Abstract: A resin composition comprises 100 parts by weight of an ethylene-base resin comprising at least 2 wt. % of linear low-density polyethylene and 0.1-30 parts by weight of an organopolysiloxane having an average molecular weight of at least 100,000. The resin composition can be produced by melting and kneading the organopolysiloxane together with the linear low-density polyethylene and then melting and kneading the resulting polymer blend together with the ethylene-base resin other than the linear low-density polyethylene. The resin composition may additionally comprise 0.1-100 parts by weight of a propylene-base resin. In the latter resin composition, the organopolysiloxane is contained in an amount of 0.1-30 parts by weight per 100 parts by weight of the sum of the ethylene-base resin and the propylene-base resin.

Abstract: A resin composition comprises 100 parts by weight of an ethylene-base resin comprising at least 2 wt. % of linear low-density polyethylene and 0.1-30 parts by weight of an organopolysiloxane having an average molecular weight of at least 100,000. The resin composition can be produced by melting and kneading the organopolysiloxane together with the linear low-density polyethylene and then melting and kneading the resulting polymer blend together with the ethylene-base resin other than the linear low-density polyethylene. The resin composition may additionally comprise 0.1-100 parts by weight of a propylene-base resin. In the latter resin composition, the organopolysiloxane is contained in an amount of 0.1-30 parts by weight per 100 parts by weight of the sum of the ethylene-base resin and the propylene-base resin.

Abstract: In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

Abstract: A method and apparatus for file operation comprise a file operation method which enters, prior to the file operation, processing methods for exceptional events which are expected to occur during the file operation, a file operation method which, at the occurrence of an exceptional event during a file operation, holds the file operation, saves information pertinent to the held file into a memory, and inquires the user of the processing method of the held file for the exceptional event, and a file operation method which displays a list of hierarchically organized files at multiple levels so that multiple files can be designated as objects of operations.

Abstract: Edited data for text, patterns, graphs, and the like can be provided by editing programs dedicated to edition of each of such data. A system for editing and printing documents includes a plurality of printing program each corresponding with each of the editing programs and operating independently of one another for generating graphics commands in accordance with the edited data a printing control program for generating print images composed of dots in accordance with the graphics commands from the printing programs and a printing management program for controlling operations of the printing programs in accordance with data in a control data file which stores therein data related to printing programs such as print positions of individual edited data.

Abstract: A central processing unit, a main memory for storing graphic or character data, an external memory, an input device for inputting the graphic or character data, a shared memory for temporarily storing the graphic or character data read by the central processing unit, a display processing means for preparing a plurality of display data displayed on a display from the graphic or character data on the shared memory, and a display memory for storing the plurality of display data are connected to a bus. The display memory, the shared memory, and the external memory have first, second and third save areas for temporarily saving the overlapped display data when the plurality of display data are overlapped. The main memory is provided with a first control table for controlling display position, mutual priority for display, and a save area during overlap, regarding each of the plurality of display data stored in the display memory.

Abstract: A print control system for controlling a computer system comprising a processing unit, a memory unit, a display unit, an input unit and a printer. The memory unit has print request blocks each for storing information necessary for printing a document, and an area for storing a print queue for defining the print execute order of the print request blocks.

Abstract: In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.