Abstract: A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

Abstract: A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

Abstract: A semiconductor device includes vertical placement part for mounting the semiconductor device on a surface of a circuit board in a vertical position, and a connection part for making electrical connections between the circuit board and a semiconductor element. A stage is provided on which the semiconductor element is placed. The stage has supporting members causing the semiconductor device to vertically stand on the circuit board. Wiring boards, stacked on a side of the stage on which the semiconductor element is placed, have windows in which the semiconductor element is located. The vertical placement part includes wiring lines extending between edges of the wiring boards facing the circuit board and peripheries of the windows. The wiring lines have ends located in the vicinity of the edges of the wiring boards and have a shape enabling the semiconductor device to be mounted on the circuit board.

Abstract: A semiconductor device employs a lead frame including a die pad (24) and a plurality of leads (25) provided outside the die pad, and is manufactured by sealing the die pad and its periphery by a resin after the die pad is fitted with the semiconductor chip (11). The die pad (24) is formed separately from the main part of the lead frame provided with leads, and is rounded at an entire outermost edge thereof and includes a flat plate shape. This die pad can be either formed rounded with ceramic or resin, or formed in metal and given a rounded edge through honing.

Abstract: A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, such that the terminal members roll substantially freely when placed on a flat surface, and of a substantially identical diameter.

Abstract: A semiconductor device includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.

Abstract: A lead frame for manufacturing a semiconductor device has at least one set of substantially parallel leads having inner ends for connection to a semiconductor chip, outer ends for external connection and central portions therebetween and an outer tiebar interconnecting the outer ends and having an elongated guide hole therein, the longer dimension of the guide hole being parallel to the leads. A lead bending die has a locating pin respectively corresponding to and received in sliding engagement in each guide hole. The die maintains a center portion of them lead frame in a first plane and, with each locating pin remaining in sliding engagement within the respective, elongated guide hole, bends the central portions of the leads thereby to dispose the respective outer ends of the leads in a second plane, displaced from the first plane. The outer tiebar and the sliding engagement of the locating pin in the guide hole serve to prevent undesirable deformation of the leads as a result of the bending operation.

Abstract: A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.

Abstract: PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced.