Abstract: An exposure apparatus including an exposure system for executing an exposure operation by use of an exposure beam to transfer a pattern of a mask onto a substrate, the mask having a photocatalyst portion, an auxiliary space for irradiating, therewithin, the mask with an auxiliary radiation different from the exposure beam to accelerate photocatalytic reaction of the photocatalyst portion, and a humidity control system for controlling humidity inside the auxiliary space.

Abstract: An X-ray mask structure and X-ray exposure method using the same are disclosed, wherein the mask has an X-ray absorptive material pattern, a supporting film for supporting the pattern, and a holding frame for holding the supporting film, wherein a suction port is arranged to be communicated with an external gas drawing system, and wherein a supply port is provided so that a gas can be supplied therethrough, for prevention of dust adhesion to the mask.

Abstract: An X-ray mask has a mask pattern, a protection means for forming a dust-proof space for protecting the mask pattern, and an inner atmospheric pressure adjustment hole for ventilating between the dust-proof space and the outer atmosphere. The X-ray mask can be either a transmission type mask in which the mask pattern is formed on a membrane, or a reflection type mask in which a multilayered film reflection layer and the mask pattern are formed on a substrate.

Abstract: An X-ray mask structure for use in X-ray lithography includes an X-ray transmission film to be disposed opposed to a workpiece in X-ray exposure, the X-ray transmission film having an X-ray absorptive material corresponding to a pattern to be printed on the workpiece, and a thin film covering at least a portion of the X-ray transmission film, the thin film having an anti-reflection function with respect to alignment light to be projected to the thin film for direct or indirect detection of relative positional deviation between the mask structure and the workpiece.

Abstract: A mask structure to be used for X-ray exposure or the like in manufacturing semiconductor devices prevents contaminants from adhering and accumulating on the surface of a mask, thereby extending the life of the mask. In this mask structure, titanium oxide films are formed on front and back pellicles that protect a mask, composed of a support film and an X-ray absorber, from dust or the like. Titanium oxide decomposes contaminants by functioning as a photocatalyst, and prevents the adhesion and accumulation of contaminants by an antistatic function based on photoconductivity. When a titanium oxide film is formed on the surface of the mask itself, it is preferable that the film be formed outside the exposure area or the like.

Abstract: The present invention provides a method for manufacturing an optical element to be used for an optical system and an optical instrument using the optical system, and a method for manufacturing a device using the optical instrument, wherein the optical element is manufactured by the steps including the steps for processing a high purity silica glass by lithography, and the hydrogen molecule content is adjusted after manufacturing the optical element.

Abstract: An X-ray mask includes a mask pattern formed on a surface, a detachable protection cover attached on the surface for forming a dust-proof space for protecting the mask pattern, the protection cover being detached when the mask pattern is exposed with X-rays, and a hole for ventilating between the dust-proof space and an outer atmosphere.

Abstract: A mask structure to be used for X-ray exposure or the like in manufacturing semiconductor devices prevents contaminants from adhering and accumulating on the surface of a mask, thereby extending the life of the mask. In this mask structure, titanium oxide films are formed on front and back pellicles that protect a mask, composed of a support film and an X-ray absorber, from dust or the like. Titanium oxide decomposes contaminants by functioning as a photocatalyst, and prevents the adhesion and accumulation of contaminants by an antistatic function based on photoconductivity. When a titanium oxide film is formed on the surface of the mask itself, it is preferable that the film be formed outside the exposure area or the like.

Abstract: A reflection-type mask for use in exposing a pattern onto a photosensitive material, wherein the mask includes a reflection area, having a multilayer film, for reflecting exposure light, and a non-reflection area which does not reflect the exposure light, the reflection area and the non-reflection area forming a mask pattern, wherein at least one layer of the multilayer film consists of an impurity semiconductor, whereby bad influences, for example, caused by poor conduction of the multilayer film at mask-production stage, can be prevented.

Abstract: An exposure method for printing a pattern onto a workpiece to be exposed, includes a first exposure step for forming, on the workpiece and by exposure, a transferred image of a first absorbing material pattern formed on a mask and having no periodic structure, and a second exposure step for printing, on the workpiece and by exposure, a diffraction pattern to be produced through Fresnel diffraction due to a second absorbing material pattern formed on the mask and having a periodic structure, the diffraction pattern having a period corresponding to 1/n of a period of the transferred image of the periodic structure pattern, where n is an integer not less than 2, and wherein the first and second exposure steps are performed simultaneously.

