Patents by Inventor Kenichi Sasaki
Kenichi Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140300800Abstract: Provided is an imaging apparatus that acquires an object distance to an object and focus position information for each of a plurality of divided areas of an imaging screen corresponding to an imaging area. The imaging apparatus acquires data of the amount of field curvature corresponding to the imaging distance and removes a field curvature component from the object distance and the defocus amount so as to determine a plurality of objects which is equi-spaced from the imaging apparatus and faces the imaging apparatus. When the plurality of objects is equi-spaced from the imaging apparatus and is arrayed so as to face the imaging apparatus, a focused position at which an error in the defocus amount on the entire imaging screen is minimized is calculated. If otherwise, a focusing reference area is selected and then a preferential focusing operation is performed for an object corresponding to the area.Type: ApplicationFiled: March 27, 2014Publication date: October 9, 2014Applicant: CANON KABUSHIKI KAISHAInventor: Kenichi Sasaki
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Publication number: 20140266031Abstract: A wireless power supply system according to an embodiment includes a power transmitting unit that transmits electric power. The wireless power supply system includes a power receiving unit that receives the electric power output from the power transmitting unit. Even if one of a plurality of power transmitting coils stops transmitting electric power, the wireless power supply system can increase the electric power transmitted by the other power transmitting coils.Type: ApplicationFiled: September 9, 2013Publication date: September 18, 2014Applicant: KABUSHIKI KAISHA TOSHIBAInventor: Kenichi Sasaki
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Patent number: 8770003Abstract: Seamless pipes are produced by using billets for which the length L of a parent billet, the lengths l of child billets and the number nB of the obtainable child billets are determined on the basis of predetermined tolerances and the conditions of a billet-heating furnace and billet-rolling facilities. In this way, energy saving in the production of seamless pipes can be realized and the productivity in the production of seamless pipes can also be improved.Type: GrantFiled: September 16, 2010Date of Patent: July 8, 2014Assignee: Sumitomo Metal Industries, Ltd.Inventor: Kenichi Sasaki
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Publication number: 20140187000Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.Type: ApplicationFiled: January 16, 2014Publication date: July 3, 2014Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventors: Kenichi Sasaki, Norio Fukasawa
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Patent number: 8664775Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.Type: GrantFiled: July 19, 2012Date of Patent: March 4, 2014Assignee: Fujitsu Semiconductor LimitedInventors: Kenichi Sasaki, Norio Fukasawa
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Patent number: 8648564Abstract: According to an embodiment, a power transmitting device includes a power supply unit, a power transmitting coil, a first switch, a piezoelectric element, and a first switch controller. The power supply unit is configured to generate a transmission power by using power supplied to a power input terminal. Once the first switch is turned on, the first switch electrically connects an external power supply and the power input terminal until the first switch is turned off next time. The piezoelectric element is disposed at a position at which a weight of a placed power receiving device can be detected. The piezoelectric element is configured to generate a detection power according to the weight of the placed power receiving device. The first switch controller is configured to generate a starting power by the detection power and switches the first switch to on by using the starting power.Type: GrantFiled: September 10, 2012Date of Patent: February 11, 2014Assignee: Kabushiki Kaisha ToshibaInventor: Kenichi Sasaki
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Publication number: 20130313910Abstract: According to an embodiment, a power transmitting device includes a power supply unit, a power transmitting coil, a first switch, a piezoelectric element, and a first switch controller. The power supply unit is configured to generate a transmission power by using power supplied to a power input terminal. Once the first switch is turned on, the first switch electrically connects an external power supply and the power input terminal until the first switch is turned off next time. The piezoelectric element is disposed at a position at which a weight of a placed power receiving device can be detected. The piezoelectric element is configured to generate a detection power according to the weight of the placed power receiving device. The first switch controller is configured to generate a starting power by the detection power and switches the first switch to on by using the starting power.Type: ApplicationFiled: September 10, 2012Publication date: November 28, 2013Applicant: Kabushiki Kaisha ToshibaInventor: Kenichi SASAKI
