Abstract: A multilayer semiconductor device includes first wirings extending in a first direction and arranged adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and the second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The third and fourth directions are neither parallel nor orthogonal to the first and second directions. The dummy wirings have a first, a second, and a third dummy wiring. Centers of the second and third dummy wirings are nearest to a center of the first dummy wiring relative to others of the dummy wirings. The respective centers of the first, second, and third dummy wirings are aligned on a third virtual linear line extending in a fifth direction neither parallel to nor perpendicular to the first and second directions.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction and arranged adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and the second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The third and fourth directions are neither parallel nor orthogonal to the first and second directions. The dummy wirings have a first, a second, and a third dummy wiring. Centers of the second and third dummy wirings are nearest to a center of the first dummy wiring relative to others of the dummy wirings. The respective centers of the first, second, and third dummy wirings are aligned on a third virtual linear line extending in a fifth direction neither parallel to nor perpendicular to the first and second directions.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction and arranged adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and the second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The third and fourth directions are neither parallel nor orthogonal to the first and second directions. The dummy wirings have a first, a second, and a third dummy wiring. Centers of the second and third dummy wirings are nearest to a center of the first dummy wiring relative to others of the dummy wirings. The respective centers of the first, second, and third dummy wirings are aligned on a third virtual linear line extending in a fifth direction neither parallel to nor perpendicular to the first and second directions.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction and arranged adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and the second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The third and fourth directions are neither parallel nor orthogonal to the first and second directions. The dummy wirings have a first, a second, and a third dummy wiring. Centers of the second and third dummy wirings are nearest to a center of the first dummy wiring relative to others of the dummy wirings. The respective centers of the first, second, and third dummy wirings are aligned on a third virtual linear line extending in a fifth direction neither parallel to nor perpendicular to the first and second directions.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction and arranged adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and the second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The third and fourth directions are neither parallel nor orthogonal to the first and second directions. The dummy wirings have a first, a second, and a third dummy wiring. Centers of the second and third dummy wirings are nearest to a center of the first dummy wiring relative to others of the dummy wirings. The respective centers of the first, second, and third dummy wirings are aligned on a third virtual linear line extending in a fifth direction neither parallel to nor perpendicular to the first and second directions.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and a second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The dummy wirings have a first dummy wiring, a second dummy wiring, a third dummy wiring, a fourth dummy wiring, and a fifth dummy wiring. When the dummy wirings are rotated around a center of the first dummy wiring through 90 degrees, centers of the second, third, fourth, and fifth dummy wirings are aligned with centers of the fourth, fifth, third, and second dummy wirings prior to being rotated.

Abstract: A fuel-filter abnormality detection device is used for a subject filter provided in a fuel supply device of an engine to filtrate a fuel. The fuel-filter abnormality detection device includes a first filter attachable downstream of the subject filter in fuel flow. A filtration capacity of the first filter is smaller than a filtration capacity of the subject filter, and the first filter traps a foreign matter on a downstream side of the subject filter to cause a change in fuel pressure indicating an abnormality of the subject filter. The fuel-filter abnormality detection device may include a bypass passage through which the fuel bypasses the first filter, a bypass control valve configured to allow the fuel to flow through the bypass passage when the abnormality of the subject filter is detected, and a second filter filtrating the fuel flowing through the bypass passage.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and a second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The dummy wirings have a first dummy wiring, a second dummy wiring, a third dummy wiring, a fourth dummy wiring, and a fifth dummy wiring. When the dummy wirings are rotated around a center of the first dummy wiring through 90 degrees, centers of the second, third, fourth, and fifth dummy wirings are aligned with centers of the fourth, fifth, third, and second dummy wirings prior to being rotated.

Abstract: A multilayer semiconductor device includes first wirings extending in a first direction and arranged adjacent to each other in a second direction. Dummy wirings are arranged between the first wirings and the second wiring at crossing points between first virtual linear lines extending in a third direction and second virtual linear lines extending in a fourth direction. The third and fourth directions are neither parallel nor orthogonal to the first and second directions. The dummy wirings have a first, a second, and a third dummy wiring. Centers of the second and third dummy wirings are nearest to a center of the first dummy wiring relative to others of the dummy wirings. The respective centers of the first, second, and third dummy wirings are aligned on a third virtual linear line extending in a fifth direction neither parallel to nor perpendicular to the first and second directions.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A supply pump includes a housing, a tappet, a guide groove, and a stopper pin. The housing includes a cylindrical sliding wall. The tappet is configured to be reciprocated along the sliding wall. The guide groove is provided for one of the housing and the tappet. One end of the guide groove includes a tapered surface. The stopper pin is provided for the other one of the housing and the tappet. The stopper pin is fitted into the guide groove to stop rotation of the tappet relative to the housing. When the tappet is displaced abnormally in an upper direction, the tapered surface is pressed on an end of the stopper pin to be engaged with the stopper pin.

Abstract: A fuel-filter abnormality detection device is used for a subject filter provided in a fuel supply device of an engine to filtrate a fuel. The fuel-filter abnormality detection device includes a first filter attachable downstream of the subject filter in fuel flow. A filtration capacity of the first filter is smaller than a filtration capacity of the subject filter, and the first filter traps a foreign matter on a downstream side of the subject filter to cause a change in fuel pressure indicating an abnormality of the subject filter. The fuel-filter abnormality detection device may include a bypass passage through which the fuel bypasses the first filter, a bypass control valve configured to allow the fuel to flow through the bypass passage when the abnormality of the subject filter is detected, and a second filter filtrating the fuel flowing through the bypass passage.

Abstract: A cylinder body includes a cylinder hole and a discharge flow passage. The cylinder hole receives a plunger and forms a pressurizing chamber in one axial end portion thereof. The discharge flow passage is connected to the pressurizing chamber and is adapted to guide and discharge the pressurized fuel from the pressurizing chamber to an outside of the housing. A connection opening of the discharge flow passage is formed in a hole wall of the cylinder hole. A pressure is applied to a predetermined prestressing subject area in the hole wall of the cylinder hole and a passage wall of the discharge flow passage through autofrettage to generate a residual compression stress in the predetermined prestressing subject area and thereby to form a prestressed area of a final product. The prestressing subject area includes an inner peripheral edge of the connection opening.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A method for dismantling a furnace having a multilayered refractory structure including: a furnace shell; a containing layer that is formed of a containing refractory that contains asbestos, and covers the inner side of the furnace shell; and a multilayered non-containing layer that is formed of a non-containing refractory that contains no asbestos, and covers the inner side of the containing layer, the method includes: a primary dismantling process; and a secondary dismantling process conducted after the primary dismantling process. In the primary dismantling process, the non-containing layer is dismantled from a furnace-core side thereof but the containing layer and at least one layer of the layers forming the non-containing layer, which is in contact with the containing layer, are left as a remnant. In the secondary dismantling process, the remnant is dismantled while asbestos measures are implemented.