Abstract: A liquid ejecting apparatus includes a liquid ejecting head that includes a nozzle formation surface on which a plurality of nozzles which eject a liquid are formed to be lined up in one direction to form nozzle columns, a belt-shaped member that is brought into contact with the nozzle formation surface, and a belt-shaped member contact portion that brings the belt-shaped member into contact with the nozzle formation surface in both a first contact state where the belt-shaped member is brought into contact with a partial area of the nozzle formation surface and a second contact state where the belt-shaped member is in contact with an area corresponding to the nozzle column in a direction along the nozzle column on the nozzle formation surface.

Abstract: An image forming apparatus includes a plurality of latent image bearers, a latent image writer, a plurality of developing units, a primary transfer unit, a secondary transfer unit, an adjuster, a pattern image formation controller, a color deviation detector, a color deviation correction controller, and an image-formation-mode setting unit. The latent image writer writes latent images to the latent image bearers. The plurality of developing units develops the latent images of the latent image bearers and form toner images of different colors. The primary transfer unit transfers the toner images on the latent image bearers to an intermediate transferer. The secondary transfer unit transfers the toner images from the intermediate transferer to a sheet. The adjuster causes the intermediate transferer and the secondary transfer unit to be in a contact state or a separated state.

Abstract: A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, and a second wiring layer formed on a second surface of the core. The first wiring layer includes a first opening, and the second wiring layer includes a second opening. The core includes a plurality of electronic component accommodating bores that extend through the core at portions exposed from the first and second openings. An electronic component is arranged in each electronic component accommodating bore. The electronic component accommodating bores are filled with an insulating layer. The core includes a partition located between adjacent electronic component accommodating bores. The partition is formed by part of the core.

Abstract: A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.

Abstract: A fuel filler assembly for a vehicle includes a main flap unit connected to a fuel filler pipe adjacent a filling end thereof and a main flap pivotally disposed on the main flap unit for selectively closing access to the filling end of the fuel filler pipe. The fuel filler assembly further includes a shutter unit connected to the fuel filler pipe adjacent the filling end thereof and engaging the main flap unit, and a shutter pivotally disposed on the shutter unit for selectively closing access to the filling end of the fuel filler pipe. Cooperative engagement (e.g., an interference fit) between the main flap unit and the shutter unit seals the main flap unit and the shutter unit together and prevents fuel from leaking therebetween.

Abstract: A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head that includes a nozzle formation surface on which a plurality of nozzles which eject a liquid are formed to be lined up in one direction to form nozzle columns, a belt-shaped member that is brought into contact with the nozzle formation surface, and a belt-shaped member contact portion that brings the belt-shaped member into contact with the nozzle formation surface in both a first contact state where the belt-shaped member is brought into contact with a partial area of the nozzle formation surface and a second contact state where the belt-shaped member is in contact with an area corresponding to the nozzle column in a direction along the nozzle column on the nozzle formation surface.

Abstract: A wiring substrate includes an insulating layer, a first pad, and a solder resist layer. The first pad is embedded in the insulating layer. The solder resist layer is provided on an upper surface of the insulating layer. The solder resist layer is formed with an opening portion through which the recess portion is exposed. An adjacent portion of the solder resist layer adjacent to a peripheral portion of the opening portion covers a peripheral portion of the upper surface of the first pad and protrudes from the peripheral portion of the upper surface of the first pad toward the center portion of the first pad so as to cover above the recess portion. Surfaces of the first pad being in contact with the insulating layer are smaller in roughness than the upper surface of the insulating layer and the peripheral portion of the upper surface of the first pad.

Abstract: A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface.

Abstract: Laser light is emitted to a sheet member wound on a forming drum in a range which includes the entire width of the sheet member and distance data on a distance to a reflecting surface is obtained, using a two-dimensional laser sensor which has a detection range along a drum circumferential direction, while moving either the two-dimensional laser sensor or the forming drum in a drum width direction. Further, the positions of width-directional opposite end sections of the sheet member are calculated on the basis of the obtained distance data.

Abstract: A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an opposite side of the first surface, an electrode pad exposed from the first surface, a layered body including first insulating layers and being formed on the second surface, the first insulating layers having a first insulating material as a main component, another layered body including second insulating layers and being formed on the layered body, the second insulating layers having a second insulating material as a main component, and another electrode pad exposed from a surface of the another layered body that is opposite to the layered body. The number of the first insulating layers is equal to that of the second insulating layers. The first insulating layers have a thermal expansion coefficient that is greater than that of the second insulating layers.

Abstract: An image forming apparatus includes a multi-color misalignment calculator that calculates an amount of multi-color misalignment of multiple color misalignment detection test pattern images based on position readings outputted by multiple test pattern image detectors, an image formation condition adjusting unit that adjusts an image formation condition of the image forming apparatus in accordance with the amount of multi-color misalignment of the multiple color misalignment detection test pattern images calculated by the multi-color misalignment calculator, and a process control unit that initiates a first multi-color misalignment correction control mode including a skew misalignment correction process and a second multi-color misalignment correction control mode excluding the skew misalignment correction process to correct multi-color misalignment of the multiple color misalignment detection test pattern images.

Abstract: A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.

Abstract: A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

Abstract: A body-cavity-insertion-type probe wherein an electronic circuit board is provided via a relay board on a back surface side of an oscillator unit. A backing member is joined to a center region of a back surface of the electronic circuit board. A wiring sheet is joined to a peripheral region of the back surface. A rear wing and a front wing of the wiring sheet surround a backing case, and a right wing and a left wing of an exhaust heat sheet protrude outward via two slits formed in a heat dissipation shell and are fixed on an outer surface of the heat dissipation shell. Heat generated by the electronic circuit board is transmitted to the heat dissipation shell via the exhaust heat sheet or the backing case, and heat is dissipated by the heat dissipation shell as a whole.

Abstract: A fuel filler assembly for a vehicle includes a main flap unit connected to a fuel filler pipe adjacent a filling end thereof and a main flap pivotally disposed on the main flap unit for selectively closing access to the filling end of the fuel filler pipe. The fuel filler assembly further includes a shutter unit connected to the fuel filler pipe adjacent the filling end thereof and engaging the main flap unit, and a shutter pivotally disposed on the shutter unit for selectively closing access to the filling end of the fuel filler pipe. Cooperative engagement (e.g., an interference fit) between the main flap unit and the shutter unit seals the main flap unit and the shutter unit together and prevents fuel from leaking therebetween.

Abstract: A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad.

Abstract: A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole.

Abstract: An image forming apparatus includes an image bearing member, a plurality of developing devices, a transfer device, a moving device, a color drift detector, a test pattern forming device, and a color drift correction device. The test pattern forming device forms a test pattern on the image bearing member. The color drift correction device corrects the color drift in a separating state in which the image bearing member and the transfer device are separated from each other. The test pattern forming device forms the test pattern again in an area on the image bearing member contacting the transfer device but not pressed by the transfer device after the color drift correction device corrects the color drift in the separating state, and the color drift correction device corrects the color drift in the contact state in which the image bearing member and the transfer device are in contact with each other.

Abstract: In a sheet creaser, a sheet set is pushed between a pair of folding rollers to fold the sheet set. Then, a re-pressing roller re-presses the sheet set, which has been folded by the folding rollers, by rolling along the crease. Pressure applied on the sheet set by the folding rollers is released when the re-pressing roller re-presses the sheet set.