Abstract: A control system of an engine is provided. The control system includes an exhaust emission control catalyst provided in an exhaust passage, a deceleration fuel cutoff module for performing a deceleration fuel cutoff when a deceleration fuel cutoff condition is satisfied in an engine decelerating state, a purging unit for performing a purge to supply a purge gas to an intake passage during the deceleration fuel cutoff, an evaporated fuel supply amount estimating module for estimating a supply amount of evaporated fuel to the intake passage when the purge is performed, and a catalyst temperature estimating module for estimating a temperature of the exhaust emission control catalyst when the purge is performed, based on the supply amount of the evaporated fuel. The purging unit controls a supply flow rate of the purge gas to the intake passage when the purge is performed, based on the exhaust emission control catalyst temperature.

Abstract: A control system of an engine in which a purge gas containing evaporated fuel desorbed from a canister is supplied to an intake passage of the engine is provided. The control system includes a deceleration fuel cutoff module for performing a deceleration fuel cutoff to stop a fuel supply from an injector to the engine when a predetermined deceleration fuel cutoff condition is satisfied in a decelerating state of the engine, a purge unit for purging by supplying the purge gas to the intake passage during the deceleration fuel cutoff, an O2 sensor provided in an exhaust passage of the engine, an abnormality determining module for determining an abnormality of the O2 sensor based on a change of an output value of the O2 sensor that is caused by the deceleration fuel cutoff, and a purge restricting module for restricting the purge during the abnormality determination.

Abstract: The wire tool with abrasive grains comprises a wire, and abrasive grains fixed by electrification hole plating in electrification holes, which are provided at multiple spots on the outer circumferential surface of the wire. The cylindrical electrification holes are disposed on a helical curve separated from each other by a uniform gap and the gap is larger than ? of the radius (R) of the electrification holes.

Abstract: The present invention provides a hot coil for line pipe use which can reduce deviation in ordinary temperature strength and improve low temperature toughness despite the numerous restrictions in production conditions due to the coiling step and provides a method of production of the same, specifically makes the steel plate stop for a predetermined time between rolling passes in the recrystallization temperature range and performs cooling by two stages after hot rolling so as to thereby make the steel structure at the center part of plate thickness and effective crystal grain size of 3 to 10 ?m, make the total of the area ratios of bainite and acicular ferrite 60 to 99%, and make the absolute value of A-B 0 to 30% when the totals of the area ratios of bainite and acicular ferrite at any two portions are designated as respectively A and B.

Abstract: The present invention provides a hot coil for line pipe use which can reduce deviation in ordinary temperature strength and improve low temperature toughness despite the numerous restrictions in production conditions due to the coiling step and provides a method of production of the same, specifically makes the steel plate stop for a predetermined time between rolling passes in the recrystallization temperature range and performs cooling by two stages after hot rolling so as to thereby make the steel structure at the center part of plate thickness and effective crystal grain size of 3 to 10 ?m, make the total of the area ratios of bainite and acicular ferrite 60 to 99%, and make the absolute value of A-B 0 to 30% when the totals of the area ratios of bainite and acicular ferrite at any two portions are designated as respectively A and B.

Abstract: A guiding device, includes: a first position detecting unit which detects a present position; an obtaining unit which obtains a present position detected by a second position detecting unit, from a sensor unit having the second position detecting unit which detects the present position; a detecting unit which detects a communication condition with the sensor unit; a determining unit which determines whether to preferentially use the present position detected by the first position detecting unit or the present position detected by the second position detecting unit, based on the communication condition; and a controlling unit which displays a guidance based on the present position determined by the determining unit, on a display unit. Therefore, since the present position can be calculated with accuracy, it becomes possible to appropriately perform the guide based on the present position.

Abstract: An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.

Abstract: A planar inductor comprises a metal element (11-14) on a substrate (300, 310), said metal element being provided with at least one groove (20) extending along and into said element from at least one surface (2) of said element. Said groove or grooves (20) extend into the element in a direction substantially perpendicular to the surface of the substrate (300, 310), giving rise to a higher Q value and a lower serial resistance are also achieved. The inductor may comprise grooved (11, 13, 14) and non-grooved (12) layers. The invention also relates to a method of manufacturing the inductor.

Abstract: Flap resonator, comprising a first electrode and a second electrode, the second electrode comprising a support part separated from an adjacent end of the first electrode by a dielectric part, and a beam part extending from said support part and over at least a part of a surface of the first electrode. The support part has an effective width that is smaller than the width of the beam part.