Abstract: An X-ray mask includes a holding frame, a membrane held by the holding frame, a pattern formed on a surface of the membrane by an X-ray absorptive material, the surface being disposed opposed to a workpiece to which the pattern is to be transferred when the mask is mounted in an exposure apparatus, a member for reinforcing the holding frame and having a portion placed closer to the workpiece than to the membrane and a pellicle provided at a side where the pattern is formed, the pellicle being attached to the portion of the member so that the pellicle is placed at the workpiece side of the membrane.

Abstract: A method of manufacturing semiconductor devices includes a coating step for coating a substrate using a resist solution including a base resin and a low-oxygen or oxygen-free solvent in which oxygen is removed by nitrogen bubbling, a heating step for heating the substrate coated with the resist, an exposing step for exposing the substrate with radiation to transfer a pattern, and a developing step for developing the exposed substrate. The coating step, the heating step, the exposing step and the developing step are performed under an environment controlled in a low-oxygen or oxygen-free state.

Abstract: A resist solution for photolithography includes a base resin and an oxygen-free or low-oxygen solvent, wherein an oxygen volume in 1 ml of the solution is 0.05 cm.sup.3 or less under atmospheric pressure.

Abstract: X-ray or vacuum-ultraviolet-ray transmissive mask membrane is constituted by a laminated film. The laminated film is obtained by continuously forming a SiCN film on one of or each of sides of a SiC film. Thereby, a membrane, which is superior in physical or mechanical strength and in surface conditions and optical transmittance, is provided. Moreover, there is provided a mask using the membrane.

Abstract: The present X-ray mask comprises an X-ray transmitting film, and a mask pattern formed on the X-ray transmitting film, wherein the mask pattern includes a mixture of a high-contrast pattern and a low-contrast pattern against X-rays and wherein the high-contrast pattern is comprised of stacked films the number of which is larger than that of the low-contrast pattern and which are made of different kinds of materials. A fabrication process of this X-ray mask comprises a step of forming a first metal film; a step of forming a second metal film of a different kind of material from the first metal film, thereon; and a step of successively performing a resist application process and an etching process to form a portion where the both first and second metal films are removed, a portion where only the first metal layer is left, and a portion where the both first and second metal layers are left, thereby forming a mask pattern.

Abstract: An X-ray mask structure is produced by a procedure including the steps of preparing a substrate having a surface provided thereon with an X-ray transmitting film, forming, on the substrate, one of a metal film and a multilayered film, having alkali resistivity, removing a predetermined limited portion of the metal film, bonding the substrate and a reinforcing member through the remaining metal film, by an anodic bonding process wherein the remaining metal film functions as an electrically conductive material in the anodic bonding process, etching the substrate with the remaining metal film functioning as an etching mask, to define an X-ray transmitting portion of the X-ray transmitting film and forming a mask pattern by use of an X-ray absorptive material.

Abstract: A mask for use with radiation including one of X-rays and vacuum ultraviolet rays. The mask includes a transmissive member for supporting a pattern of a radiation absorptive material, and a phase shifter material provided on the transmissive member. The phase shifter material has a radiation absorptivity less than that of the radiation absorptive material. The thickness of the transmissive member at a portion where the phase shifter material is provided is less than that of another portion thereof.

Abstract: A mask suitably usable in X-ray lithography has a membrane and a radiation absorbing material pattern formed on the membrane, wherein the radiation absorbing material pattern contains an alloy including tungsten (W) and molybdenum (Mo), the proportion of the molybdenum content to the alloy being in a range of 0.1-50 wt %, the alloy having crystal precedence orientation of {110}. In one preferred form, the absorbing material pattern is provided on an amolphous metal layer formed on the mask membrane.

Abstract: A method of making an X-ray mask structure having an X-ray absorber in a desired pattern on the surface of a support film held by a frame. The method includes a step of patterning the X-ray absorber, including a drawing step that utilizes charged particles, and a step of thereafter providing the frame with a magnetic member. The frame and the support film each include a non-magnetic material.

Abstract: Disclosed is a mask structure which includes a membrane on which a pattern is formed or to be formed, a holding frame for holding the membrane, and a reinforcing member for reinforcing the holding frame, wherein the reinforcing member comprises ceramics and wherein the reinforcing member and the holding frame are bonded to each other through a film oxide of the ceramics. Also disclosed is a mask structure which includes a membrane on which a pattern is formed or to be formed, a holding frame for holding the membrane, and a reinforcing member for reinforcing the holding frame, wherein the reinforcing member has a major constituent the same as that of the membrane.