Abstract: A wiring board includes an insulating layer including a first insulating film provided with a first surface and a second surface that is opposite to the first surface, and composed of only resin, and a second insulating film provided with a first surface and a second surface that is opposite to the first surface, including a reinforcing member and resin, in which the reinforcing member is impregnated with the resin, and stacked on the first surface of the first insulating film such that the second surface of the second insulating film contacts the first surface of the first insulating film and the second surface of the first insulating film is exposed outside; and a first wiring layer embedded in the first insulating film, a predetermined surface of the first wiring layer being exposed from the second surface of the first insulating film.

Abstract: A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.

Abstract: A body-cavity-insertion-type probe wherein an electronic circuit board is provided via a relay board on a back surface side of an oscillator unit. A backing member is joined to a center region of a back surface of the electronic circuit board. A wiring sheet is joined to a peripheral region of the back surface. A rear wing and a front wing of the wiring sheet surround a backing case, and a right wing and a left wing of an exhaust heat sheet protrude outward via two slits formed in a heat dissipation shell and are fixed on an outer surface of the heat dissipation shell. Heat generated by the electronic circuit board is transmitted to the heat dissipation shell via the exhaust heat sheet or the backing case, and heat is dissipated by the heat dissipation shell as a whole.

Abstract: A wiring substrate includes a first wiring layer, a first insulation layer, and a second wiring layer. The first insulation layer covers an upper surface and a side surface of the first wiring layer and exposes a lower surface of the first wiring layer. The second wiring layer is stacked on at least one of a lower surface of the first insulation layer and the lower surface of the first wiring layer.

Abstract: A bank repair method for repairing a defect portion of a bank in a process of manufacturing an organic electroluminescence (EL) display device including a substrate, banks formed over the substrate, and light-emitting layers formed in concave spaces defined by the banks. The bank repair method includes: examining whether or not a bank having a defect portion is present; and when a bank having a defect portion is present, repairing the bank by applying a repair material containing a gas adsorbent to the defect portion and curing the repair material; and after curing the repair material, baking the repair material by irradiating the repair material with infrared laser light.

Abstract: A device includes a sound source, an electric board, an exterior member, an electric board container box, and a sound absorber. The sound source generates a sound at a time of operation. The electric board has a circuit mounting an electrical component. The exterior member surrounds the sound source and the electric board. The electric board container box houses the electric board. The sound absorber is at least partially disposed inside a virtual space corresponding to a thickness of the electric board container box in an interior space of the device.

Abstract: An examination is performed of whether or not a bank having a defect portion is present. When a bank having a defect portion is present, the bank having the defect portion is repaired by forming a dam in each of adjacent concave spaces between which the bank having the defect portion is located. A dam formed in a concave space partitions the concave space into a first space in a vicinity of the defect portion and a second space outside the vicinity of the defect portion. The dam, at a portion thereof with lowest height, satisfies (h/H)+0.1W?1.5, 0.5?(h/H)?2.0, and 5?W?50, where a ratio of the height h of the dam to a height H of the banks is denoted as h/H, and a width of the dam is denoted as W ?m.

Abstract: A topping sheet forming method includes: a feeding and division step of feeding a textile original fabric, obtained by weaving longitudinally aligned tire cords into a cord fabric by use of weft yarns, and cutting off the weft yarns in predetermined widthwise positions to divide the textile original fabric into a plurality of narrow textile original fabrics; and a topping step of topping at least one surface of each of the narrow textile original fabrics with unvulcanized rubber.

Abstract: A topping sheet forming method includes: a division step of cylindrically winding a textile original fabric, obtained by weaving longitudinally aligned tire cords into a cord fabric by use of weft yarns, to form an original fabric roll and cutting off the weft yarns in predetermined widthwise positions by using a wire wound on the original fabric roll in a predetermined winding angle range to divide the textile original fabric into narrow textile original fabrics; and a topping step of topping at least one surface of each of the narrow textile original fabrics with unvulcanized rubber.

Abstract: A topping sheet forming method includes: feeding a textile original fabric, obtained by weaving longitudinally aligned tire cords into a cord fabric by use of weft yams; cutting off the weft yarns at a predetermined widthwise position to divide the textile original fabric into a plurality of narrow textile original fabrics; and topping at least one surface of the narrow textile original fabric with unvulcanized rubber.

