Abstract: An image forming apparatus includes a unit, a high-voltage board and a connecting mechanism. The connecting mechanism includes a first connecting member, a first holding member, a coupling member and a second connecting member. The first connecting member includes a first spring terminal. The first spring terminal includes a first large diameter part and a first small diameter part. The first holding member has a first contact part coming into contact with an end part of the first small diameter part at a side of the first large diameter part in a state where the first holding member is coupled with the coupling member. The coupling member has a second contact part coming into contact with an end part of the first large diameter part at a side of the first small diameter part in the state where the first holding member is coupled with the coupling member.

Abstract: A holding member of a sheet feeder includes a locking member engageable with a part of a pinion gear and holds the pinion gear and a sensor member. The holding member is detachably attachable to the sheet storage portion. The pinion gear and a pair of rack members are meshed with the holding member attached to a sheet storage portion. The holding member holds the pinion gear movably in an axial direction of the rotary shaft so that the pinion gear is displaceable between a first position where the rotation of the pinion gear is regulated and a second position where the pinion gear is rotatable. The pinion gear is located at the first position with the holding member detached from the sheet storage portion and located at the second position with the holding member attached to the sheet storage portion.

Abstract: A display control unit (23) scrollably displays a plurality of images to be displayed in a specific display area within a screen. An operation receiving unit (21) receives a scroll instruction and a display mode switching instruction that are issued in response to a user operation. When a display mode is switched, the display control unit (23) switches a display in the display area such that, among the plurality of images in the display area displayed in the first display mode, at least one image located as a position that goes out of the display area first upon scroll in a forward direction is arranged, upon a switch to a second display mode, at a position that also goes out of the display area first upon scroll in the forward direction in the display area.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A semiconductor device includes a first chip including a PN junction diode, and a second chip including a Schottky barrier diode, connected in parallel to the first chip. A first inductive metal member has a first end connected to a cathode of the PN junction diode, and a second end connected to a cathode of the Schottky barrier diode. A second inductive metal member has a third end connected to the cathode of the Schottky barrier diode. An output line is connected to a fourth end of the second connection member, and electrically connected to the cathode of the PN junction diode via a first path formed by the first and second metal members, and to the cathode of the Schottky barrier diode via a second path formed by the second metal member and exclusive of the first metal member, so that the first path has greater inductance than the second.

Abstract: A holding member of a sheet feeder includes a locking member engageable with a part of a pinion gear and holds the pinion gear and a sensor member. The holding member is detachably attachable to the sheet storage portion. The pinion gear and a pair of rack members are meshed with the holding member attached to a sheet storage portion. The holding member holds the pinion gear movably in an axial direction of the rotary shaft so that the pinion gear is displaceable between a first position where the rotation of the pinion gear is regulated and a second position where the pinion gear is rotatable. The pinion gear is located at the first position with the holding member detached from the sheet storage portion and located at the second position with the holding member attached to the sheet storage portion.

Abstract: An image forming apparatus includes an exterior cover having a plurality of faces. The exterior cover is configured so that one face of the plurality of faces is divided into a plurality of cover boards. The plurality of cover boards are configured so that adjacent cover boards of the plurality of cover boards include respective overlapping parts overlapping onto each other formed in the respective adjacent cover boards and the one face is composed by overlapping the overlapping parts from the outside in predetermined order.

Abstract: An image forming apparatus includes an apparatus main body and a board holding member. The apparatus main body includes an image forming part. The board holding member is attached to the apparatus main body and configured to have a surface to which a board is fixed. The apparatus main body includes an engaging part and a supporting part. The engaging part is configured to engage with a side edge part of the board holding member. The supporting part is configured to support a part closer to an inside than the side edge part of the board holding member. The board holding member is rotated around the side edge part as a fulcrum so as to be opened and closed with respect to the apparatus main body.

Abstract: An image forming apparatus includes a unit, a high-voltage board and a connecting mechanism. The connecting mechanism includes a first connecting member, a first holding member, a coupling member and a second connecting member. The first connecting member includes a first spring terminal. The first spring terminal includes a first large diameter part and a first small diameter part. The first holding member has a first contact part coming into contact with an end part of the first small diameter part at a side of the first large diameter part in a state where the first holding member is coupled with the coupling member. The coupling member has a second contact part coming into contact with an end part of the first large diameter part at a side of the first small diameter part in the state where the first holding member is coupled with the coupling member.

Abstract: An electronic circuit includes a bipolar device, a unipolar device connected in parallel to the bipolar device, and an output line connected to the bipolar device and to the unipolar device. An inductance between the unipolar device and the output line is smaller than an inductance between the bipolar device and the output line.