Abstract: The resonator comprises two capacitively coupled electrodes. One of the electrodes is made of a p-type doped semiconductor material, whereas the other electrode is made of an n-type doped semiconductor material. The invention also comprises a method of using this specific selection of the doping for enhancing the output signal current from a resonator.

Abstract: An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.

Abstract: The invention relates to an electronic circuit comprising a first terminal (100) and a second terminal (200, 300) and at least three transistors (1) arranged in parallel, each transistor having a control terminal (2) connected to said first terminal (100) for receiving a control signal, and an output terminal (3, 4) connected to said second terminal (200, 300) for providing an output signal, said output signal depending on the control signal. The transistors (1) are arranged symmetrically with regard to a point of symmetry, in a manner such that the contribution to the heating of a transistor by heat received from the other transistors, is substantially the same for all of said transistors. The invention also relates to a method for manufacturing an electronic circuit.

Abstract: A planar inductor comprises a metal element (11-14) on a substrate (300, 310), said metal element being provided with at least one groove (20) extending along and into said element from at least one surface (2) of said element. Said groove or grooves (20) extend into the element in a direction substantially perpendicular to the surface of the substrate (300, 310), giving rise to a higher Q value and a lower serial resistance are also achieved. The inductor may comprise grooved (11, 13, 14) and non-grooved (12) layers. The invention also relates to a method of manufacturing the inductor.

Abstract: A multi-column type electron beam exposure apparatus includes: plural column cells disposed over a wafer, each including an electron gun, deflector for deflecting an electron beam emitted by the electron gun, and exposure data receiving unit for receiving exposure data; and correction computing unit for calculating the exposure data for use in the column cells. The correction computing unit includes exposure data controlling unit and exposure data transmitting unit for each of the column cells. The exposure data transmitting unit encodes the exposure data corrected by the exposure data controlling unit to convert the data into serial data, converts the serial data into a light signal, and transmits the light signal. The exposure data receiving unit converts the light signal into an electric signal, and decodes the encoded exposure data to convert the data into parallel data.

Abstract: A semiconductor device with a plurality of passive components (7,7a,8,8a) comprising a bottom substrate (1), a buried oxide layer (2) on a portion of the top surface of the bottom substrate (1), an dielectric intermediate insulating layer (3) on a portion of the buried oxide layer (2), a dielectric top insulating layer (4), and at least one implanted passive component (7a,8a) of a semiconductor material implanted under the buried oxide layer (2) within the top surface portion of the bottom substrate (1), the implanted semiconductor material having a material polarity being opposite to the bottom substrate polarity. When the implanted passive component (7a) is an AC decoupling capacitor (7a), the bottom and side portions of the implanted semiconductor material are surrounded by a depletion layer (7b) of a semiconductor material implanted between said bottom substrate (1) and said implanted semiconductor material.

Abstract: An object is to provide a video recording/playing apparatus for facilitating recording/playing of motion pictures.

Abstract: The resonator comprises two capacitively coupled electrodes. One of the electrodes is made of a p-type doped semiconductor material, whereas the other electrode is made of an n-type doped semiconductor material. The invention also comprises a method of using this specific selection of the doping for enhancing the output signal current from a resonator.

Abstract: Flap resonator, comprising a first electrode and a second electrode, the second electrode comprising a support part separated from an adjacent end of the first electrode by a dielectric part, and a beam part extending from said support part and over at least a part of a surface of the first electrode. The support part has an effective width that is smaller than the width of the beam part.

Abstract: A semiconductor device with a plurality of passive components (7,7a,8,8a) comprising a bottom substrate (1), a buried oxide layer (2) on a portion of the top surface of the bottom substrate (1), an dielectric intermediate insulating layer (3) on a portion of the buried oxide layer (2), a dielectric top insulating layer (4), and at least one implanted passive component (7a,8a) of a semiconductor material implanted under the buried oxide layer (2) within the top surface portion of the bottom substrate (1), the implanted semiconductor material having a material polarity being opposite to the bottom substrate polarity. When the implanted passive component (7a) is an AC decoupling capacitor (7a), the bottom and side portions of the implanted semiconductor material are surrounded by a depletion layer (7b) of a semiconductor material implanted between said bottom substrate (1) and said implanted semiconductor material.