Patents by Inventor Kazunari Maki

Kazunari Maki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11149329
    Abstract: This stabilizer material for superconductor includes a copper material, wherein the copper material contains one kind or two kinds or more of additive elements selected from Ca, La, and Ce for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, and the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO4, LaS, La2SO2, CeS, and Ce2SO2 are present in the matrix.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: October 19, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei Fukuoka, Yuki Ito, Kazunari Maki
  • Patent number: 11104977
    Abstract: A copper alloy includes, by mass %: Mg: 0.15%-0.35%; and P: 0.0005%-0.01%, with a remainder being Cu and unavoidable impurities, wherein [Mg]+20×[P]<0.5 is satisfied. Among the unavoidable impurities, H is 10 mass ppm or less, O is 100 mass ppm or less, S is 50 mass ppm or less, and C is 10 mass ppm or less. In addition, 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to a total grain boundary triple junctions is NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is NFJ2.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 31, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Matsunaga, Kenichiro Kawasaki, Hiroyuki Mori, Kazunari Maki, Yoshiteru Akisaka
  • Publication number: 20210225560
    Abstract: The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca, Sr, Ba, and rare earth elements in a total of 3 ppm by mass to 400 ppm by mass; a balance being Cu and inevitable impurities, and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.
    Type: Application
    Filed: October 13, 2020
    Publication date: July 22, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei FUKUOKA, Yuki ITO, Kazunari MAKI
  • Publication number: 20210108325
    Abstract: A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 ?m to 1.2 ?m inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu6Sn5 is a main ingredient and part of copper in the Cu6Sn5 is substituted with nickel, and an average crystal grain size is 0.2 ?m to 1.5 ?m inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 ?m to 1000 ?m inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.
    Type: Application
    Filed: March 29, 2019
    Publication date: April 15, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Kazunari Maki, Shinichi Funaki, Yuki Inoue, Kiyotaka Nakaya
  • Patent number: 10971278
    Abstract: This superconducting wire includes: a strand including a superconducting material; and a stabilizer material for superconductor arranged in contact with the strand, wherein the stabilizer material for superconductor includes a copper material which contains one kind or two kinds or more of additive elements selected from Ca, Sr, Ba, and rare earth elements (RE) for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO4, SrS, SrSO4, BaS, BaSO4, (RE)S, and (RE)2SO2 are present in the matrix.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: April 6, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei Fukuoka, Yuki Ito, Kazunari Maki
  • Patent number: 10964454
    Abstract: The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca, Sr, Ba, and rare earth elements in a total of 3 ppm by mass to 400 ppm by mass; a balance being Cu and inevitable impurities, and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: March 30, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei Fukuoka, Yuki Ito, Kazunari Maki
  • Patent number: 10964453
    Abstract: The present invention is a superconducting stabilization material used for a superconducting wire, which is formed of a copper material which contains: one or more types of additive elements selected from Ca, La, and Ce in a total of 3 ppm by mass to 400 ppm by mass; and a balance being Cu and inevitable impurities and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 30, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei Fukuoka, Yuki Ito, Kazunari Maki
  • Patent number: 10923245
    Abstract: A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 ?m to 1.2 ?m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 ?m to 1.5 ?m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 ?m to 1.0 ?m (inclusive) and an average crystal grain diameter of from 0.01 ?m to 0.5 ?m (inclusive).
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: February 16, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuki Inoue, Kazunari Maki, Shinichi Funaki, Takashi Tamagawa, Kiyotaka Nakaya
  • Patent number: 10910132
    Abstract: The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca, Sr, Ba, and rare earth elements in a total of 3 ppm by mass to 400 ppm by mass; a balance being Cu and inevitable impurities, and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: February 2, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei Fukuoka, Yuki Ito, Kazunari Maki
  • Publication number: 20210017628
    Abstract: A copper alloy for electronic and electrical equipment is provided, including: 0.15 mass % or greater and less than 0.35 mass % of Mg; 0.0005 mass % or greater and less than 0.01 mass % of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, a content [Mg] (mass %) of Mg and a content [P] (mass %) of P satisfy a relational expression of [Mg]+20×[P]<0.5, and a content of H is 10 mass ppm or less, a content of O is 100 mass ppm or less, a content of S is 50 mass ppm or less, and a content of C is 10 mass ppm or less.
    Type: Application
    Filed: March 29, 2017
    Publication date: January 21, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kazunari MAKI
  • Publication number: 20210002743
    Abstract: A copper alloy includes, by mass %: Mg: 0.15%-0.35%; and P: 0.0005%-0.01%, with a remainder being Cu and unavoidable impurities, wherein [Mg]+20×[P]<0.5 is satisfied. Among the unavoidable impurities, H is 10 mass ppm or less, O is 100 mass ppm or less, S is 50 mass ppm or less, and C is 10 mass ppm or less. In addition, 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to a total grain boundary triple junctions is NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is NFJ2.
