Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Abstract: A molding apparatus includes a mechanism configured to apply a curable composition onto a substrate with irregularities, a pressing and releasing mechanism that presses or releases a mold (super straight) having a flat surface against the curable composition on the substrate, and a curing mechanism configured to cure the curable composition by light radiation, a first supply unit configured to supply a first gas to the curable-composition application mechanism, and a second supply unit configured to supply a second gas different from the first gas to the pressing and releasing mechanism.

Abstract: A molding apparatus including a template apparatus is configured to bring the template into contact with a curable composition arranged on a substrate and to cure the curable composition. The template includes a planarization coating layer of which a site front least squares range (SFQR) is 20 nm or less in a contact surface which is a surface of the template in contact with the curable composition.

Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Abstract: The pattern forming method, which is a photo-nanoimprint technology, includes in this order: laying a layer formed of a curable composition (A1) containing at least a polymerizable compound on a surface of a substrate; dispensing liquid droplets of a curable composition (A2) containing at least a polymerizable compound dropwise discretely onto the layer of (A1) to lay the liquid droplets; sandwiching a layer obtained by partially mixing (A1) and (A2) between a mold and the substrate; of irradiating the layer obtained by partially mixing (A1) and (A2) with light from a side of the mold to cure the layer in one stroke; and releasing the mold from the layer formed of the curable compositions after the curing, in which a value Vr/Vc obtained by dividing a volume of (A2) per shot area (Vr) by a volume of (A1) (Vc) is 4 or more and 15 or less.

Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.

Abstract: Method of forming a pattern by arranging a photocurable composition on a substrate; bringing a mold having a concavo-convex pattern into contact with the composition; irradiating the composition with light to form a cured film; releasing the mold from the cured film; forming a reversal layer on the cured film having a concavo-convex pattern transferred from the mold; partially removing the reversal layer to expose the convexes of the pattern in such a manner that the reversal layer remains in the concaves of the pattern formed on the cured film; and etching the photocurable composition layer using the reversal layer remaining in the concaves as a mask to form a reversal pattern, wherein the mold is brought into contact with the photocurable composition in an atmosphere of a soluble gas having a solubility in the composition; and the soluble gas has a saturation solubility of 38% by volume or more.

Abstract: A pattern is formed on a substrate with forming a layer of a first curable composition (A1) containing a component (a1) as a polymerizable compound and a first component (c1) as a surfactant on a surface of the substrate, then dispensing droplets of a second curable composition (A2) containing a component (a2) as a polymerizable compound and a second component (c2) as a surfactant onto the layer formed of the first curable composition (A1), subsequently sandwiching a mixture layer of the first and second curable compositions (A1) and (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after curing. The first curable composition (A1) contains at least 0.5 wt % of the first component (c1), the second curable composition (A2) contains at least 0.5 wt % of the second component (c2).

Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound and a component (d1) serving as a solvent on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound dropwise discretely onto the layer of the curable composition, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the layer, and releasing the mold from the mixture layer after the curing.

Abstract: The pattern forming method, which is a photo-nanoimprint technology, includes in this order: laying a layer formed of a curable composition (A1) containing at least a polymerizable compound on a surface of a substrate; dispensing liquid droplets of a curable composition (A2) containing at least a polymerizable compound dropwise discretely onto the layer of (A1) to lay the liquid droplets; sandwiching a layer obtained by partially mixing (A1) and (A2) between a mold and the substrate; of irradiating the layer obtained by partially mixing (A1) and (A2) with light from a side of the mold to cure the layer in one stroke; and releasing the mold from the layer formed of the curable compositions after the curing, in which a value Vr/Vc obtained by dividing a volume of (A2) per shot area (Vr) by a volume of (A1) (Vc) is 4 or more and 15 or less.

Abstract: An imprint method that uses a condensable gas process has a problem in that the surface of a resist cured film is rough. This is resolved by a photocurable composition used for performing imprint in an atmosphere containing a condensable gas. The photocurable composition contains a component (A) which is a (meth)acrylate monomer, a component (B) which is a photopolymerization initiator, and a component (C) which is a mold releasing agent. A saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 5% by weight or less, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.

Abstract: In an imprint method in a condensable gas atmosphere, the force (mold releasing force) required to separate a mold from a resist cured film (mold release) has been large. A photocurable composition for performing imprint in an atmosphere containing a condensable gas includes a component (A) which is a (meth)acrylate monomer; a component (B) which is a photopolymerization initiator; and a component (C) which is a mold releasing agent. The saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 50% by weight or more, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.

Abstract: An imprinting method for forming a pattern of a cured product by irradiating a curable composition for imprinting disposed on a substrate with light while the curable composition is in contact with a mold having surface asperities and removing the mold from a cured product of the curable composition. The method includes bringing the mold into contact with the curable composition in a condensable gas atmosphere, wherein the curable composition for imprinting has a viscosity in the range of 1 cP to 40 cP in air at 23° C., and the condensable gas is introduced between the mold and the curable composition such that the curable composition for imprinting has a condensable gas solubility (gas/(curable composition+gas)) (g/g) in the range of 0.1 to 0.4.

Abstract: A pattern is formed by arranging a photocurable composition on a substrate; bringing a mold having a concavo-convex pattern into contact with the composition; irradiating the composition with light to form a cured film; releasing the mold from the cured film; forming a reversal layer on the cured film having a concavo-convex pattern transferred from the mold; partially removing the reversal layer to expose the convexes of the pattern in such a manner that the reversal layer remains in the concaves of the pattern formed on the cured film; and etching the photocurable composition layer using the reversal layer remaining in the concaves as a mask to form a reversal pattern, wherein the mold is brought into contact with the photocurable composition in an atmosphere of a soluble gas having a solubility in the composition; and the soluble gas has a saturation solubility of 38% by volume or more.

Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.

Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound and a component (d1) serving as a solvent on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound dropwise discretely onto the layer of the curable composition, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the layer, and releasing the mold from the mixture layer after the curing.

Abstract: A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a component (a1) as a polymerizable compound and a component (c1) as a surfactant on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a component (a2) as a polymerizable compound and a component (c2) as a surfactant dropwise discretely onto the layer formed of the curable composition (A1), subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) containing at least 0.5 wt % or more of the component (c1), the curable composition (A2) containing at least 0.5 wt % or more of the component (c2).

Abstract: An imprint apparatus for forming a pattern on a substrate by bringing a mold into contact with an imprint material on the substrate is provided. The apparatus includes a supply device configured to supply, between the imprint material and the mold, a condensable gas that is liquefied due to a rise in pressure caused by the contact, and a controller configured to control a pressure of a gas between the imprint material and the mold before the contact so that the condensable gas between the imprint material and the mold is not liquefied before the contact.

Abstract: In an imprint method in a condensable gas atmosphere, the force (mold releasing force) required to separate a mold from a resist cured film (mold release) has been large. A photocurable composition for performing imprint in an atmosphere containing a condensable gas includes a component (A) which is a (meth)acrylate monomer, a component (B) which is a photopolymerization initiator; and a component (C) which is a mold releasing agent. The saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 50% by weight or more, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.