Abstract: A method of fabricating a semiconductor device, includes depositing, on a semiconductor substrate, a gate insulating film, a polycrystalline or amorphous silicon film, a silicon nitride film and a silicon oxide film sequentially, patterning a resist for forming a plurality of trenches on an upper surface of the substrate so as to have opening widths differing from each other, etching the silicon oxide film and the silicon nitride film formed on the substrate by an reactive ion etching (RIE) process with the resist serving as a mask, and etching the polycrystalline or amorphous silicon film, the gate insulating film and the substrate by the RIE process with the etched silicon oxide film and silicon nitride film serving as a mask using reactive plasma including a halogen gas, fluorocarbon gas, Ar and O2, thereby simultaneously forming the trenches with opening widths differing from each other.

Abstract: A highly efficient integrated coal gasification combined cycle plant is provided having a dust removing system which can reliably exhibit a desired dust removing performance and which can maintain high operational reliability such that the occurrence of dust leaks is prevented. The integrated coal gasification combined cycle plant has a coal gasification furnace configured to yield a coal gas by gasification of coal, a gas turbine generator driven with a gas turbine which is operated using the coal gas as fuel and which discharges a high-temperature combustion exhaust gas, an exhaust heat recovery boiler configured to recover heat from the high-temperature combustion exhaust gas and to produce steam, and a steam turbine generator driven with a steam turbine operated using the steam produced by the exhaust heat recovery boiler.

Abstract: A polyester film for forming which is excellent in formability especially at low temperatures and low pressures and in solvent resistance and heat resistance and is reduced in environmental burden. The polyester film for forming is a biaxially oriented polyester film comprising a copolyester as a component, and is characterize in that (1) the stress at 100% elongation of the film in each of the machine direction and the transverse direction is 10 to 1,000 MPa at 25° C. and is 1 to 100 MPa at 100° C.; (2) the storage viscoelasticity (E?) of the film in each of the machine direction and the transverse direction is 10 to 1,000 MPa at 100° C. and is 5 to 40 MPa at 180° C.; and (3) the degree of heat distortion (initial load, 49 mN) of the film in the machine direction is ?3% to +3% at 175° C.

Abstract: A production method for producing an electrode plate that can hold well the active material and producing a battery using the electrode plate. A production method for an electrode plate of a battery includes the steps of: forming at least one electrode plate prototype by forming a layer filled with an active material on a main surface of a plate-shaped core body; and infiltrating a liquid containing a resin and an organic solvent into at least part of a circumference of the layer filled with the active material. The applied liquid infiltrates into the circumferential region of the active material filling area, namely an outer edge of the layer and an area in its vicinity including the outer edge. The resin contained in the liquid enhances the bonding force between the conductive core body and the active material particles and between the active material particles.

Abstract: A biaxially oriented polyamide laminate film having a layered structure of A/B, A/B/A or A/B/C, layer A having no projections with a height of 0.27 ?m or higher on the surface, or having a density of projections with a height of 0.27 ?m or higher on the surface of 200 projections/mm2, and the film exhibiting a maximum dimensional change of 4% or less during immersion in 95° C. hot water, a maximum dimensional change of 6% or less after withdrawal from the hot water, and a maximum dimensional change of 4% or less after heat treatment in dry hot air at 160° C.; and a process for producing the same. This film reduces the differences in physical properties in the width direction that occurs in a tenter and exhibits excellent adhesive properties, resistance to fatigue from flexing and operability, and can be provided economically.

Abstract: [Problems] The present invention provides a-polyester-film superior in heat resistance, chemical resistance, insulation property and thermal dimensional stability, and suitable for application to fields associated with boiling or retort treatment, which require tenacity, pinhole resistance, bending resistance, bag breakage resistance on dropping, impact resistance and the like, fields requiring thermoforming or vacuum forming, and various uses such as packaging bags for water-containing food, pharmaceutical products and the like. [Solving Means] The polyester film characteristically shows an initial elastic modulus in at least one direction of 2.5-10 GPa, an impact strength of 40-10000 J/mm, a thermal shrinkage in at least one direction at 150° C. of ?0.5% to 6%, a haze of 0.001% to 7%, and an absolute value of the difference in the thermal shrinkage between the longitudinal direction and the transverse direction of not more than 1.1%.

