Patents by Inventor Kenichi Yoshida

Kenichi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9224706
    Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: December 29, 2015
    Assignee: TDK CORPORATION
    Inventors: Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe
  • Publication number: 20150355050
    Abstract: A building safety verification system and a building safety verification method for estimating a degree of damage of a building after an earthquake occurs are provided. The building safety verification system includes: an inter-story displacement measurement unit which obtains, from measurement data of acceleration sensors which measure accelerations of a plurality of stories in a building, an inter-story displacement of each of the stories; a natural period measurement unit which obtains a natural period of microtremor of the building from measurement data of a micro vibration sensor which measures micro vibration of a highest story of the building or a story near the highest story; and a building safety evaluation unit which evaluates soundness of the building from the inter-story displacement obtained by the inter-story displacement measurement unit and the natural period obtained by the natural period measurement unit.
    Type: Application
    Filed: January 8, 2014
    Publication date: December 10, 2015
    Applicant: NTT FACILITIES, INC.
    Inventors: Kenichi YOSHIDA, Shigeto NAGASHIMA, Toshiya MOTOHI, Kouzou TOYOTA, Yoshifumi SUGIMURA, Wataru GOTO, Maki MOCHIDUKI, Hiroyasu NISHII
  • Publication number: 20150349452
    Abstract: A receptacle is provided to connect modular electronic instruments to each other. A box-shaped case has a front face having an opening for inserting a single modular electronic instrument into the box-shaped case. A first connector is disposed inside the box-shaped case to connect the single modular electronic instrument to the receptacle. A second connector is disposed on a first side face of the receptacle for connecting the receptacle to a first receptacle on the side of the first side face. A third connector is disposed on a second side face of the receptacle for connecting the receptacle to a second receptacle on the side of the second side face. A lock secures the connection with one of the first and second receptacles. A leg is disposed on the bottom face. The position of the leg is deviated only to one of the first or second side faces.
    Type: Application
    Filed: February 10, 2015
    Publication date: December 3, 2015
    Inventors: Kenichi YOSHIDA, Hiroshi AKAISHI
  • Patent number: 9177687
    Abstract: A coating for a conductor, the coating having a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more, which means 65% or more of the crystal planes of the palladium layer are aligned to this crystal plane. Preferably the crystal plane whose orientation rate is 65% or more in the coating is the (111) plane or (200) plane.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: November 3, 2015
    Assignee: TDK CORPORATION
    Inventors: Kenichi Yoshida, Yuhei Horikawa, Makoto Orikasa, Hideyuki Seike
  • Patent number: 9171668
    Abstract: A magnet member excellent in both corrosion resistance and adhesion is provided. The magnet member 30 in accordance with the present invention is a magnet member comprising a magnet base body 32 including a rare-earth magnet and a plating film 34 containing Ni and covering the magnet base body 32, while the plating film 34 has a sulfur content lower in a marginal part 38 in a surface S of the magnet base body having an easy magnetization direction M of the magnet base body 32 as a perpendicular thereto than in a center part 36 of the surface S.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: October 27, 2015
    Assignee: TDK CORPORATION
    Inventor: Kenichi Yoshida
  • Patent number: 9070606
    Abstract: The present invention relates to a terminal structure comprising: a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, a height Hbm at which the bump has a maximum diameter (Lbm) is lower than a maximum height Hu of the under-bump metal layer.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: June 30, 2015
    Assignee: TDK CORPORATION
    Inventors: Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe
  • Publication number: 20150156992
    Abstract: A method for producing poultry for raising poultry with high production score is provided. In a method for producing poultry in a poultry house, a feeding area for feeding the poultry is illuminated with blue light in an early raising period of a poultry raising period. In the early raising period, behavior of chicks can be restricted by illuminating the feeding area with blue light. Accordingly, sudden death of chick or metabolic disorder due to excessive and abrupt behavior of chick can be prevented, and thus chicks not having injury or diseases such as metabolic disorder can be raised, and physical conditions of the grown poultry can be improved.
    Type: Application
    Filed: February 4, 2014
    Publication date: June 11, 2015
    Inventors: Takeshi Kasahara, Masaaki Shimizu, Tatsuji Matsunaga, Tokuo Kume, Takahiro Wada, Kenichi Yoshida, Masayuki Okamoto, Chikamitsu Ohshima, Shigeki Doi
  • Patent number: 9028981
    Abstract: A metal magnet 10 including a magnet body 12 and a coating layer 14 over the magnet body 12, in which the coating layer 14 has a Martens hardness of 2000 N/mm2 or more and an elastic resilience of 25% or less, and a motor including the metal magnet 10.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: May 12, 2015
    Assignee: TDK Corporation
    Inventors: Kenichi Yoshida, Jun Hagiwara
  • Patent number: 8976076
    Abstract: A high-frequency transmission line having low alternate current (AC) resistance is provided. One aspect of the present invention is a high-frequency transmission line disposed along a surface of an insulating support, wherein, letting F [Hz] be the frequency of an AC electric signal transmitted by the high-frequency transmission line and Ms [Wb/m] be the saturation magnetization per unit area, the frequency value F and the saturation magnification value per unit area Ms satisfy the following expression (1): Ms?(1.5×102)/F+5.7×10?8??(1).
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: March 10, 2015
    Assignee: TDK Corporation
    Inventors: Kenichi Yoshida, Yuhei Horikawa
  • Patent number: 8970037
    Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: March 3, 2015
    Assignee: TDK Corporation
    Inventors: Kenichi Yoshida, Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe
  • Patent number: 8962619
    Abstract: The present invention relates to substituted imidazopyridinyl-aminopyridine compounds and methods of synthesizing these compounds. The present invention also relates to pharmaceutical compositions containing substituted imidazopyridinyl-aminopyridine compounds and methods of treating cell proliferative disorders, such as cancer, by administering these compounds and pharmaceutical compositions to subjects in need thereof.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: February 24, 2015
    Assignee: ArQule, Inc.