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Publication number: 20130308018Abstract: An image processing apparatus includes an acquisition unit configured to divide an image into a plurality of areas and to acquire an object distance and a defocus amount in each area, and a processing unit configured to obtain, for each area, a correction amount corresponding to the object distance and the defocus amount and to perform correction processing for correcting lateral chromatic aberration based on the correction amount.Type: ApplicationFiled: May 13, 2013Publication date: November 21, 2013Applicant: CANON KABUSHIKI KAISHAInventor: Kenichi Sasaki
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Publication number: 20130304793Abstract: A computing unit computes a computed value for input data. A comparing unit compares the computed value of the computing unit with a computed value of another node which is included in an input/output set. An output unit outputs the computed value as output data of a node itself when the result of the comparison by the comparing unit shows that the computed value matches either one of computed values. When the computed value does not match any one of the computed values of other nodes, a transferring unit adds the computed value of the node itself to the input/output set, and transfers the input/output set to another node.Type: ApplicationFiled: December 7, 2011Publication date: November 14, 2013Applicant: Mitsubishi Electric CorporationInventor: Kenichi Sasaki
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Publication number: 20130270665Abstract: In an image sensor in which each microlens of a microlens array is disposed at a position corresponding to each pixel on a side to which light flux is incident, a layer formed of a member different from a member constituting the microlens array is disposed on the side of the microlens array to which light flux is incident, and a surface of the layer formed of the different member has a phase structure optically -opposite to that of the microlens array.Type: ApplicationFiled: April 16, 2013Publication date: October 17, 2013Applicant: CANON KABUSHIKI KAISHAInventor: Kenichi Sasaki
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Publication number: 20130115444Abstract: A semi-organic insulation coating includes an inorganic component and an organic resin, a Zr compound and an Si compound contains a plate-like silica as an inorganic component and are included in a ratio in a dry coating of 20 to 70 mass % of Zr compound (converted to ZrO2) and 10 to 50 mass % of Si compound containing plate-like silica (converted to SiO2), and the remainder is substantially an organic resin, whereby a magnetic steel sheet with a semi-organic insulation coating has no deterioration of corrosion resistance and water resistance without containing a chromium compound and being excellent in powdering resistance, scratch resistance, sticking resistance, TIG weldability, punchability and coating appearance.Type: ApplicationFiled: July 21, 2011Publication date: May 9, 2013Applicant: JFE STEEL CORPORATIONInventors: Kazumichi Sashi, Hiroyuki Ogata, Chiyoko Tada, Nobuko Nakagawa, Nobue Fujibayashi, Tomofumi Shigekuni, Kenichi Sasaki
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Publication number: 20130032942Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.Type: ApplicationFiled: July 19, 2012Publication date: February 7, 2013Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventors: Kenichi Sasaki, Norio Fukasawa
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Patent number: 8358422Abstract: The invention provides a robot including a connection member relatively displaceably connected, and configured to control the displacement of the connection member based on a reference posture that can be adjusted, the robot including: a light emitting unit to emit a laser beam in a predetermined direction; a light receiving unit to receive the laser beam when the connection member is located in a detection posture that is away, by a preset displacement amount, from a predetermined zero posture; and a zeroing unit to relatively displace the connection member so as to make the light receiving unit receive the laser beam, and then to adjust the reference posture to the zero posture based on the posture of the connection member when the laser beam is received as well as on a relationship between the zero posture and the detection posture.Type: GrantFiled: March 8, 2010Date of Patent: January 22, 2013Assignee: Kawasaki Jukogyo Kabushiki KaishaInventors: Takeshi Shibata, Kenichi Sasaki
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Publication number: 20120301744Abstract: An electrical steel sheet is provided with an insulating coating which has inorganic with some organic materials, the insulating coating including inorganic components and an organic resin, the insulating coating contains, as the inorganic components, a Zr compound, a B compound, and a Si compound, specifically, when expressed as percentages in the dry coating, 20% to 70% by mass of the Zr compound (in terms of ZrO2), 0.1% to 5% by mass of the B compound (in terms of B2O3), and 10% to 50% by mass of the Si compound (in terms of SiO2), and the balance containing the organic resin.Type: ApplicationFiled: November 5, 2010Publication date: November 29, 2012Applicant: JFE Steel CorporationInventors: Kazumichi Sashi, Hiroyuki Ogata, Chiyoko Tada, Nobuko Nakagawa, Nobue Fujibayashi, Tomofumi Shigekuni, Kenichi Sasaki
