Patents by Inventor Kazuhiro Kobayashi
Kazuhiro Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9089041Abstract: A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad.Type: GrantFiled: January 16, 2013Date of Patent: July 21, 2015Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kotaro Kodani, Kentaro Kaneko, Kazuhiro Kobayashi
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Patent number: 9058740Abstract: A state determining device includes a current detecting unit, a state determining unit, and a notifying unit. The current detecting unit detects a current value of a drive current which flows into a drive motor that rotary-drives a driven unit with a drive force according to the drive current. Based on the drive current value detected by the current detecting unit, the state determining unit determines a state of a driving system including the driven unit. The notifying unit notifies a user of a determination result of the state determining unit.Type: GrantFiled: May 16, 2013Date of Patent: June 16, 2015Assignee: RICOH COMPANY, LIMITEDInventors: Kazuhiro Kobayashi, Takashi Kuwayama, Yuki Sato, Tetsuji Nishikawa, Nobuhiro Shima, Jo Ebara
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Publication number: 20150147099Abstract: An image forming apparatus includes an image bearing member, a plurality of developing devices, a transfer device, a moving device, a color drift detector, a test pattern forming device, and a color drift correction device. The test pattern forming device forms a test pattern on the image bearing member. The color drift correction device corrects the color drift in a separating state in which the image bearing member and the transfer device are separated from each other. The test pattern forming device forms the test pattern again in an area on the image bearing member contacting the transfer device but not pressed by the transfer device after the color drift correction device corrects the color drift in the separating state, and the color drift correction device corrects the color drift in the contact state in which the image bearing member and the transfer device are in contact with each other.Type: ApplicationFiled: November 14, 2014Publication date: May 28, 2015Inventors: Akihiko TOSAKA, Toshiyuki Uchida, Kazuhiro Kobayashi, Hiroaki Murakami
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Publication number: 20150136768Abstract: A fuel filler system for use in a vehicle is provided. The system includes a fuel filler tube, a locking bracket coupled to an inner surface of the fuel filler tube, and a closure device coupleable within the tube end and including an outer wall and a radially movable tab extending from the outer wall. The tab engages the locking bracket after rotation of the closure device from a first rotational position to a second rotational position to prevent rotation of the closure device relative to the locking bracket. The closure device further includes a web flexibly connecting the tab to the outer wall and a region of weakness defined in the web, such that upon forcible rotation of the closure device from the second rotational position to the first rotational position, the region of weakness facilitates separation of the web from the outer wall.Type: ApplicationFiled: December 5, 2014Publication date: May 21, 2015Applicants: TOYODA GOSEI CO., LTD., HONDA MOTOR CO., LTD.Inventors: Kazuhiro Kobayashi, Hidekazu Nobata, Masaru Tomimatsu, Hiroyuki Hagano
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Patent number: 9024207Abstract: A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer, a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.Type: GrantFiled: February 12, 2013Date of Patent: May 5, 2015Assignee: Shinko Electric Industries Co., Ltd.Inventors: Michiro Ogawa, Kazuhiro Kobayashi, Kentaro Kaneko
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Patent number: 9006103Abstract: A method of manufacturing a wiring substrate, includes, forming an etching stop layer and a first wiring layer on a supporting member, forming a first insulating layer on the first wiring layer, forming a via hole reaching the first wiring layer, and forming the wiring layers of an n-layer and the insulating layers of an n-layer, removing the supporting member and the etching stop layer, thereby forming a build-up intermediate body, forming a second insulating layer on the wiring layer of an n-th layer, and forming a third insulating layer on first wiring layer, forming a via hole reaching the wiring layer of the n-th layer, and forming a via hole reaching the first wiring layer, forming a roughened face to the third insulating layer, and forming a second wiring layer connected to the wiring layer, and forming a third wiring layer connected to the first wiring layer.Type: GrantFiled: September 16, 2013Date of Patent: April 14, 2015Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazuhiro Kobayashi, Kotaro Kodani, Junichi Nakamura, Kentaro Kaneko
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Publication number: 20150083721Abstract: Systems and methods for assembling a fuel filler system for use in a vehicle are provided. A locking bracket is coupled within an end of a fuel filler tube. At least one passage is defined in the locking bracket for facilitating insertion of a closure device into the fuel filler tube end. At least one anti-removal structure on the closure device passes through the at least one passage during insertion of the closure device. The at least one anti-removal structure precludes removal of the closure device after insertion of the closure device, and rotation of the closure device from a first rotational position relative to the locking bracket to a second rotational position. First and second anti-rotation structures extending from the closure device engage first and second ends of the locking bracket to prevent further rotation of the closure device.Type: ApplicationFiled: September 20, 2013Publication date: March 26, 2015Applicant: HONDA MOTOR CO., LTD.Inventors: Kazuhiro Kobayashi, Hidekazu Nobata, Masaru Tomimatsu
