Abstract: The present invention includes: a front-side positive trace (2P) disposed on a flexible substrate (5); a positive external connection line (12P) connected to the front-side positive trace (2P) to supply electric power; and LED chips (4) provided to the flexible substrate (5) and connected to the front-side positive trace (2P), wherein an electric resistance between the positive external connection line (12P) and one of the LED chips (4) which is farthest from the positive external connection line (12P) is less than an internal resistance of the one of the LED chips (4).

Abstract: A base substrate include a first substrate (110) having a first principal surface (110a) and a second principal surface (110b), and a first wiring member placed over the first or second principal surface. A pixel substrate includes a second substrate (201) having a third principal surface (201a) and a fourth principal surface (201b), a plurality of light-emitting elements (202) mounted over the third principal surface, a driver IC (205) mounted over the third principal surface, an external connection terminal mounted over the third principal surface, and a second wiring member (206) placed on the third or fourth principal surface. The driver IC drives the plurality of light-emitting elements. The external connection terminal receives an input signal that is supplied from outside the pixel substrate. The second substrate (201) is disposed to be stacked on top of the first substrate (110) so that the first principal surface and the fourth principal surface face each other.

Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Abstract: An image display device includes a drive circuit substrate, micro LED elements, and a wavelength conversion layer that converts excitation light emitted from the micro LED elements and that emits converted long-wavelength light to a side opposite to the drive circuit substrate, the micro LED elements and the wavelength conversion layer being sequentially stacked on the drive circuit substrate. The micro LED elements include a first multilayer film that reflects the long-wavelength light converted by the wavelength conversion layer.

Abstract: An image display device includes a plurality of micro light-emission elements that constitute a pixel and that are provided on a driving circuit substrate. The micro light-emission element displays an image by emitting light to a side opposite to the driving circuit substrate. A light convergence portion that converges light is disposed in the pixel.

Abstract: A light irradiation substrate (1) includes a flexible substrate (5), first electrical conducting material patterns (15) composed of wirings (2) and a dummy pattern (6) which are provided on a front surface of the flexible substrate (5), and LED chips (4) each of which is mounted on each of the wirings (2), front surfaces of the first electrical conducting material patterns (15) are formed of a reflecting material having total light flux reflectance of 80% or more, and area coverage of the first electrical conducting material patterns (15) at least in a region surrounded by the LED chips (4) is 85% or more.

Abstract: A display portion including a plurality of pixel units that are paired with a plurality of micro lenses is provided, in which each of the pixel units has a plurality of pixels and each of the pixels includes a micro LED.

Abstract: [Object ] To provide a micro LED element that can reduce deterioration in light emission efficiency, even when the micro LED element is miniaturized in size. [Solution] A micro LED element (100) includes: a nitride semiconductor layer (14) including an N-side layer (11), a light emission layer (12), and a P-side layer (13); and a plurality of micro-mesas each having a slope that surrounds the light emission layer (12) and is inclined at an angle within a prescribed range including 45° as an angle (?) formed by the slope and the light emission layer, and a flat portion formed by a surface of the P-side layer.

Abstract: A photodetector measures flight time by an imaging optical element imaging reflected light from an illuminated illumination region of an object illuminated by pulse light, and a light detection portion receiving the imaged light. The light detection portion is formed larger than a projection region reflected at the illumination region of the object and imaged on the light detection portion. In the light detection portion, a portion overlaying the projection region is activated as a light-detection region.

Abstract: A phototherapy apparatus includes: a light irradiation module that radiates light for treatment; and a spacer that is disposed on a light output side of the light irradiation module and contacts a surface of a body to keep a distance between the light irradiation module and a part to be treated on the surface of the body constant, in which a spacer opening that avoids contact of the part to be treated and the spacer is formed on a surface of the spacer, which contacts the surface of the body.

Abstract: A pulsed light emitting element emits pulsed light that is linearly polarized in a first polarization direction, the pulsed light passes through a polarizing beam splitter and a lens in this order and is radated onto a target object, reflected light passes through the lens and the polarizing beam splitter in this order, is linearly polarized in a second polarization direction that is different from the first polarization direction, and is concentrated on a light receiving element, the pulsed light emitting element and the light receiving element are provided on a focal plane of the lens, and the optical axis of the pulsed light and the optical axis of the reflected light overlap.

Abstract: An optical treatment apparatus includes: a power source unit; a light irradiation module, that irradiates an affected part with light; a spacer that is positioned between the light irradiation module and the affected part; a fixing material that applies pressure to the light irradiation module and fixes the light irradiation module at an installation position; and a shielding material that covers the light irradiation module, in which, in a case where the pressure applied by the fixing material becomes lower than predetermined pressure, supply of current is stopped.