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Publication number: 20120274327Abstract: A magnetic shielding material which can decrease the thickness by having excellent conductivity even at low temperatures of, for example, 77 K or lower, in a strong magnetic field of a magnetic flux density of 1 T or more is provide. A magnetic shielding material to be used at low temperatures of 77 K or lower in the magnetic field of a magnetic flux density of 1 T or more, comprises aluminum having a purity of 99.999% by mass or more.Type: ApplicationFiled: April 27, 2012Publication date: November 1, 2012Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED, INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION HIGH ENERGY ACCELERATION RESEARCH ORGANIZATIONInventors: Takayuki TOMARU, Kenichi SASAKI, Hiroaki HOSHIKAWA, Hiroshi TABUCHI
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Publication number: 20120275948Abstract: A wiring material which is easy to handle and also exhibits excellent conductivity even in a strong magnetic field of, for example, a magnetic flux density of 1 T or more is provided. A wiring material to be used in the magnetic field of a magnetic flux density of 1 T or more comprises aluminum having a purity of 99.999% by mass or more.Type: ApplicationFiled: April 27, 2012Publication date: November 1, 2012Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED, INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATIONInventors: Takayuki TOMARU, Kenichi SASAKI, Hiroaki HOSHIKAWA, Hiroshi TABUCHI
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Publication number: 20120273181Abstract: A thermal conductor material having excellent heat transfer properties by obtaining high thermal conductivity even at low temperature of, for example, a liquid nitrogen temperature (77 K) or lower is to provide. A thermal conductor to be used at low temperature of 77 K or lower in the magnetic field of a magnetic flux density of 1 T or more, includes aluminum which has a purity of 99.999% by mass or more and also has the content of iron of 1 ppm by mass or less.Type: ApplicationFiled: April 27, 2012Publication date: November 1, 2012Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED, INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATIONInventors: Takayuki TOMARU, Kenichi SASAKI, Hiroaki HOSHIKAWA, Hiroshi TABUCHI
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Patent number: 8288325Abstract: The present invention provides a lubricant composition for hot forming which makes it possible to provide lubricity at 80° C. or more without being peeled or washed by the roll cooling water, and which is easily washed under 40° C. without having water resistance. The lubricant composition for hot forming of the present invention comprises: a solid lubricant from 10 to 40% by mass; water-dispersible synthetic resin from 5 to 20% by mass; inorganic acid amine salt from 0.5 to 5% by mass; and water from 45 to 80% by mass.Type: GrantFiled: September 9, 2010Date of Patent: October 16, 2012Assignee: Sumitomo Metal Industries, Ltd.Inventors: Kenichi Sasaki, Sumio Iida, Shizuo Mori, Kazuo Tanaka
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Patent number: 8223295Abstract: A liquid-crystal display that can inhibit the coloring of an image when a liquid-crystal panel is viewed from an oblique direction is provided. An optical filter is disposed at the forward end of a liquid-crystal panel and has different transmittances between a light component that travels in an oblique direction and a light component that travels in a direction normal to the multilayer, where both of the light components have a predetermined wavelength range. In the case where a wide-color-gamut light source, such as LEDs, is used as a light sources of a backlight unit, when the liquid-crystal panel is viewed from an oblique direction, the entire image area tends to be reddish, and the color temperature tends to decrease. In this case, the optical filter is configured such that the intensity of a visible red light component is selectively reduced such that the intensity of a visible blue light component is increased, thereby inhibiting the reddening of an image area when viewed from an oblique direction.Type: GrantFiled: May 23, 2006Date of Patent: July 17, 2012Assignee: Sony CorporationInventors: Satoshi Sato, Satoshi Kawamura, Masaharu Senoue, Norimasa Furukawa, Kenichi Sasaki
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Publication number: 20120092493Abstract: In order to provide a monitoring system for performing monitoring efficiently using a small number of cameras in accordance with a crowded degree in a target region, a monitoring system, comprising: a movable monitoring camera; and a controlling unit for controlling the monitoring camera, wherein the controlling unit detects a target object in a target region, calculates a crowded degree of the target objects in the target region, moves the monitoring camera to a position of the target object so as to monitor the target object if the crowded degree is small, and makes the monitoring camera round so as to monitor the target objects if the crowded degree is large is provided.Type: ApplicationFiled: August 19, 2011Publication date: April 19, 2012Inventors: Syouta Tsutsui, Tohru Kajiyama, Hiroaki Arima, Kenichi Sasaki, Mitsunobu Sugimoto, Masaki Kawamata