Patents by Inventor Kenichi Yoshida

Kenichi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141267
    Abstract: A light emitting diode (LED) module includes: an LED that emits an ultraviolet ray; an information holding apparatus; and a module-side connector electrically connected to the LED and the information holding apparatus.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Kenichi HORIUCHI, Kousuke HONDA, Nobuo HORIMOTO, Hiroki HIRAI, Taiki OSHIMOTO, Yuta SAKAI, Kaori YOSHIDA
  • Publication number: 20240141276
    Abstract: A light emitting diode (LED) module includes: an LED that emits an ultraviolet ray; a metallic cylindrical body in which the LED is accommodated; and a metallic coupling for fixing the metallic cylindrical body to a culture apparatus by being engaged with an engaged portion fixed to the culture apparatus, in which the metallic cylindrical body and the metallic coupling dissipate heat generated by the LED to the engaged portion.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Hiroki HIRAI, Nobuo HORIMOTO, Kenichi HORIUCHI, Kousuke HONDA, Taiki OSHIMOTO, Yuta SAKAI, Kaori YOSHIDA
  • Publication number: 20240141277
    Abstract: A culture apparatus includes a box and a light emitting diode (LED) module detachably attached to the box and configured to emit an ultraviolet ray inside the box.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Hiroki HIRAI, Nobuo HORIMOTO, Kenichi HORIUCHI, Kousuke HONDA, Taiki OSHIMOTO, Yuta SAKAI, Kaori YOSHIDA
  • Patent number: 11972907
    Abstract: A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t1<t2, t3<t4, t1<t3, and t4/t3<t2/t1, where t1 is the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; t2 is the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; t3 is the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and t4 is the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: April 30, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Tani, Kenichi Oshiumi, Kazutoyo Horio, Junichi Sato, Keiji Yoshida
  • Patent number: 11942278
    Abstract: Provided is a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, wherein the capacitance portion has an opening which extends in a lamination direction in which the plurality of electrode layers and the dielectric layer are laminated and through which one electrode layer of the plurality of electrode layers is exposed, the one electrode layer has an exposed portion exposed at a bottom surface of the opening, the exposed portion is in contact with a wiring layer connecting the one electrode layer and an electrode terminal, and a thickness of the exposed portion of the one electrode layer is smaller than a thickness of other portions of the one electrode layer and is 50% or more of the thickness of the other portions of the one electrode layer.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: March 26, 2024
    Assignee: TDK Corporation
    Inventors: Michihiro Kumagae, Kazuhiro Yoshikawa, Kenichi Yoshida, Junki Nakamoto, Norihiko Matsuzaka
  • Patent number: 11942665
    Abstract: A separator member for a fuel cell includes: a first resin layer including a resin; and a graphite layer that is layered on the first resin layer and substantially made of graphite. The layering amount of the graphite layer is 50 g/m2 or less, and the volume resistivity of the graphite is 3 m?·cm or less.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: March 26, 2024
    Assignee: ARISAWA MFG. CO., LTD.
    Inventors: Akira Yoshida, Kio Miyaji, Kenichi Watabe
  • Patent number: 11940347
    Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 26, 2024
    Assignees: DENSO CORPORATION, NAGANO KEIKI CO., LTD.
    Inventors: Hiroshi Kodama, Naoki Yoshida, Kaori Miyashita, Eiji Takeda, Nobuaki Yamada, Yoshihiro Tomomatsu, Yasushi Yanagisawa, Yusuke Midorikawa, Shirou Kamanaru, Kenichi Yokoyama, Inao Toyoda, Hisayuki Takeuchi, Naohisa Niimi, Masao Takahashi, Yasutake Ura, Kouji Asano, Yukihiro Kamada
  • Publication number: 20240042728
    Abstract: Provided are a polymeric article and a composite article capable of obtaining favorable texture with a high resilience by using thermoplastic elastomer. A composite article includes: a first member; and a second member having a plate-shaped portion and a plurality of protrusions protruding from the back surface of the plate-shaped portion and having protruding ends contacting the first member, and cushioning properties are imparted to the composite article by elastic deformation of the second member. The plate-shaped portion and the plurality of protrusions are integrally made of solid thermoplastic elastomer or slightly-foamed thermoplastic elastomer with an expansion ratio of 1.1 or less, the thermoplastic elastomer having an impact resilience modulus of 30 to 90% at 23° C. measured in accordance with JIS K6255, and a hysteresis loss rate measured at 23° C. by compressing and depressurizing the composite article at a speed of 60 mm/min is 28% or less.
    Type: Application
    Filed: December 2, 2021
    Publication date: February 8, 2024
    Inventors: Kenji ONUMA, Kenichi YOSHIDA
  • Publication number: 20230397338
    Abstract: An electronic component has: a conductor layer M1 formed on a substrate and including lower electrodes of a capacitor; a dielectric film covering the top and side surfaces of each of the lower electrodes; upper electrodes of the capacitor which are formed on the top surfaces of the respective lower electrodes through the dielectric film; and an adhesive film disposed between the dielectric film and the top and side surfaces of each of the lower electrodes. The adhesive film is thus disposed between the dielectric film and the top and side surfaces of each of the lower electrodes.
