Abstract: An imprint method that uses a condensable gas process has a problem in that the surface of a resist cured film is rough. This is resolved by a photocurable composition used for performing imprint in an atmosphere containing a condensable gas. The photocurable composition contains a component (A) which is a (meth)acrylate monomer, a component (B) which is a photopolymerization initiator, and a component (C) which is a mold releasing agent. A saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 5% by weight or less, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.

Abstract: A curable composition for imprinting in a condensable gas atmosphere, wherein the maximum condensable gas solubility (gas/(curable composition+gas)) (g/g) is 0.1 or more and 0.4 or less, and the curable composition for imprinting has a viscosity of 40 cP or less at 23° C. The maximum condensable gas solubility is determined by charging a 9-ml brown bottle with 3 g of the curable composition, measuring the weight of the curable composition at 23° C. at 1 atm before and after bubbling of the condensable gas at a flow rate of 0.1 L/min for 15 minutes, and dividing the increased weight due to the bubbling by the total weight of the curable composition and the condensable gas.

Abstract: A method of cleaning a supply pipe of an immersion exposure apparatus includes a cycle including a step of increasing a flow rate of a cleaning liquid via a supply pipe, which supplies a liquid to a gap between a substrate and a final surface of a projection optical system, and a step of decreasing the flow rate, wherein the cycle is executed a plurality of times after one of completion of one of setting and maintenance of the immersion exposure apparatus and completion of exposure of at least one substrate, and before exposure of a first shot region on a new substrate using the immersion exposure apparatus.

Abstract: An exposure apparatus includes an illumination optical system for illuminating a reticle using a light from a light source, and a projection optical system for projecting a pattern of the reticle onto a substrate, the exposure apparatus exposing the substrate through a liquid that is supplied to a space between the substrate and a lens of the projection optical system closest to the substrate, a surface of the lens on which the light does not pass having a polished surface.

Abstract: The present invention provides an exposure apparatus which exposes a substrate via a liquid, the apparatus including a projection optical system configured to project a pattern of a reticle onto the substrate, a liquid supply unit configured to supply the liquid between the projection optical system and the substrate, a blowing nozzle which is arranged around the projection optical system on a side of the substrate and configured to blow a gas around the liquid supplied between the projection optical system and the substrate, and an exhaust unit configured to exhaust the gas in a space between the blowing nozzle and the liquid supplied between the projection optical system and the substrate, the exhaust unit including a removal member configured to remove a volatile component which volatilizes from the liquid and is contained in the gas in the space.

Abstract: An exposure apparatus exposes a substrate via liquid, and includes a liquid holding plate configured to hold the liquid, and arranged around the substrate, and a chuck configured to hold the substrate, at least one of at least part of a surface of the liquid holding plate and at least part of a surface of the chuck being made of polyparaxylene resin or including a modified layer of polyparaxylene resin.

Abstract: An exposure apparatus includes an illumination optical system for illuminating a reticle using a light from a light source, and a projection optical system for projecting a pattern of the reticle onto a substrate, the exposure apparatus exposing the substrate through a liquid that is supplied to a space between the substrate and a lens of the projection optical system closest to the substrate, a surface of the lens on which the light does not pass having a polished surface.

Abstract: A reflection type mask includes a substrate on which a multi-layered film for reflecting X-rays is provided, a mask pattern which is formed on the multi-layered film for absorbing the X-rays, and a cover for protecting the mask pattern. The cover is detachably attached to the substrate.

Abstract: A method for forming a three-dimensional structure made of a photosensitive material on a substrate includes the steps of determining a film thickness of the photosensitive material necessary to form the desired three-dimensional structure, comparing a predetermined maximum film thickness with the film thickness determined by the determining step, and applying, when the film thickness determined by the determining step is greater than the predetermined maximum film thickness, the photosensitive material within the maximum film thickness plural times until the photosensitive material has the film thickness on the substrate.