Abstract: A porous polyester film containing a polyester resin as a main starting material is provided. By optimizing the melt viscosity of a void-forming agent to be added, the ratio of the number of voids to film thickness can be set to 0.20 void/?m or above. As a result a lightweight polyester film can be provided, which has a high strength, superior processability and high reflectivity to visible light. This film is suitable as a material for various reflectors.

Abstract: A polyester film for forming which is excellent in formability especially at low temperatures and low pressures and in solvent resistance and heat resistance and is reduced in environmental burden. The polyester film for forming is a biaxially oriented polyester film comprising a copolyester as a component, and is characterize in that (1) the stress at 100% elongation of the film in each of the machine direction and the transverse direction is 10 to 1,000 MPa at 25° C. and is 1 to 100 MPa at 100° C.; (2) the storage viscoelasticity (E?) of the film in each of the machine direction and the transverse direction is 10 to 1,000 MPa at 100° C. and is 5 to 40 MPa at 180° C.; and (3) the degree of heat distortion (initial load, 49 mN) of the film in the machine direction is ?3% to +3% at 175° C.

Abstract: This invention provides a novel polymerization catalyst other than antimony compounds, polyester produced by using the same and a process for producing polyester. The polycondensation catalyst of this invention is a polyester polymerization catalyst comprising an aluminum compound and a phosphorus compound having a specific structure. Further, this invention relates to polyester produced by using this polyester polymerization catalyst and a process for producing polyester. Further, this invention relates to fibers, films and hollow molded articles comprising the polyester.

Abstract: A semiconductor device includes a stopper film formed so as to cover an element formation region and an element isolation region, an interlayer insulating film formed on the stopper film, a contact hole formed in the element formation region so as to extend through the interlayer insulating film and the stopper film, and a contact plug buried in the contact hole. The contact hole includes an upper part extending through the interlayer insulating film, an intermediate part extending through the stopper film and a lower part formed by etching a surface of the element formation region. The lower part includes an interface between the intermediate part and the lower part and a part near to a central part. The interface has a first diameter and the part near to the central part has a second inner diameter. The lower part is formed so that the second diameter is larger than the first inner diameter.

Abstract: Disclosed is a heat-shrinkable polyester film having a specific composition. A heat shrinkage factor of a 10 cm square sample of the film in a maximal shrinkage direction of the film is not less than 20% under the condition that the sample is immersed in hot water of 85° C. for 10 seconds, and then in water of 25° C. for 10 seconds. The number of test pieces of the film having a rupture ratio of not more than 5% is not more than 10% to the total number of the test pieces under the condition that a tensile test of drawing the film in a direction orthogonal to the maximal shrinkage direction of the film is conducted with a distance between corresponding chucks of 100 mm, each test piece having 15 mm in width, a temperature of 23° C., and a drawing rate of 200 mm/min.

Abstract: A film roll of a heat-shrinkable polyester film characterized in that the heat-shrinkable polyester film meets the following requirements (1) and (2). (1) When samples are cut off therefrom at an almost equal interval along the longitudinal direction, and immersed in hot water at 85° C. for 10 seconds, subsequently in water at 25° C. and withdrawn, heat-shrinkage percentages in the maximum shrinkage direction of all the samples are 20% or more. (2) When raw polymers used for production of the film above comprises of a major constitutional unit and one or more sub constitutional units different therefrom; and the content of the primary sub constitutional unit is determined, the content of the primary sub constitutional unit in each sample is more than 7 mole % in 100% of all constitutional units, and when an average of the contents of the primary sub constitutional unit is calculated, the contents thereof of all the samples fall within a range of ±2 mole % relative to the average.

Abstract: The heat-shrinkable polyester film rolls according to the present invention is characterized in that the film rolls have (1) a heat shrinkage percentage at 85° C. in the maximum shrinkage direction of 20% or more; (2) a melt resistivity at a temperature of 275° C. of 0.70×108 ?·cm or less; (3) when samples thereof are cut off at an interval of about 100 m and the fluctuation in thickness in the maximum shrinkage direction is measured, a thickness distribution width represented by the following formula of respective samples of 7% or less. Thickness distribution width=(Maximum thickness?Minimum thickness)/Average thickness×100 Container-wrapping films excellent in processability and printability can be produced from the heat-shrinkable polyester film rolls in high yield.

