Abstract: To enable manufacturing of a display device with a low defect rate and high yield, an integrated circuit chip includes a drive circuit that drives a light emitting unit, and the drive circuit includes a P-side electrode connected to an anode of the light emitting unit and a nonvolatile memory transistor that controls current supply to the P-side electrode.

Abstract: An image display element includes: pixels arranged in an array, each of the pixels including a micro light emitting element; and a driving circuit substrate including a driving circuit configured to supply a current to the micro light emitting element to cause the micro light emitting element to emit light. The micro light emitting element emits emission light in an opposite direction to the driving circuit substrate. The micro light emitting element includes a light emitting portion configured to generate the emission light, a reflection/transmission film provided on the light emitting portion at a part facing in a light emission direction, and a reflective surface provided on the light emitting portion at a part proximate to the driving circuit substrate. The reflection/transmission film and the reflective surface constitute a microcavity for the emission light. A tilted reflective surface is provided on a side of the light emitting portion.

Abstract: An image display element provides an image display element including a plurality of micro light-emitting elements arrayed in an array manner, and a semiconductor layer at which a drive circuit is disposed, the drive circuit being configured to supply a current to each of the plurality of micro light-emitting elements to cause light to be emitted, in which a transistor that constitutes the drive circuit and a wiring layer are disposed at a first surface of the semiconductor layer, the plurality of micro light-emitting elements are disposed at a second surface of the semiconductor layer that is an opposite side of the first surface, and the transistor and the wiring layer are electrically coupled to the micro light-emitting elements through a through substrate via that extends through the semiconductor layer.

Abstract: An image display device includes a plurality of micro light-emission elements that constitute a pixel and that are provided on a driving circuit substrate. The micro light-emission element displays an image by emitting light to a side opposite to the driving circuit substrate. A light convergence portion that converges light is disposed in the pixel.

Abstract: An image display device includes: a plurality of LED elements that are mounted on a drive circuit substrate and emit light source light; a wavelength conversion layer that is stacked on a side of the LED elements opposite to the drive circuit substrate, converts the light source light emitted by the LED elements into long wavelength light, and emits the long wavelength light to a side opposite to the drive circuit substrate; and a first functional layer that is disposed on a light emitting surface side of the long wavelength light of the wavelength conversion layer, reflects the light source light, and transmits the long wavelength light.

Abstract: An image display device includes a drive circuit substrate, micro LED elements, and a wavelength conversion layer that converts excitation light emitted from the micro LED elements and that emits converted long-wavelength light to a side opposite to the drive circuit substrate, the micro LED elements and the wavelength conversion layer being sequentially stacked on the drive circuit substrate. The micro LED elements include a first multilayer film that reflects the long-wavelength light converted by the wavelength conversion layer.

Abstract: A display portion including a plurality of pixel units that are paired with a plurality of micro lenses is provided, in which each of the pixel units has a plurality of pixels and each of the pixels includes a micro LED.

Abstract: An image-forming element includes a plurality of pixels, and projects and displays light emitted from the pixels. The image-forming element includes a light emitting element which includes a light source emitting the light and a mounting substrate on which a plurality of light emitting elements are provided on a mounting surface. A plurality of light sources which are segmented and included in at least one pixel are provided, and each of the light sources includes power supply electrodes provided on the same surface or a surface facing the mounting substrate. The mounting substrate includes a drive circuit which drives the light source and electrodes which are provided on the mounting surface and are electrically connected to the power supply electrodes of the light source. In each pixel, an area occupation ratio of the light source with respect to a region area of the pixel is 15% or more and 85% or less.

Abstract: Provided is an imaging device that is able to obtain a clear image in a relatively long distance in an environment of precipitation. A rainy weather camera includes: a light source that emits pulse light; a fan-shaped pulse light radiation unit that performs scanning in one direction with the pulse light emitted by the light source, spreads, in a direction perpendicular to the scanning direction, the pulse light for the scanning when the scanning is performed, and radiates the pulse light, which is in a state of being polarized in the direction perpendicular to the scanning direction, to an object; an imaging unit that receives reflection light from the object and performs exposure to a pixel; and a polarization filter that transmits light that is included in the reflection light received by the imaging unit and polarized to be parallel to the scanning direction. The imaging unit performs exposure only to a pixel which is synchronized with the scanning with the pulse light.

Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Abstract: An image display device includes a drive circuit substrate, micro LED elements, and a wavelength conversion layer that converts excitation light emitted from the micro LED elements and that emits converted long-wavelength light to a side opposite to the drive circuit substrate, the micro LED elements and the wavelength conversion layer being sequentially stacked on the drive circuit substrate. The micro LED elements include a first multilayer film that reflects the long-wavelength light converted by the wavelength conversion layer.

Abstract: An image display device comprises a drive circuit substrate including a drive circuit that supplies currents to micro light-emitting elements to emit light; and the micro light-emitting elements arranged in an array shape on the drive circuit substrate, wherein a light-distribution control unit that increases forward light emission of the micro light-emitting elements is disposed on a light-emitting surface of each of the micro light-emitting elements, and a partition wall that does not transmit the light emitted by the micro light-emitting elements is disposed around the light-distribution control unit.

Abstract: An image-forming element includes a plurality of pixels, and projects and displays light emitted from the pixels. The image-forming element includes a light emitting element which includes a light source emitting the light and a mounting substrate on which a plurality of light emitting elements are provided on a mounting surface. A plurality of light sources which are segmented and included in at least one pixel are provided, and each of the light sources includes power supply electrodes provided on the same surface or a surface facing the mounting substrate. The mounting substrate includes a drive circuit which drives the light source and electrodes which are provided on the mounting surface and are electrically connected to the power supply electrodes of the light source. In each pixel, an area occupation ratio of the light source with respect to a region area of the pixel is 15% or more and 85% or less.

Abstract: In an image display device, a scattering unit has a size that covers a surface of a red conversion unit on a side that emits light having a second wavelength and a surface of a green conversion unit on a side that emits light having a third wavelength, and faces at most a part of a micro LED element.

Abstract: In a pixel, at least two sets of a pair of wiring lines, that is connected to a pair of electrodes of a micro-LED and is coupled to a pixel circuit, are disposed, the pixel circuit has a first LED drive circuit that supplies a current to the micro-LED and a second LED drive circuit that substitutes for the first LED drive circuit, and the pixel circuit also has a switching device that short-circuits the pair of wiring lines.

Abstract: A three-dimensional display includes a plurality of micro-projectors, each of which including a display element and a projection optic, and a micro-lens array, and each micro-projector projects a display image displayed by the display element onto the micro-lens array through the projection optic and the display element includes a drive circuit substrate and a plurality of micro light emission elements formed on a surface on one side of the drive circuit substrate.

Abstract: An image display element includes micro light emitting elements disposed in an array on a driving circuit substrate. An excitation light emitting element includes a main body including a compound semiconductor, a metal electrode disposed on a side of the main body located closer to the driving circuit substrate, and a transparent electrode disposed on an opposite side to the driving circuit substrate, and a light emission layer included in the main body is disposed on a side opposite to the driving circuit substrate from a center portion of the main body.

Abstract: To enable manufacturing of a display device with a low defect rate and high yield, an integrated circuit chip includes a drive circuit that drives a light emitting unit, and the drive circuit includes a P-side electrode connected to an anode of the light emitting unit and a nonvolatile memory transistor that controls current supply to the P-side electrode.

Abstract: An SN ratio of light to be received is improved. A polarizing filter (150) that is arranged in a light path extending from an object (11) to a light receiving unit (154) of a ToF sensor (153) and allows transmission of light polarized in a direction vertical to a direction of scanning is provided.

Abstract: [Object] To provide a micro LED element that can reduce deterioration in light emission efficiency, even when the micro LED element is miniaturized in size. [Solution] A micro LED element (100) includes: a nitride semiconductor layer (14) including an N-side layer (11), a light emission layer (12), and a P-side layer (13); and a plurality of micro-mesas each having a slope that surrounds the light emission layer (12) and is inclined at an angle within a prescribed range including 45° as an angle (?) formed by the slope and the light emission layer, and a flat portion formed by a surface of the P-side layer.