Abstract: A device includes first and second regions including first and second amplifiers, respectively and a memory cell array region formed between the first and second regions and includes first and second conductive layers each extending in a first direction, and a plurality of first pillar elements arranged in line in the first direction on the first conductive layer, each of the first pillar elements being coupled to the first conductive layer at one end thereof, and the first pillar elements comprising a plurality of first elements and a second element, and a plurality of second pillar elements arranged in line in the first direction on the second conductive layer, each of the second pillar elements being coupled to the second conductive layer at one end thereof, and the second pillar elements comprising a plurality of third elements and a fourth element.

Abstract: A method for carrying out read and write operations in a synchronous memory device having a shared I/O, includes receiving a read command directed to a first internal memory bank during a first timeslot, activating the first internal memory bank to access read data at a read address requested by the read command, receiving a write command directed to a second internal memory bank during a second timeslot later than the first timeslot, determining whether a data collision between the read data for output to the shared I/O with normal read latency and write data to be received on the shared I/O with normal write latency would occur, and receiving the write data on the shared I/O with the normal write latency during a third timeslot later than the second timeslot.

Abstract: A semiconductor device is provided with normal memory cells constituted so as to store user data, reference memory cells constituted so as to generate a reference signal for reading out the normal memory cells, and a control circuit that carries out a defect detecting operation for detecting whether or not the reference memory cell and data stored in the reference memory cell are coincident with expected values on the stored data read out from the reference memory cells. Moreover, it is also provided with a control circuit for executing a defect correcting operation for correcting data to be stored in the reference memory cells that are detected as defective. Furthermore, it is also provided with a control circuit that is configured so as to cut off the reference memory cell detected as defective from the sense amplifier.

Abstract: A semiconductor device is disclosed which comprises first and second local bit lines coupled to a plurality of memory cells arranged in first and second areas, respectively, a differential type local sense amplifier amplifying a voltage difference between the first and second local bit lines, a global bit line arranged in an extending direction of the first and second local bit lines, and first and second switches controlling electrical connections between the first and second local bit lines and the global bit line, respectively.

Abstract: Disclosed herein is a device that includes: a memory cell array including a plurality of memory cells, the memory cell array operates on a first internal voltage; a peripheral circuit accessing selected one or ones of the memory cells, the peripheral circuit operates on a second internal voltage; a first internal voltage generation circuit that supplies the first internal voltage to the memory cell array; and a second internal voltage generation circuit that supplies the second internal voltage to the peripheral circuit. The second internal voltage generation circuit sets the second internal voltage to a first voltage value in a first mode, and to a second voltage value that is different from the first voltage value in a second mode. The first internal voltage generation circuit sets the first internal voltage to a third voltage value in both the first and second modes.

Abstract: Disclosed herein is a semiconductor device comprising complementary pair of bit lines, memory cells connected to the bit lines, dummy cells having the same structure as the memory cells, a differential sense amplifier, an equalizing circuit equalizing potentials of the bit lines, and a control circuit. The memory cells are disconnected from the bit lines and the dummy cells are connected to the bit lines, and subsequently the bit lines are equalized by the equalizing circuit. When accessing a selected memory cell, the equalizing circuit is inactivated, a corresponding dummy cell is disconnected from the bit line, and subsequently the selected memory cell is connected to the bit line. Thereafter, the sense amplifier is activated so that potentials of the bit lines are amplified respectively.

Abstract: A semiconductor device comprises memory cell array including first memory cell connected between first terminal and second terminal, written to first resistive state by applying voltage in first direction to first memory cell, and written to second resistive state by applying voltage in second direction different from first direction to first memory cell, first line and second line connected to first terminal and second terminal, respectively, third terminal receiving control signal, and first writing circuit comprising first input terminal connected to third terminal, second input terminal connected to one end of second line, and first output terminal connected to one end of first line, and first writing circuit being configured to control first line based on control signal of first input terminal and signal of second input terminal transmitted via second line.

Abstract: A semiconductor memory device comprises: plurality of global bit lines; plurality of sense amplifier circuits each connected to corresponding one of the plurality of global bit lines; plurality of column selection lines each of which is connected to or disconnected from corresponding one of the plurality of sense amplifier circuits according to column address information; and plurality of local bit lines including first local bit line and second local bit line. The first local bit line is connected to or disconnected from corresponding one of the plurality of global bit lines according to first row address information different from column address information. The second local bit line replaces first local bit line when defect is present in first local bit line and is connected to or disconnected from corresponding global bit line according to second row address information different from column address information.

Abstract: A semiconductor device having a memory cell including a capacitor and a select transistor with a floating body structure, a bit line connected to the select transistor, a bit line control circuit, and a sense amplifier amplifying a signal read out from the memory cell. The bit line control circuit sets the bit line to a first potential during a non-access period of the memory cell, and thereafter sets the bit line to a second potential during an access period of the memory cell, so that the data retention time can be prolonged by reducing leak current at a data storage node of the memory cell so that an average consumption current for the data retention can be reduced.

Abstract: A semiconductor includes a plurality of memory cell arrays each of which includes a plurality of memory cells. Bitlines extend in one direction in the memory cell arrays to transfer data stored in the memory cells. Wordlines extend perpendicular to the bitlines in the memory cell arrays to select at least one of the memory cells. Local data lines extend parallel to the wordlines outside of the memory cell arrays and convey signals from bitlines. Global data lines convey signals from the local data lines. The global data lines include a part extending parallel to the wordlines and the part is disposed over another one of the memory cell arrays other than a selected memory cell array.