Abstract: A semiconductor device such as a flash memory includes a semiconductor substrate having a surface, and a plurality of trenches formed in the substrate so as to be open at the surface of the substrate, the trenches having opening widths different from each other. The trench with a smaller opening width is formed so as to have a first depth and the trench with a larger opening width has a bottom including opposite ends each of which has a second depth deeper than the first depth and a central portion shallower than the second depth.

Abstract: A film roll of a heat-shrinkable polyester film characterized in that the heat-shrinkable polyester film meets the following requirements (1) and (2). (1) When samples are cut off therefrom at an almost equal interval along the longitudinal direction, and immersed in hot water at 85° C. for 10 seconds, subsequently in water at 25° C. and withdrawn, heat-shrinkage percentages in the maximum shrinkage direction of all the samples are 20% or more. (2) When raw polymers used for production of the film above comprises of a major constitutional unit and one or more sub constitutional units different therefrom; and the content of the primary sub constitutional unit is determined, the content of the primary sub constitutional unit in each sample is more than 7 mole % in 100% of all constitutional units, and when an average of the contents of the primary sub constitutional unit is calculated, the contents thereof of all the samples fall within a range of ±2 mole % relative to the average.

Abstract: A semiconductor device includes a semiconductor substrate having an upper face, a plurality of trenches formed in the semiconductor substrate, an element isolating film embedded in each trench and having a top located higher than the upper face of the semiconductor substrate, a gate insulating film formed on the semiconductor substrate so as to be located between the element isolating films adjacent to each other, and a gate electrode formed on the gate insulating film and having a top located higher than the top of the element isolating film. The element isolating film has a recess formed on the top thereof so that the recess extends toward the semiconductor substrate.

Abstract: A semiconductor device includes a semiconductor substrate and an interlayer wiring structure further including a lower wiring layer formed on the semiconductor substrate, an interlayer wiring layer including an interlayer insulating film formed on the lower wiring layer and a plurality of contact plugs each formed so as to extend through the interlayer insulating film to be brought into electrical contact with the lower wiring layer, an upper wiring layer patterned so as to be in electrical contact with upper faces of the contact plugs, and a recessed portion formed by recessing the interlayer insulating film and the contact plugs exposed in the interlayer wiring layer with respect to at least a portion with a short distance between wirings so as to correspond to a shape of the upper wiring layer.

Abstract: A polyester film made from two kinds of polyester resins and having a specific DSC (and a specific glass transition point) is provided, (i) which is superior in mechanical property, capable of thermocompression bonding with a metal sheet, despite a high degree of crystallization of the film, reduces quality change of plastic film laminated on the metal sheet even if faced with variation of conditions of thermocompression bonding with the metal sheet, and which is capable of thermocompression bonding even at a relatively low temperature, (ii) which is superior in formability, (iii) which is superior in flavoring property and impact resistance, and which obliterates occurrence of whitening or delamination of the film, or microcracks on the film, even if the film in the metal laminated sheet obtained by thermocompression bonding of the film on the metal sheet or on the surface of a metal can obtained by subjecting the metal laminated sheet to various form processings is crystallized, and (iv) which satisfies pro

Abstract: A film roll comprising a heat-shrinkable polystyrene based resin film wound into a roll, characterized in that, each of the samples taken out from the roll exhibits, in a heat shrinkage test under the condition of the immersion in a hot water at 85° C. for 10 sec, a heat shrinkage rate in the main shrinking direction of within ±5% relative to an average rate of the total samples; a heat-shrinkable polystyrene based resin film taken from the roll; a heat-shrinkable label comprising the film; a method for producing the heat-shrinkable polystyrene based resin film roll which comprises using raw material chips having a specific form, or using a hopper having a specific shape for feeding raw material chips to an extruder, or limiting the variation of the surface temperature of a film in a specific production step to a specific range.

Abstract: An electrical connection box has a configuration in which fuse sections of bus bars integrated with fusible links housed in parallel alignment can be visually inspected with ease. The bus bars are positioned with space therebetween so that a bus bar closest to a peripheral wall of the case is placed at a lowest position and that the inner bus bars are placed at higher positions. A cut-out section is provided on an upper edge of a peripheral wall of the case so that the position of the cut-out section opposes the fuse sections of the bus bar at the lowest position.