    Type: Application
    Filed: March 28, 2019
    Publication date: January 7, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kenichiro KAWASAKI, Hiroyuki MORI, Kazunari MAKI, Yoshiteru AKISAKA
  • Publication number: 20200340079
    Abstract: A superconductivity stabilizing material used for a superconducting wire and which is formed of a copper material containing at least one of additive elements selected from Ca, Sr, Ba, and rare earth elements in a range of 3 ppm by mass or more and 100 ppm by mass or less in total, with a remainder being Cu and unavoidable impurities, in which the total concentration of the unavoidable impurities, excluding O, H, C, N, and S which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, the half-softening temperature thereof is 200° C. or lower, the Vickers hardness thereof is 55 Hv or more, and the residual resistance ratio (RRR) thereof is 50 or more and 500 or less.
    Type: Application
    Filed: October 30, 2018
    Publication date: October 29, 2020
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei FUKUOKA, Yuki ITO, Kazunari MAKI
  • Patent number: 10676803
    Abstract: A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75% IACS, and a strength ratio TSTD/TSLD, which is calculated from strength TSTD obtained in a tensile test performed in a direction perpendicular to a rolling direction and strength TSLD obtained in a tensile test performed in a direction parallel to a rolling direction, is more than 0.9 and less than 1.1. The copper alloy may further include P in a range of 0.0005 mass % or more and less than 0.01 mass %.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 9, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Matsunaga, Kazunari Maki
  • Publication number: 20200002787
    Abstract: The stabilizer material for superconductor of the present invention is used for a superconducting wire, and the stabilizer material for superconductor includes a copper material, the copper material contains one kind or more of additive elements selected from Mg, Mn, Ti, Y, and Zr for a total amount of 3 ppm by mass or more and 100 ppm by mass or less, with the remainder being Cu and unavoidable impurities, the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or more selected from MgS, MgSO4, MnS, TiS, YS, Y2SO2, and ZrS are present in the matrix.
    Type: Application
    Filed: April 3, 2017
    Publication date: January 2, 2020
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei FUKUOKA, Yuki ITO, Kazunari MAKI
  • Publication number: 20190362865
    Abstract: A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 ?m to 1.2 ?m (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of Cu6Sn5, with some of the copper in the Cu6Sn5 being substituted by nickel, and has an average crystal grain diameter of from 0.2 ?m to 1.5 ?m (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 ?m to 1.0 ?m (inclusive) and an average crystal grain diameter of from 0.01 ?m to 0.5 ?m (inclusive).
    Type: Application
    Filed: January 16, 2018
    Publication date: November 28, 2019
    Inventors: Yuki Inoue, Kazunari Maki, Shinichi Funaki, Takashi Tamagawa, Kiyotaka Nakaya
  • Publication number: 20190338396
    Abstract: This stabilizer material for superconductor includes a copper material, wherein the copper material contains one kind or two kinds or more of additive elements selected from Ca, La, and Ce for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, and the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO4, LaS, La2SO2, CeS, and Ce2SO2 are present in the matrix.
    Type: Application
    Filed: April 3, 2017
    Publication date: November 7, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei FUKUOKA, Yuki ITO, Kazunari MAKI
  • Patent number: 10458003
    Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100??(1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: October 29, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazunari Maki, Yuki Ito
  • Patent number: 10453582
    Abstract: A copper alloy for and electric and an electronic device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; Pin a range of 0.0005 mass % or more and less than 0.01 mass %; and a Cu balance including inevitable impurities. In the copper alloy, a Mg content [Mg] and a P content [P], both of which are in a mass ratio, satisfy a relationship expressed by [Mg]+20×[P]<0.5, and an electrical conductivity of the copper alloy is more than 75% IACS.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: October 22, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Matsunaga, Kazunari Maki
  • Patent number: 10392680
    Abstract: Provided are a copper alloy for electric and electronic devices, a copper alloy sheet for electric and electronic devices, a component for electric and electronic devices, a terminal, and a bus bar. The copper alloy for electric and electronic devices includes, as a composition: 0.01 mass % or higher and lower than 0.11 mass % of Zr; 0.002 mass % or higher and lower than 0.03 mass % of Si; and a balance including Cu and unavoidable impurities, in which a ratio Zr/Si of the Zr content (mass %) to the Si content (mass %) is within a range of 2 to 30.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: August 27, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazunari Maki, Hirotaka Matsunaga, Shuhei Arisawa
  • Patent number: 10294547
    Abstract: The present invention provides a copper alloy for electronic and electronic device which has excellent mechanical properties and is capable of suppressing generation of defects even in a case in which the copper alloy is worked to a thin plate thickness or a smaller wire diameter than in the related art, a plastically-worked copper alloy material, and a component and a terminal for electronic and electronic device. The copper alloy for electronic and electronic device of the present invention includes Mg in a range of 1.3 mass % to 2.8 mass % with a remainder substantially being Cu and inevitable impurities, in which a content of H is set to 10 mass ppm or lower, a content of O is set to 100 mass ppm or lower, a content of S is set to 50 mass ppm or lower, and a content of C is set to 10 mass ppm or lower.
    Type: Grant
    Filed: July 29, 2014
    Date of Patent: May 21, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuki Ito, Kazunari Maki