Abstract: A topping sheet forming method includes: a feeding and division step of feeding a textile original fabric, obtained by weaving longitudinally aligned tire cords into a cord fabric by use of weft yams, and cutting off the weft yarns in predetermined widthwise positions to divide the textile original fabric into a plurality of narrow textile original fabrics; a calender step of topping, with unvulcanized rubber, at least one surface of one narrow textile original fabric out of the divided narrow textile original fabrics; and a wind-up step of winding up the other narrow textile original fabrics out of the divided narrow textile original fabrics.

Abstract: A method for repairing a bank during manufacture of an organic EL display device when a bank defect portion is produced due to collapsing of a bank, a foreign particle, or the like. The method includes: detecting a defect portion of a lengthwise bank formed over a ground substrate; and when a defect portion is detected, forming, in each of adjacent concave spaces between which the lengthwise bank having the defect portion is located, a dam partitioning the concave space into a first space in a vicinity of the bank defect portion and a second portion not in the vicinity of the bank defect portion. The shape of the dam is configured so that in ejecting organic functional layer ink in each concave space with a nozzle head, there is an ink dropping point in each of the first space and the second space.

Abstract: A heat shield for a motor vehicle includes an elongated planar shield body for separating an exhaust pipe and a fuel tank of the motor vehicle, the shield body extending longitudinally along a longitudinal axis between the exhaust pipe and the fuel tank, the shield body having a generally concave surface extending from the axis to first and second vertical walls along first and second edges of the shield body, a forward attachment portion for attaching the shield body to a frame of the motor vehicle longitudinally forward of the fuel tank, a rearward attachment portion for attaching the shield body to the frame of the motor vehicle longitudinally rearward of the fuel tank, and a water escape port in the first vertical wall.

Abstract: A heat shield for a motor vehicle includes an elongated planar shield body for separating an exhaust pipe and a fuel tank of the motor vehicle, the shield body extending longitudinally along a longitudinal axis between the exhaust pipe and the fuel tank, the shield body having a generally concave surface extending from the axis to first and second vertical walls along first and second edges of the shield body, a forward attachment portion for attaching the shield body to a frame of the motor vehicle longitudinally forward of the fuel tank, a rearward attachment portion for attaching the shield body to the frame of the motor vehicle longitudinally rearward of the fuel tank, and a water escape port in the first vertical wall.

Abstract: A device includes a sound source, an electric board, an exterior member, an electric board container box, and a sound absorber. The sound source generates a sound at a time of operation. The electric board has a circuit mounting an electrical component. The exterior member surrounds the sound source and the electric board. The electric board container box houses the electric board. The sound absorber is at least partially disposed inside a virtual space corresponding to a thickness of the electric board container box in an interior space of the device.

Abstract: A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.

Abstract: An examination is performed of whether or not a bank having a defect portion is present. When a bank having a defect portion is present, the bank having the defect portion is repaired by forming a dam in each of adjacent concave spaces between which the bank having the defect portion is located. A dam formed in a concave space partitioning the concave space into a first space in a vicinity of the defect portion and a second space outside the vicinity of the defect portion.

Abstract: A telescopic boom includes a first frame having a curved portion whose section is substantially U-shaped, and a second frame connected to the first frame so that a closed section is formed. In the telescopic boom, the U-shaped curved portion of the first frame includes a plurality of protrusion portions formed at intervals in a circumferential direction of the telescopic boom, each protrusion portion extending in a longitudinal direction of the telescopic boom and being formed to have an arc-shaped section and protrude to the outside of the first frame.

Abstract: A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and the recess portion is filled with the insulating layer.

Abstract: An examination is performed of whether or not a bank having a defect portion is present. When a bank having a defect portion is present, the bank having the defect portion is repaired by forming a dam in each of adjacent concave spaces between which the bank having the defect portion is located. A dam formed in a concave space partitions the concave space into a first space in a vicinity of the defect portion and a second space outside the vicinity of the defect portion. The dam, at a portion thereof with lowest height, satisfies (h/H)+0.1W?1.5, 0.5?(h/H)?2.0, and 5?W?50, where a ratio of the height h of the dam to a height H of the banks is denoted as h/H, and a width of the dam is denoted as W ?m.