Abstract: A telescopic boom includes a first frame having a curved portion whose section is substantially U-shaped, and a second frame connected to the first frame so that a closed section is formed. In the telescopic boom, the U-shaped curved portion of the first frame includes a plurality of protrusion portions formed at intervals in a circumferential direction of the telescopic boom, each protrusion portion extending in a longitudinal direction of the telescopic boom and being formed to have an arc-shaped section and protrude to the outside of the first frame.

Abstract: A method of manufacturing a wiring substrate, includes, forming an etching stop layer and a first wiring layer on a supporting member, forming a first insulating layer on the first wiring layer, forming a via hole reaching the first wiring layer, and forming the wiring layers of an n-layer and the insulating layers of an n-layer, removing the supporting member and the etching stop layer, thereby forming a build-up intermediate body, forming a second insulating layer on the wiring layer of an n-th layer, and forming a third insulating layer on first wiring layer, forming a via hole reaching the wiring layer of the n-th layer, and forming a via hole reaching the first wiring layer, forming a roughened face to the third insulating layer, and forming a second wiring layer connected to the wiring layer, and forming a third wiring layer connected to the first wiring layer.

Abstract: A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole.

Abstract: A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.

Abstract: A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an opposite side of the first surface, an electrode pad exposed from the first surface, a layered body including first insulating layers and being formed on the second surface, the first insulating layers having a first insulating material as a main component, another layered body including second insulating layers and being formed on the layered body, the second insulating layers having a second insulating material as a main component, and another electrode pad exposed from a surface of the another layered body that is opposite to the layered body. The number of the first insulating layers is equal to that of the second insulating layers. The first insulating layers have a thermal expansion coefficient that is greater than that of the second insulating layers.

Abstract: A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.

Abstract: A wiring board includes an insulating layer; a connection part provided on a surface of the insulating layer, the connection part including a first plating layer including a flat surface and a curved surface continuous with the flat surface, wherein the flat surface and the curved surface are exposed on the insulating layer, and an end portion of the curved surface is in contact with the surface of the insulating layer; and a second plating layer formed on an interior surface of the first plating layer so as to be coated with the first plating layer; and a via formed in the insulating layer so as to be connected to the second plating layer.

Abstract: A state determining device includes a current detecting unit, a state determining unit, and a notifying unit. The current detecting unit detects a current value of a drive current which flows into a drive motor that rotary-drives a driven unit with a drive force according to the drive current. Based on the drive current value detected by the current detecting unit, the state determining unit determines a state of a driving system including the driven unit. The notifying unit notifies a user of a determination result of the state determining unit.

Abstract: A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.

Abstract: An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.

Abstract: A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess.

Abstract: The danger of a jib falling off a boom due to an erroneous operation during movement of the jib between a stowage position and an extended position is eliminated. The jib is provided with a pivot pin insertion state detector, pivot pin retraction blocking element, a coupling pin insertion state detector, first and second cables, wherein movement of a coupling pin to a retracted position is restricted by a coupling pin retraction blocking element via the first cable when the pivot pin insertion state detector has detected that the pivot pin is retracted, and movement of the pivot pin to the retracted is restricted by the pivot pin retraction blocking element via the second cable when the coupling pin insertion state detector has detected that the coupling pin is retracted, so that simultaneous removal of both of the pivot pin and the coupling pin is prevented.

Abstract: A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer which is less subject to oxidation than the first metal layer is provided between the vias and the first metal layer, and the vias are connected to the second metal layer.

Abstract: A conveying device that conveys a sheet bundle with a flattened back-face portion includes a first conveying unit, a driving unit, and a second conveying unit. The first conveying unit retracts to a position where no driving force is exerted on the sheet bundle before a leading end of the sheet bundle formed in a flat spine shape enters, and abuts on the sheet bundle to exert conveying force after the leading end of the sheet bundle passes a conveying position. The driving unit moves the first conveying unit to retract to the position and to abut on the sheet bundle. The second conveying unit is positioned on an upstream side of the first conveying unit in a sheet bundle conveying direction and conveys the sheet bundle towards the first conveying unit.

Abstract: A drive unit for rotating a first rotary member and a second rotary member disposed around the first rotary member includes a drive source, an output gear driven by the drive source, a first gear greater in diameter than the output gear and configured to engage the output gear, a first joint member projecting from the first gear coaxially and coupled to the first rotary member, a second gear smaller in diameter than the first gear and connected between the first gear and the first joint member, a driven gear smaller in diameter than the first gear and disposed within an area of the first gear in a radial direction thereof to engage the second gear to be driven thereby, and a second joint member projecting from the driven gear coaxially and connected to the second rotary member.

Abstract: A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

Abstract: A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.

Abstract: To provide an acrylic rubber composition having an excellent heat resistance, especially an excellent balance between the residual ratio of the tensile strength and the residual ratio of the elongation after heat aging, when formed into a vulcanized product, and a hose article, a sealing article and a rubber vibration insulator using the acrylic rubber composition. An acrylic rubber composition containing an acrylic rubber obtainable by copolymerizing 100 parts by mass of an alkyl acrylate with from 10 to 100 parts by mass of an alkyl methacrylate and from 0.5 to 4 parts by mass of a crosslinkable monomer. Here, the alkyl methacrylate is preferably at least one compound selected from the group consisting of methyl methacrylate, ethyl methacrylate and n-butyl methacrylate, and the alkyl acrylate is preferably at least one compound selected from the group consisting of methyl acrylate, ethyl acrylate and n-butyl acrylate.

Abstract: Laser light is emitted to a sheet member wound on a forming drum in a range which includes the entire width of the sheet member and distance data on a distance to a reflecting surface is obtained, using a two-dimensional laser sensor which has a detection range along a drum circumferential direction, while moving either the two-dimensional laser sensor or the forming drum in a drum width direction. Further, the positions of width-directional opposite end sections of the sheet member are calculated on the basis of the obtained distance data.

Abstract: A fuel tank includes a first fuel chamber for receiving liquid fuel; a communication chamber communicated with the first fuel chamber and having a bottom higher than a bottom of the first fuel chamber; and a second fuel chamber communicated with the communication chamber, the second fuel chamber having a bottom lower than the bottom of the communication chamber. The fuel tank also includes a sleeve member having a lower end opening toward the bottom of the communication chamber, and configured so that fuel evaporative emissions are discharged while liquid fuel is supplied to the first fuel chamber. The first fuel chamber, the communication chamber, and the second fuel chamber are all molded integrally by resin blow molding. The communication chamber is provided with a protrusion which is convex when viewed from inside the communication chamber, and a depression which is concave when viewed from outside of the communication chamber.