Abstract: An optical system for forming an image of an object. The optical system includes an optical element, which is deformed by the weight thereof, and at least one optical member for preventing a change in optical performance of the optical system due to deformation of the optical element, when the optical element is provided in the optical system.

Abstract: A three-dimensional structure forming method that forms a three-dimensional structure made of a photosensitive material on a substrate includes the steps of determining a film thickness of the photosensitive material necessary to form the desired three-dimensional structure, comparing a predetermined maximum film thickness with the film thickness determined by the determining step, and applying, when the film thickness determined by the determining step is greater than the predetermined maximum film thickness, the photosensitive material within the maximum film thickness plural times until the photosensitive material has the film thickness on the substrate.

Abstract: An X-ray mask has a mask pattern, a protection means for forming a dust-proof space for protecting the mask pattern, and an inner atmospheric pressure adjustment hole for ventilating between the dust-proof space and the outer atmosphere. The X-ray mask can be either a transmission type mask in which the mask pattern is formed on a membrane, or a reflection type mask in which a multilayered film reflection layer and the mask pattern are formed on a substrate.

Abstract: An exposure method for transferring a pattern of a mask onto a member to be exposed. The method includes the steps of making preparations for exposure while a protection cover is attached to the mask, executing alignment between the member to be exposed and the mask while the protection cover is detached from the mask, and executing exposure with X-rays while the protection cover is detached from the mask.

Abstract: A reflection-type mask for use in exposing a pattern onto a photosensitive material, wherein the mask includes a reflection area, having a multilayer film, for reflecting exposure light, and a non-reflection area which does not reflect the exposure light, the reflection area and the non-reflection area forming a mask pattern, wherein at least one layer of the multilayer film consists of an impurity semiconducter, whereby bad influences, for example, caused by poor conduction of the multilayer film at mask-production stage, can be prevented.

Abstract: A device manufacturing method includes a first exposure step for executing a multiple exposure of a first layer of a substrate by use of plural first masks, a development step for developing the first layer of the substrate and a second exposure step, executed after the development step, for executing a multiple exposure of a second layer of the substrate by use of plural second masks. A portion of at least one of the first masks has a pattern the same as a pattern formed in a portion of at least one of the second masks.

Abstract: The present invention provides a method for manufacturing an optical element to be used for an optical system and an optical instrument using the optical system, and a method for manufacturing a device using the optical instrument, wherein the optical element is manufactured by the steps including the steps for processing a high purity silica glass by lithography, and the hydrogen molecule content is adjusted after manufacturing the optical element.

Abstract: An X-ray mask structure for use in X-ray lithography includes an X-ray transmission film to be disposed opposed to a workpiece in X-ray exposure, the X-ray transmission film having an X-ray absorptive material corresponding to a pattern to be printed on the workpiece, and a thin film covering at least a portion of the X-ray transmission film, the thin film having an anti-reflection function with respect to alignment light to be projected to the thin film for direct or indirect detection of relative positional deviation between the mask structure and the workpiece.

Abstract: A device manufacturing method includes a first step for executing a multiple exposure to a first layer on a substrate, by use of a plurality of first masks, and a second step, to be executed after the first step, for executing a multiple exposure to a second layer on the substrate, by use of a plurality of second masks, wherein one of the second masks has a pattern portion of the same design rule as that of one of the first masks.

Abstract: An optical system includes a diffractive optical element having a diffractive optical surface, and a device for preventing a change in optical performance of the optical system due to deformation of the diffractive optical element produced when the diffractive optical element is provided in the optical system.

Abstract: A mask manufacturing method includes performing a multiple exposure process to a substrate so that a number of latent images are formed on the substrate, and processing the exposed substrate to produce actual mask patterns, wherein the multiple exposure process includes a first exposure step for forming a latent image of relatively-fine periodic patterns on the substrate by use of a first master mask having absorptive periodic patterns, and a second exposure step for forming a latent image of relatively-rough patterns on the substrate by use of a second master mask having absorptive patterns.