Abstract: A semiconductor device has a first electrode 61; a second electrode 62; and a semiconductor layer 1 having a winding wire part 10 provided so as to surround a current flowing between the first electrode 61 and the second electrode 62, a winding return wire part, which is provided so as to surround the current, is connected to a terminal end part of the winding wire part 10 and returns toward a starting end part side from the terminal end part, and an integration circuit configuration part connected to the winding wire part 10 or the winding return wire part. The integration circuit configuration part has one or more of a resistance part 115, a capacitor part 125 and an operational amplifier part 135.

Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.

Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.

Abstract: In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.

Abstract: An object of one embodiment of the present disclosure is to provide a product with a high added value to a user by preventing an unnatural character string from being combined, combination of no character string, and the like in a case where there is no voice or almost no voice before or after an image selected from within a moving image. One embodiment of the present disclosure is an image processing apparatus including: a selection unit configured to select, from a moving image including a plurality of frames, a part of the moving image; an extraction unit configured to extract a voice during a predetermined time corresponding to the selected part in the moving image; and a combination unit configured to combine a character string based on a voice extracted by the extraction unit, with the part of the moving image selected by the selection unit.

Abstract: An object of one embodiment of the present disclosure is to provide a product with a high added value to a user by preventing an erroneous character string from being combined in a case where a voice before and after an image selected from within a moving image is a mixed voice. One embodiment of the present disclosure is an image processing apparatus including: a selection unit configured to select, from a moving image including a plurality of frames, a part of the moving image; an extraction unit configured to extract a voice during a predetermined time corresponding to the selected part in the moving image; and a combination unit configured to combine a character string based on a voice extracted by the extraction unit, with the part of the moving image selected by the selection unit or a frame among frames corresponding to the part.

Abstract: An electronic component mounting package includes a semiconductor element which is disposed such that an active surface faces a main surface of a wiring portion, and which is electrically connected to the wiring portion via a first terminal; and a thin film passive element which is disposed between the active surface of the semiconductor element and the main surface of the wiring portion when seen in a lamination direction, and which is electrically connected to the semiconductor element. A part of the first terminal is disposed on an outer side with respect to the thin film passive element in a plan view. A length of the first terminal in the lamination direction disposed on the outer side with respect to the thin film passive element is larger than a thickness of the thin film passive element in the lamination direction.

Abstract: In a system, mobile terminal and a reader are communicable with each other. In the mobile terminal, a terminal tilt state is detected by a detecting unit as a terminal environmental state, an information code is generated such that the detected terminal environmental state and predetermined information are recorded in the information code, and the generated information code is displayed on the screen of a display unit. In the reader, a reading surface tilt state corresponding to the terminal environmental state is detected by a detecting unit as a reading surface environmental state. When the reader reads the information code and the detected reading surface environmental state and the detected terminal environmental state show the same environmental state, the read predetermined information is used by a control unit to perform processing based on the predetermined information.

Abstract: A semiconductor component 150 has a semiconductor layer 1 including a winding wire part 10 and a winding return wire part 50 connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side, wherein the semiconductor component is disposed so as to surround an object to be measured.

Abstract: A semiconductor device 100 has a first electrode 61; a second electrode 62; and a semiconductor layer 1 including a first winding wire part 10 provided so as to surround a current flowing between the first electrode 61 and the second electrode 62, and a second winding wire part 50 connected to a terminal end part of the first winding wire part 10 and returning from the terminal end part toward a starting end part side of the first winding wire part 10.

Abstract: A detection substrate 150 has a body film 1a having a through hole 91; a winding wire part 10 provided on a surface of one side of the body film 1a, on a surface of another side of the body film 1a and in the through hole 91, and disposed so as to surround a current to be detected; and a winding return wire part 50, provided on the body film 1a, connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side.

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.

Abstract: A laminated composite interior part includes a first member made of synthetic resin and having a mating surface; and a second member made of elastically deformable synthetic resin and having a plate portion substantially parallel to the mating surface. The plate portion has integrally-formed and interspersed protrusions protruding toward the mating surface. The second member is placed on the first member with distal end portions of the protrusions being in contact with the mating surface. Cushioning properties are provided by elastic deformation of the protrusions, caused as the protrusions' distal end portions are relatively pressed against the mating surface. Flexural rigidity of each of the protrusions against a compressive load is anisotropic about its axis, so that the protrusion is flexurally deformed in one direction about its axis with the distal end portion thereof sliding on the mating surface. Surface roughness of the mating surface is less than 0.20.

Abstract: A device for analyzing a worker's work state, the analysis involving generation of determination data for determining whether worker's manual work is performed in a predetermined work order. This device includes imaging and setting units. The imaging unit images, a work video, a worker's manual working state in which the worker repeatedly performs predetermined work. This predetermined work is performed by repeating a plurality of fundamental work operations by hand. Based on a predetermined motion which is previously set for each of the fundamental work operations, the setting unit sets delimitation information to delimit the work video every fundamental work operation at a timing when the predetermined motion is detected. In the device, a generation unit generates determination data which includes both the imaged work video and the set delimitation information. Based on the determination data, the worker's manual work can be analyzed in various ways.

Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

Abstract: Disclosed herein is a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer positioned between the lower electrode layer and the upper electrode layer. The upper electrode layer has a first capacitive electrode part opposed to the lower electrode layer through the dielectric layer without being connected to the lower electrode layer and a fiducial mark part penetrating the dielectric layer to be connected to the lower electrode layer.

Abstract: A management system includes: an information terminal that reads an information code attached to a management target, the information code storing code identification information that specifies the management target; and a server communicable with the information terminal. The information terminal includes: a reading portion that optically reads display information including the information code; a position information acquisition portion that acquires position information of the information terminal; a terminal-side transmission portion that transmits the position information as reading position information to the server; and a notification portion that notifies predetermined information.

Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film, a first metal film formed on one surface of the capacitive insulating film, and a second metal film formed on other surface of the capacitive insulating film and made of a metal material different from that of the first metal film. The thin film capacitor has an opening penetrating the capacitive insulating film, first metal film, and second metal film. The second metal film is thicker than the first metal film. A first size of a part of the opening that penetrates the first metal film is larger than a second size of a part of the opening that penetrates the second metal film.

Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.

Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.