Abstract: An image forming system includes an image forming apparatus, a post-processing apparatus, a fixed member, a first connector, a connecting member, and a second connector. The mage forming apparatus includes the fixed member on which the first connector is mounted and the post-processing apparatus includes connecting member on which the second connector is mounted. The connecting member is movable in a front-back direction and configured so as to be displaced between an engaging position in which the connecting member is engaged with the fixed member and a disengaging position in which the connecting member is disengaged from the fixed member. The first connector and the second connector are disconnected from each other when the connecting member is set to the disengaging position, and connected to each other when the connecting member is set to the engaging position.

Abstract: A semiconductor device (1) includes an n type epitaxial layer (8), body regions (12) formed in the surface layer part of the n type epitaxial layer (8), n type source regions (16) formed in the surface layer parts of the body regions (12), a gate insulating film (19) formed on the n type epitaxial layer (8), and a gate protection diode (30) and gate electrodes (20) formed on the gate insulating film (19). The gate protection diode (30) includes a first p type region (31), an n type region (32), and a second p type region (33). A first diode (30A) is formed of the first p type region (31) and the n type region (32). A second diode (30B) is formed of the n type region (32) and the second p type region (33). The first p type region (31) is connected to the gate electrode (20). The second p type region (33) is connected to a source electrode (27).

Abstract: A semiconductor device includes a first conductive-type semiconductor layer, a second conductive-type body region formed in a surficial portion of the semiconductor layer, a first conductive-type source region formed in a surficial portion of the body region, a gate insulating film provided on the semiconductor layer and containing nitrogen atoms, the gate insulating film including a first portion in contact with the semiconductor layer outside the body region, a second portion in contact with the body region, and a third portion in contact with the source region, and a gate electrode provided on the gate insulating film in an area extending across the semiconductor layer outside the body region, the body region, and the source region. The third portion of the gate insulating film has a thickness greater than the thickness of the first portion and the thickness of the second portion.

Abstract: Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of which is connected to a unipolar device, said semiconductor device being capable of improving the reliability of wire bonding. A package (4) includes a die pad (61), a source lead (63), a first MOSFET (11), and a first Schottky barrier diode (21). A source electrode (11S) of the first MOSFET (11), an anode electrode (21A) of the first Schottky barrier diode (21), and the source lead (63) are electrically connected by the bonding wire (31), one end of which is bonded to the source electrode (11S) of the first MOSFET (11), the other end of which is bonded to the source lead (63), and the center of which is bonded to the anode electrode (21A) of the first Schottky barrier diode (21).

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of which is connected to a unipolar device, said semiconductor device being capable of improving the reliability of wire bonding. A package (4) includes a die pad (61), a source lead (63), a first MOSFET (11), and a first Schottky barrier diode (21). A source electrode (11S) of the first MOSFET (11), an anode electrode (21A) of the first Schottky barrier diode (21), and the source lead (63) are electrically connected by the bonding wire (31), one end of which is bonded to the source electrode (11S) of the first MOSFET (11), the other end of which is bonded to the source lead (63), and the center of which is bonded to the anode electrode (21A) of the first Schottky barrier diode (21).

Abstract: An image forming apparatus according to one aspect of the present disclosure includes an apparatus body, a document sheet feed apparatus, a wiring cord, a guide portion, and a wiring cord cover. The apparatus body includes a document sheet reading portion therein. The document sheet feed apparatus is configured to be openable and closable relative to a document sheet placing surface of the apparatus body. The wiring cord is configured to electrically connect between the apparatus body and the document sheet feed apparatus. The guide portion is configured to surround the wiring cord. The wiring cord cover is mounted detachably to the apparatus body in a state where the wiring cord cover has the wiring cord disposed therein.

Abstract: An inspection management apparatus includes: a schedule generation unit that, based on a scheduled start date and time of examination, a scheduled start date and time of observation, a predictive transfer time of image data from a receiving device to an inspection management apparatus, and a predictive image processing time for each type of image processing, calculates an image transfer start date and time from the receiving device to the inspection management apparatus, and calculates an image processing start date and time of the transferred image data; and a control unit that starts acquisition of the image data transmitted from the receiving device when the image transfer start date and time comes, and causes, when the image processing start date and time comes, an image processing unit to perform specified image processing on the image data that the transfer has been started on the image transfer start date and time.

Abstract: Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of which is connected to a unipolar device, said semiconductor device being capable of improving the reliability of wire bonding. A package (4) includes a die pad (61), a source lead (63), a first MOSFET (11), and a first Schottky barrier diode (21). A source electrode (11S) of the first MOSFET (11), an anode electrode (21A) of the first Schottky barrier diode (21), and the source lead (63) are electrically connected by the bonding wire (31), one end of which is bonded to the source electrode (11S) of the first MOSFET (11), the other end of which is bonded to the source lead (63), and the center of which is bonded to the anode electrode (21A) of the first Schottky barrier diode (21).

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.