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Publication number: 20150083720Abstract: Systems and methods for assembling a fuel filler system for use in a vehicle are provided. The fuel filler system includes a closure device assembly and a fuel filler tube. A circumferential rim extends radially outwardly from a first end of the fuel filler tube. The rim has a non-planar cross-sectional shape. The fuel filler system also includes at least one catch member that extends from an inner surface of the closure device assembly. A seal member encircles a portion of the closure device assembly, and is axially spaced apart from the at least one catch member. After the closure device assembly is coupled to the fuel filler tube, the circumferential rim is axially captured between the at least one catch member and the seal member.Type: ApplicationFiled: September 20, 2013Publication date: March 26, 2015Applicant: HONDA MOTOR CO., LTD.Inventors: Kazuhiro Kobayashi, Hidekazu Nobata, Masaru Tomimatsu
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Publication number: 20150029261Abstract: A liquid ejecting apparatus includes a liquid ejecting head that includes a nozzle formation surface on which a plurality of nozzles which eject a liquid are formed to be lined up in one direction to form nozzle columns, a belt-shaped member that is brought into contact with the nozzle formation surface, and a belt-shaped member contact portion that brings the belt-shaped member into contact with the nozzle formation surface in both a first contact state where the belt-shaped member is brought into contact with a partial area of the nozzle formation surface and a second contact state where the belt-shaped member is in contact with an area corresponding to the nozzle column in a direction along the nozzle column on the nozzle formation surface.Type: ApplicationFiled: October 13, 2014Publication date: January 29, 2015Inventor: Kazuhiro KOBAYASHI
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Publication number: 20150014027Abstract: A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface.Type: ApplicationFiled: July 11, 2014Publication date: January 15, 2015Inventors: Kentaro Kaneko, Kazuhiro Kobayashi, Toshimitsu Omiya, Kotaro Kodani, Shunichiro Matsumoto, Ruofan Tang
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Publication number: 20150014020Abstract: A wiring substrate includes an insulating layer, a first pad, and a solder resist layer. The first pad is embedded in the insulating layer. The solder resist layer is provided on an upper surface of the insulating layer. The solder resist layer is formed with an opening portion through which the recess portion is exposed. An adjacent portion of the solder resist layer adjacent to a peripheral portion of the opening portion covers a peripheral portion of the upper surface of the first pad and protrudes from the peripheral portion of the upper surface of the first pad toward the center portion of the first pad so as to cover above the recess portion. Surfaces of the first pad being in contact with the insulating layer are smaller in roughness than the upper surface of the insulating layer and the peripheral portion of the upper surface of the first pad.Type: ApplicationFiled: July 11, 2014Publication date: January 15, 2015Inventors: Kentaro Kaneko, Katsuya Fukase, Kazuhiro Kobayashi
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Patent number: 8903278Abstract: A drive unit for rotating a first rotary member and a second rotary member disposed around the first rotary member includes a drive source, an output gear driven by the drive source, a first gear greater in diameter than the output gear and configured to engage the output gear, a first joint member projecting from the first gear coaxially and coupled to the first rotary member, a second gear smaller in diameter than the first gear and connected between the first gear and the first joint member, a driven gear smaller in diameter than the first gear and disposed within an area of the first gear in a radial direction thereof to engage the second gear to be driven thereby, and a second joint member projecting from the driven gear coaxially and connected to the second rotary member.Type: GrantFiled: October 18, 2012Date of Patent: December 2, 2014Assignee: Ricoh Company, Ltd.Inventors: Hiroaki Murakami, Toshiyuki Uchida, Kazuhiro Kobayashi, Akihiko Tosaka
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Patent number: 8888235Abstract: A liquid ejecting apparatus includes a liquid ejecting head that includes a nozzle formation surface on which a plurality of nozzles which eject a liquid are formed to be lined up in one direction to form nozzle columns, a belt-shaped member that is brought into contact with the nozzle formation surface, and a belt-shaped member contact portion that brings the belt-shaped member into contact with the nozzle formation surface in both a first contact state where the belt-shaped member is brought into contact with a partial area of the nozzle formation surface and a second contact state where the belt-shaped member is in contact with an area corresponding to the nozzle column in a direction along the nozzle column on the nozzle formation surface.Type: GrantFiled: October 29, 2013Date of Patent: November 18, 2014Assignee: Seiko Epson CorporationInventor: Kazuhiro Kobayashi
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Patent number: 8810040Abstract: A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer.Type: GrantFiled: November 20, 2012Date of Patent: August 19, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kentaro Kaneko, Kazuhiro Kobayashi
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Patent number: 8794116Abstract: A perforating apparatus having an orientation correction device that corrects skewing and aligns the front edge by striking the front edge of the paper, a perforation device having a punch to conduct perforation processing on the paper; and a lateral registration adjustment device that can adjust, in a direction at a right angle to the direction of movement of the aforementioned paper, the position of the perforation device punch in relation to the paper with orientation corrected using an orientation constraint device prior to perforating by the perforation device. The perforating apparatus may also include a structure in which said perforation device can be inserted into and detached from a non-moving support unit having the drive source of a lateral registration adjustment device, and when mounted, the type of perforation device can be recognized.Type: GrantFiled: August 28, 2006Date of Patent: August 5, 2014Assignee: Ricoh Company, Ltd.Inventors: Masahiro Tamura, Nobuyoshi Suzuki, Shuuya Nagasako, Tomoichi Nomura, Hiroshi Maeda, Kazuhiro Kobayashi, Shohichi Satoh, Akira Kunieda
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Patent number: 8797757Abstract: A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.Type: GrantFiled: January 6, 2012Date of Patent: August 5, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kentaro Kaneko, Toshiaki Aoki, Kazuhiro Kobayashi, Kotaro Kodani, Junichi Nakamura
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Patent number: 8760883Abstract: A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings.Type: GrantFiled: January 6, 2012Date of Patent: June 24, 2014Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kentaro Kaneko, Toshiaki Aoki, Kazuhiro Kobayashi, Kotaro Kodani, Junichi Nakamura
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Publication number: 20140125734Abstract: A liquid ejecting apparatus includes a liquid ejecting head that includes a nozzle formation surface on which a plurality of nozzles which eject a liquid are formed to be lined up in one direction to form nozzle columns, a belt-shaped member that is brought into contact with the nozzle formation surface, and a belt-shaped member contact portion that brings the belt-shaped member into contact with the nozzle formation surface in both a first contact state where the belt-shaped member is brought into contact with a partial area of the nozzle formation surface and a second contact state where the belt-shaped member is in contact with an area corresponding to the nozzle column in a direction along the nozzle column on the nozzle formation surface.Type: ApplicationFiled: October 29, 2013Publication date: May 8, 2014Applicant: SEIKO EPSON CORPORATIONInventor: Kazuhiro Kobayashi
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Publication number: 20140097009Abstract: A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil that is thinner than the first wiring layer. A first via in the first insulating layer connects the first and second wiring layers. The first via is arranged to fill a first through hole and a first recess. The first through hole extends through the first insulating layer and has a first open end with a first opening diameter and a second open end with a smaller second opening diameter. The first recess is in communication with the first through hole. The first recess has a larger diameter than the second opening diameter. The first metal foil includes a first opening communicating with the first through hole and having a larger opening diameter larger than the first opening diameter.Type: ApplicationFiled: September 26, 2013Publication date: April 10, 2014Inventors: Kentaro KANEKO, Kazuhiro KOBAYASHI
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Patent number: 8688006Abstract: A drive transmission device includes drive transmission members including a detection target gear, a detection device detecting the rotational position of the target gear and including a position detection member and a detection unit, and a conductive protection member protecting the detection unit. The detection unit and the protection member are assembled to the same member to be installed to an external apparatus. If there is a dimensional error in the protection member causing a portion of the protection member closest to the target gear to shift in position relative to the detection unit beyond a predetermined range, the protection member comes into contact with the detection unit in the assembling process, and is corrected in shape by the detection unit, with the shift in position relative to the detection unit of the portion of the protection member closest to the target gear kept within the predetermined range.Type: GrantFiled: July 8, 2011Date of Patent: April 1, 2014Assignee: Ricoh Company, Ltd.Inventors: Kazuhiro Kobayashi, Toshiyuki Uchida, Narumi Sugita