    Type: Application
    Filed: August 14, 2023
    Publication date: December 7, 2023
    Inventors: Atsuhiro TSUYOSHI, Takashi OHTSUKA, Kenichi YOSHIDA
  • Patent number: 11820159
    Abstract: A nail printing apparatus includes a print head to perform a printing operation in which an image on a nail of a person to be printed is printed by moving in a scanning direction and ejecting ink from a nozzle, and a control unit to control movement of the print head. In a case where movement of the print head is stopped regardless of controlling of movement of the print head associated with the printing operation, the control unit switches the controlling of movement of the print head after the stopping based on a stop position of the print head.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: November 21, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Daisuke Tobimatsu, Kenichi Yoshida
  • Publication number: 20230371175
    Abstract: To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 16, 2023
    Inventors: Yu FUKAE, Tomoya HANAI, Yusuke OBA, Kenichi YOSHIDA, Katsuharu YASUDA, Takashi OHTSUKA
  • Patent number: 11794442
    Abstract: A superposition interior component includes a base, an outer layer member, which covers the base, and a middle member, which is made of a soft plastic and disposed between the base and the outer layer member. The superposition interior component is formed by stacking the base, the middle member, and the outer layer member together. The middle member includes a plate-shaped body, first protrusions, and second protrusions. The first protrusions protrude from a first surface of the body, which faces the base. The second protrusions protrude from a second surface of the body, which faces the outer layer member.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: October 24, 2023
    Assignee: TOYODA IRON WORKS CO., LTD.
    Inventors: Kenichi Yoshida, Osamu Miyashita, Hideaki Sakai, Masamori Hirose, Kenji Onuma
  • Publication number: 20230335579
    Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member provided on the upper surface of the metal foil to surround the first and second electrode layers. The metal foil has an outer peripheral area which is positioned outside an area surrounded by the insulating member and which is not covered with the first and second electrode layers. A height of the electrode layer is equal to or higher than a height of the insulating member. This makes the outer peripheral portion of the thin film capacitor have a step-like shape.
    Type: Application
    Filed: December 24, 2020
    Publication date: October 19, 2023
    Inventors: Daiki ISHII, Yoshihiko YANO, Yuki YAMASHITA, Kenichi YOSHIDA, Tetsuhiro TAKAHASHI
  • Patent number: 11776947
    Abstract: Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: October 3, 2023
    Assignee: TDK CORPORATION
    Inventors: Yusuke Oba, Kenichi Yoshida, Takashi Ohtsuka, Yuichiro Okuyama, Tomoya Hanai, Yu Fukae
  • Publication number: 20230268125
    Abstract: To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.
    Type: Application
    Filed: December 24, 2020
    Publication date: August 24, 2023
    Inventors: Daiki ISHII, Yoshihiko YANO, Yuki YAMASHITA, Kenichi YOSHIDA, Tetsuhiro TAKAHASHI
  • Publication number: 20230268120
    Abstract: A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.
    Type: Application
    Filed: December 24, 2020
    Publication date: August 24, 2023
    Inventors: Daiki ISHII, Yoshihiko YANO, Yuki YAMASHITA, Kenichi YOSHIDA, Tetsuhiro TAKAHASHI
  • Publication number: 20230268133
    Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.
    Type: Application
    Filed: December 24, 2020
    Publication date: August 24, 2023
    Inventors: Daiki ISHII, Yoshihiko YANO, Kenichi YOSHIDA, Tetsuhiro TAKAHASHI, Yuki YAMASHITA
  • Publication number: 20230260697
    Abstract: To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same plane. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the metal foil is surface-roughened, a larger capacitance can be obtained.
    Type: Application
    Filed: December 24, 2020
    Publication date: August 17, 2023
    Inventors: Yuki YAMASHITA, Kenichi YOSHIDA, Yoshihiko YANO, Daiki ISHII
  • Publication number: 20230260713
    Abstract: To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle ?a formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.
    Type: Application
    Filed: December 24, 2020
    Publication date: August 17, 2023
    Inventors: Daiki ISHII, Yoshihiko YANO, Yuki YAMASHITA, Kenichi YOSHIDA, Tetsuhiro TAKAHASHI
  • Publication number: 20230260698
    Abstract: To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The particle diameter of crystal at a non-roughened center part of the metal foil is less than 15 ?m in the planar direction and less than 5 ?m in the thickness direction. This can not only enhance the flexibility of the metal foil to reduce a short-circuit failure in a state where the thin film capacitor is incorporated in a multilayer substrate but also enhance positional accuracy.
    Type: Application
    Filed: December 24, 2020
    Publication date: August 17, 2023
    Inventors: Daiki ISHII, Yoshihiko YANO, Yuki YAMASHITA, Kenichi YOSHIDA, Tetsuhiro TAKAHASHI