Abstract: Light irradiation that is suitable for treatment for a relatively small diseased part and is performed almost uniformly and efficiently for the entirety of an affected part even when the affected part is not flat is realized. Light output from a plurality of LED chips includes first wavelength region light whose light-emission intensity peak is in a wavelength range of 380 nm or more and 430 nm or less and second wavelength region light whose light-emission intensity peak is in a wavelength range of more than 430 nm and 635 nm or less, and a group of LED light sources has uniform in-plane intensity of light irradiation.

Abstract: A nitride semiconductor light-emitting element includes at least an n-type nitride semiconductor layer, a light-emitting layer, and a p-type nitride semiconductor layer. A multilayer body is provided between the n-type nitride semiconductor layer and the light-emitting layer, having at least one stack of first and second semiconductor layers. The second semiconductor layer has a greater band-gap energy than the first semiconductor layer. The first and second semiconductor layers each have a thickness of more than 10 nm and 30 nm or less. In applications in which luminous efficiency at room temperature is a high priority, the first semiconductor layer has a thickness of more than 10 nm and 30 nm or less, the second semiconductor layer has a thickness of more than 10 nm and 40 nm or less, and the light-emitting layer has V-shaped recesses in cross-sectional view.

Abstract: An image-forming element includes a plurality of pixels, and projects and displays light emitted from the pixels. The image-forming element includes a light emitting element which includes a light source emitting the light and a mounting substrate on which a plurality of light emitting elements are provided on a mounting surface. A plurality of light sources which are segmented and included in at least one pixel are provided, and each of the light sources includes power supply electrodes provided on the same surface or a surface facing the mounting substrate. The mounting substrate includes a drive circuit which drives the light source and electrodes which are provided on the mounting surface and are electrically connected to the power supply electrodes of the light source. In each pixel, an area occupation ratio of the light source with respect to a region area of the pixel is 15% or more and 85% or less.

Abstract: A nitride semiconductor light-emitting element includes at least an n-type nitride semiconductor layer, a light-emitting layer, and a p-type nitride semiconductor layer. A multilayer body is provided between the n-type nitride semiconductor layer and the light-emitting layer, having at least one stack of first and second semiconductor layers. The second semiconductor layer has a greater band-gap energy than the first semiconductor layer. The first and second semiconductor layers each have a thickness of more than 10 nm and 30 nm or less. In applications in which luminous efficiency at room temperature is a high priority, the first semiconductor layer has a thickness of more than 10 nm and 30 nm or less, the second semiconductor layer has a thickness of more than 10 nm and 40 nm or less, and the light-emitting layer has V-shaped recesses in cross-sectional view.

Abstract: A base substrate include a first substrate (110) having a first principal surface (110a) and a second principal surface (110b), and a first wiring member placed over the first or second principal surface. A pixel substrate includes a second substrate (201) having a third principal surface (201a) and a fourth principal surface (201b), a plurality of light-emitting elements (202) mounted over the third principal surface, a driver IC (205) mounted over the third principal surface, an external connection terminal mounted over the third principal surface, and a second wiring member (206) placed on the third or fourth principal surface. The driver IC drives the plurality of light-emitting elements. The external connection terminal receives an input signal that is supplied from outside the pixel substrate. The second substrate (201) is disposed to be stacked on top of the first substrate (110) so that the first principal surface and the fourth principal surface face each other.

Abstract: A light irradiation substrate (1) includes a flexible substrate (5), first electrical conducting material patterns (15) composed of wirings (2) and a dummy pattern (6) which are provided on a front surface of the flexible substrate (5), and LED chips (4) each of which is mounted on each of the wirings (2), front surfaces of the first electrical conducting material patterns (15) are formed of a reflecting material having total light flux reflectance of 80% or more, and area coverage of the first electrical conducting material patterns (15) at least in a region surrounded by the LED chips (4) is 85% or more.

Abstract: A light irradiation substrate (1) includes plural unit substrates (10) that have a flexible substrate (11). A portion of the unit substrates (10) have a pair of external connection portions (21). A first surface of the flexible substrate (11) is provided with an LED chip (13) and a wire (12) for each of the unit substrates (10), and a second surface is provided with a back surface wire (19) across the unit substrates (10).

Abstract: A light irradiation substrate is provided which can cope with cases of emergency and which is capable of optimum irradiation with therapeutic light regardless of the shape or size of affected parts while keeping a lid on cost. The center-to-center distance between two adjacent LED chips (13) facing each other across the boundary between two unit substrates (7) adjacent to each other in an X direction or (a Y direction) and belonging to the respective unit substrates (7) is twice or less as long as the center-to-center distance between two LED chips (13) adjacent to each other in the X direction (or the Y direction) within each of the unit substrates (7). Each of the unit substrates (7) includes a connection section (10) that provides external connection of wires (12). The connection section (10) is provided on a back surface of a flexible substrate (6).