-dimensional (2D) metal connection with metal cut and methods of fabricating the same are provided. An example method for fabricating a conductive interconnection layer of an integrated circuit may include: patterning a conductive connector portion on the conductive interconnection layer of the integrated circuit using extreme ultraviolet (EUV) lithography, wherein the conductive connector portion is patterned to extend across multiple semiconductor structures in a different layer of the integrated circuit; and cutting the conductive connector portion into a plurality of conductive connector sections, wherein the conductive connector portion is cut by removing conductive material from the metal connector portion at one or more locations between the semiconductor structures.

Abstract: A method is disclosed that includes disposing a first conductive metal segment; disposing a second conductive metal segment over an active area; disposing a local conductive segment to couple the first conductive metal segment and the second conductive metal segment; disposing a first conductive via on the first conductive metal segment; and disposing a first conductive line coupled to the first conductive metal segment through the first conductive via.

Abstract: The present disclosure relates to an integrated chip. In some embodiments, the integrated chip has a first plurality of source and drain regions disposed within a substrate along a first line extending in a first direction. A plurality of gate structures are arranged over the substrate at a substantially regular pitch, and a plurality of middle-of-the-line (MOL) structures are respectively interleaved between adjacent ones of the plurality of gate structures. The plurality of MOL structures include MOL active structures that are electrically coupled to an overlying conductive interconnect and MOL dummy structures that are not electrically coupled to any overlying conductive interconnect. The plurality of MOL structures are arranged over the first plurality of source and drain regions at an irregular pitch that is larger than the substantially regular pitch.

Abstract: A semiconductor device including multiple fins. At least a first set of fins among the multiple fins is substantially parallel. At least a second set of fins among the multiple fins is substantially collinear. For any given first and second fins of the multiple fins having corresponding first and second fin-thicknesses, the second fin-thickness is less than plus or minus about 50% of the first fin-thickness.

Abstract: A method for forming a semiconductor structure includes following operations. Gate structures are arranged above a first active region, a second active region and a non-active region of a substrate of a semiconductor structure. The first and second active regions are spaced apart by the non-active region. Contacts are arranged above the first and second active regions. At least one gate via is arranged above the first active region or the second active region. The at least one gate via is electrically coupled with the gate structures. At least one local interconnect is selectively arranged over the non-active region, to couple at least one of the contacts above the first active region to at least one of the contacts above the second active region.

Abstract: A method for calculating cell edge leakage in a semiconductor device comprising performing a device leakage simulation to obtain leakage information for different cell edge conditions and providing attributes associated with cell edges in the semiconductor device. The method further comprises performing an analysis to identify cell abutment cases present in the semiconductor device and calculating the leakage of the semiconductor device based at least in part on probabilities associated with the cell abutment cases and the simulated leakage values obtained from the device leakage simulation.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method is performed by forming gate structures and middle-end-of-the-line (MEOL) structures extending in a first direction over an active area of a substrate. The MEOL structures are interleaved between the gate structures along a second direction. The method further forms a power rail and a first metal wire extending in the second direction. The first metal wire is over the MEOL structures. A double patterning process is performed to form second and third metal wires extending in the first direction over the first metal wire and separated in the second direction. The second metal wire is cut according to a first cut region of a first cut mask to define a first metal strap connecting a first one of the MEOL structures to the power rail.

Abstract: A layout modification method is performed by at least one processor. The layout modification method includes: analyzing, by the at least one processor, allocation of a plurality of specific layout segments of a circuit cell layout to determine a first specific layout segment and a second specific layout segment from the plurality of specific layout segments; determining, by the at least one processor, if the first specific layout segment and the second specific layout segment are coupled to a first signal level; and merging, by the at least one processor, the first specific layout segment and the second specific layout segment into a first merged layout segment when the first specific layout segment and the second specific layout segment are coupled to the first signal level.