Abstract: There is provided a semiconductor device which includes a plurality of first through-substrate vias that are used to supply power from a first power supply and that penetrate through a substrate structure, and a plurality of second through-substrate vias that are used to supply power from a second power supply different from the first power supply and that penetrate through a substrate structure. The semiconductor device also includes a through-substrate via string composed by the first and second through-substrate vias, in which the first through-substrate vias are located adjacent to one another and the second through-substrate vias are also located adjacent to one another. The through-substrate via string is disposed in the substrate structure for extending in a first direction.

Abstract: A single-ended sense amplifier circuit of the invention comprises first and second MOS transistors and first and second precharge circuits. The first MOS transistor drives the bit line to a predetermined voltage and switches connection between the bit line and a sense node and the second MOS transistor whose gate is connected to the sense node amplifies the signal via the first MOS transistor. The first precharge circuit precharges the bit line to a first potential and the second precharge circuit precharges the sense node to a second potential. Before sensing operation, the bit line is driven to the predetermined voltage when the above gate voltage is controlled to decrease. The predetermined voltage is appropriately set so that a required voltage difference at the sense node between high and low levels can be obtained near a changing point between charge transfer/distributing modes.

Abstract: A single-ended sense amplifier circuit of the invention comprises first and second MOS transistors and first and second precharge circuits. The first MOS transistor drives the bit line to a predetermined voltage and switches connection between the bit line and a sense node and the second MOS transistor whose gate is connected to the sense node amplifies the signal via the first MOS transistor. The first precharge circuit precharges the bit line to a first potential and the second precharge circuit precharges the sense node to a second potential. Before sensing operation, the bit line is driven to the predetermined voltage when the above gate voltage is controlled to decrease. The predetermined voltage is appropriately set so that a required voltage difference at the sense node between high and low levels can be obtained near a changing point between charge transfer/distributing modes.

Abstract: A semiconductor device having a memory cell including a capacitor and a select transistor with a floating body structure, a bit line connected to the select transistor, a bit line control circuit, and a sense amplifier amplifying a signal read out from the memory cell. The bit line control circuit sets the bit line to a first potential during a non-access period of the memory cell, and thereafter sets the bit line to a second potential during an access period of the memory cell, so that the data retention time can be prolonged by reducing leak current at a data storage node of the memory cell so that an average consumption current for the data retention can be reduced.

Abstract: A semiconductor includes a memory cell array including a plurality of memory cells. A first amplifier produces, when activated, a first data signal related to data stored in a selected first one of the memory cells. A first transistor is between the output node of the first amplifier and a first data line and is turned ON in response to a first selection signal to convey the first data signal from the first amplifier onto the first data line. A second amplifier is coupled to the first data line and amplifies, when activated, the first data signal, and is further coupled to the first signal line and activated in response to a first activation signal that is transferred through a first signal line. A second transistor is coupled to the first signal line and is turned ON in response to the first selection signal to the first signal line.

Abstract: A device is provided with: memory cell array including plurality of first and second memory cells and one or more third memory cells; judging circuit that judges plurality of data values held by selected first and second memory cells of the first and second memory cells, by referring to reference potential corresponding to reference data held by a selected third memory cell; and error detection and correction circuit that detects whether or not there is error in the judged data values of the first and/or second memory cells, with judged data value of the first and second memory cells as error correcting code. When the error detection and correction circuit detects that there is error exceeding error correction capability in the judged data values, control is performed to write reference data to the selected third memory cell.

Abstract: A single-ended sense amplifier circuit of the invention comprises first and second MOS transistors and first and second precharge circuits. The first MOS transistor drives the bit line to a predetermined voltage and switches connection between the bit line and a sense node and the second MOS transistor whose gate is connected to the sense node amplifies the signal via the first MOS transistor. The first precharge circuit precharges the bit line to a first potential and the second precharge circuit precharges the sense node to a second potential. Before sensing operation, the bit line is driven to the predetermined voltage when the above gate voltage is controlled to decrease. The predetermined voltage is appropriately set so that a required voltage difference at the sense node between high and low levels can be obtained near a changing point between charge transfer/distributing modes.

Abstract: A method includes measuring a first pulse width of a resistance variable memory cell coupled between a first terminal and a second terminal, the first pulse width including a period from starting a first data writing of the resistance variable memory cell by applying a voltage between the first and second terminals to ending the first data writing of the resistance variable memory cell, and measuring a second pulse width of the resistance variable memory cell coupled between the first and the second terminal. The method includes setting longer one of the first and second pulse widths in a first storage area as a pulse width to be used in program.

Abstract: A semiconductor device comprises transmission lines, inverting circuits, first, second and third switches, global sense amplifiers, and a control circuit. The first switch switches between the transmission line and the input of the inverting circuit, the second switch switches between the transmission line and the output of the transmission line, and the third switch switches between the adjacent transmission lines. The control circuit turns off the first and second switches so that the transmission lines are brought into a floating state in a state where signals of the transmission lines are held in the inverting circuits by the global sense amplifiers. After charge sharing of the transmission lines occurs by turning on the third switches within a predetermined period, the control circuit turns off the second switches so that the transmission lines are inverted and driven via the inverting circuits and the second switches.

Abstract: A semiconductor device comprises a sense amplifier circuit amplifying a signal transmitted through the bit line, first/second data lines transmitting the signal amplified by the sense amplifier circuit, a read amplifier circuit driven by a first voltage and amplifying the signal; first/second switch circuits controlling connection between the above components, first/second voltage setting circuits setting the second/third data lines to a second voltage lower than the first voltage. A predetermined voltage obtained by adding the second voltage to a threshold voltage of a transistor in the second/third switch circuit is applied to the gate terminal thereof, and ends of the data lines are connected to the source and drain terminals thereof.