    Inventors: Mark A. Ashwell, Chris Brassard, Anton Filikov, Jason Hill, Steffi Koerner, Jean-Marc Lapierre, Yanbin Liu, Nivedita Namdev, Robert Nicewonger, Rocio Palma, Manish Tandon, David Vensel, Akihisa Matsuda, Shin Iimura, Kenichi Yoshida, Takanori Yamazaki, Takahiro Kitamura, Takeshi Isoyama
  • Patent number: 8962287
    Abstract: An object of the present invention is to provide a cell capable of efficiently producing scyllo-inositol from myo-inositol and a simple method of manufacturing scyllo-inositol using the cell. The above-mentioned object is achieved by a Bacillus subtilis cell, in which a function of a protein having a scyllo-inositol dehydrogenase activity is lost, and the manufacture of scyllo-inositol using the cell, based on a novel finding that the protein having a scyllo-inositol dehydrogenase activity and a protein having a 2-keto-myo-inositol ketoreductase function are present in Bacillus subtilis.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: February 24, 2015
    Assignee: National University Corporation KOBE University
    Inventors: Kenichi Yoshida, Hitoshi Ashida
  • Patent number: 8933336
    Abstract: A coating having a layered structure including a palladium layer is provided to a conductor. The highly stable palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass. An electronic component may include the conductor coated with the coating. The conductor coated with the coating has superior corrosion resistance and superior reliability in electrical connection with external apparatuses.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: January 13, 2015
    Assignee: TDK Corporation
    Inventors: Kenichi Yoshida, Yuhei Horikawa, Makoto Orikasa, Hideyuki Seike
  • Publication number: 20140303020
    Abstract: [Problem] To provide a method for assessing myelodysplastic syndrome or myeloid tumor predisposition, on the basis of a genetic diagnosis using massively parallel sequencing technology, as well as a peptide and antibody therefor, and a method for screening for candidate therapeutic drugs or prophylactic drugs for myelodysplastic syndrome or myeloid tumor. [Solution] A method for assessing whether or not there is a predisposition for the occurrence of myelodysplastic syndrome or myeloid tumor, wherein the method comprises a step for using a sample that includes a subject's human genes and detecting a mutation in at least one gene from among the U2AF35 gene, the ZRSR2 gene, the SFRS2 gene, or the SF3B1 gene.
    Type: Application
    Filed: August 2, 2012
    Publication date: October 9, 2014
    Applicant: The University of Tokyo
    Inventors: Seishi Ogawa, Masashi Sanada, Kenichi Yoshida
  • Publication number: 20140291021
    Abstract: A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase.
    Type: Application
    Filed: March 19, 2014
    Publication date: October 2, 2014
    Applicant: TDK CORPORATION
    Inventors: Kenichi YOSHIDA, Yuhei HORIKAWA, Hisayuki ABE
  • Patent number: 8816213
    Abstract: The present invention relates to a terminal structure and an electronic device having the terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; and a third layer containing a first intermetallic compound of an Ni—Cu—Sn type, laid on the second layer; and a solder layer on the third layer of the terminal. A second intermetallic compound of an Ni—P—Sn type partly covers a surface of the second layer on the third layer side and a maximum thickness of the second intermetallic compound in a lamination direction is from 0.05 to 0.7 ?m.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: August 26, 2014
    Assignee: TDK Corporation
    Inventors: Yuhei Horikawa, Kenichi Yoshida, Atsushi Sato
  • Patent number: 8787028
    Abstract: The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: July 22, 2014
    Assignee: TDK Corporation
    Inventors: Yuhei Horikawa, Shin Fujita, Kenichi Yoshida, Hisayuki Abe, Makoto Orikasa, Hideyuki Seike
  • Publication number: 20140142096
    Abstract: A quinolone synthetic antibacterial agent having excellent properties as a medicine is provided, which has strong antibacterial activity not only to Gram-negative bacteria but also to Gram-positive cocci that have low sensitivity to quinolone antibacterial agents, and which exhibits high safety and excellent pharmacokinetics. A compound represented by the formula (I) or a salt thereof, or a hydrate thereof. Specifically, a quinolone derivative of the formula (I) wherein substituents R6 and R7 taken together with the carbon atoms to which they are bonded form a cyclic structure which may contain an oxygen atom as a ring constituent atom, the cyclic structure forming a 5-4, 5-5, or 5-6 fused bicyclic pyrrolidinyl substituent, the substituent being bonded to a quinolone mother skeleton Q containing a pyridobenzoxazine structure.
    Type: Application
    Filed: November 19, 2013
    Publication date: May 22, 2014
    Applicant: Daiichi Sankyo Company, Limited
    Inventors: Hisashi Takahashi, Satoshi Komoriya, Takahiro Kitamura, Takashi Odagiri, Hiroaki Inagaki, Toshifumi Tsuda, Kiyoshi Nakayama, Makoto Takemura, Kenichi Yoshida, Rie Miyauchi, Masatoshi Nagamochi
  • Patent number: 8692127
    Abstract: The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: April 8, 2014
    Assignee: TDK Corporation
    Inventors: Yuhei Horikawa, Kenichi Yoshida, Atsushi Sato
  • Patent number: D745526
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: December 15, 2015
    Assignee: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Naoto Takano, Noriaki Senba, Kenichi Yoshida