Abstract: A method performed by at least one processor comprises the operations of obtaining information on gate pitch and a ratio m:n between gate pitch and metal line pitch, m, n being a natural number and the ratio being in the simplest form, determining a unit pattern having a width of n times of the gate pitch, assigning m consecutive metal lines to the unit pattern, dividing the width of the unit pattern by m and obtaining a quotient (Q) and a remainder (R), determining an integer P so that a value of the remainder R divided by P satisfies a layout precision, and determining an inter-pattern metal line pitch and an intra-pattern metal line pitch based on Q and R/P.

Abstract: A semiconductor device includes an active region comprising a source/drain region and a plurality of poly strips spaced apart and arranged along a first direction crossing over the active region. The first direction is substantially perpendicular to a lengthwise direction of the active region. A first metal pattern is disposed on the poly strips and arranged along the first direction. A plurality of first interconnect plugs is interposed in between the poly strips and the first metal pattern and in between the active region and the first metal pattern. A position of the first interconnect plugs being variable along the first direction.

Abstract: The present disclosure relates to a method of forming an integrated chip. The method may be performed by forming first and second source regions within a substrate. The first and second source regions are separated by a drain region along a first direction. First and second middle-end-of-the-line (MEOL) structures are formed over the substrate. The first and second MEOL structures have bottom surfaces that continually extend past edges of the first and second source regions, respectively, along a second direction perpendicular to the first direction. A power rail is formed that is electrically coupled to the first and second MEOL structures. The power rail has a first interconnect wire, a via rail on and in contact with the first interconnect wire, and a second interconnect wire on and in contact with the via rail. The via rail continuously extends along the first direction past the first and second MEOL structures.

Abstract: Examples of an integrated circuit a having an advanced two-dimensional (2D) metal connection with metal cut and methods of fabricating the same are provided. An example method for fabricating a conductive interconnection layer of an integrated circuit may include: patterning a conductive connector portion on the conductive interconnection layer of the integrated circuit using extreme ultraviolet (EUV) lithography, wherein the conductive connector portion is patterned to extend across multiple semiconductor structures in a different layer of the integrated circuit; and cutting the conductive connector portion into a plurality of conductive connector sections, wherein the conductive connector portion is cut by removing conductive material from the metal connector portion at one or more locations between the semiconductor structures.

Abstract: The present disclosure relates to a method of forming an integrated chip having middle-of-the-line (MOL) structures arranged at an irregular pitch, and an associated method of formation. In some embodiments, the integrated chip has a well region with a plurality of source/drain regions. A plurality of gate structures are arranged over the well region at a regular pitch. A plurality of middle-of-the-line (MOL) structures are laterally interleaved between some of the plurality of gate structures and are arranged over the well region at an irregular pitch having a first pitch that is larger than the regular pitch. Since the MOL structures have an irregular pitch with a first pitch that is larger than the regular pitch, one or more of the plurality of gate structures are spaced apart from a closest gate or MOL structure by a space that reduces parasitic capacitance.

Abstract: A method, of manufacturing fins for a semiconductor device which includes Fin-FETs, includes: forming a structure including a semiconductor substrate and capped semiconductor fins, the capped semiconductor fins being organized into at least first and second sets, with each member of the first set having a first cap with a first etch sensitivity, and each member of the second set having a second cap with a second etch, the second etch sensitivity being different than the first etch sensitivity; removing selected members of the first set and selected members of the second set from the structure.

Abstract: A method of manufacturing a semiconductor device includes providing a material above a substrate and respectively forming separate gate electrode lines on opposite sidewalls of the material. As such, a width of cut between the gate electrode lines can be minimized. This shortens a height of cell of the semiconductor device, increasing a cell density of the semiconductor device.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method is performed by forming gate structures and middle-end-of-the-line (MEOL) structures extending in a first direction over an active area of a substrate. The MEOL structures are interleaved between the gate structures along a second direction. The method further forms a power rail and a first metal wire extending in the second direction. The first metal wire is over the MEOL structures. A double patterning process is performed to form second and third metal wires extending in the first direction over the first metal wire and separated in the second direction. The second metal wire is cut according to a first cut region of a first cut mask to define a first metal strap connecting a first one of the MEOL structures to the power rail.