Patents by Inventor Kenji Furuta

Kenji Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10525668
    Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 7, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Yoshio Terada, Tadashi Takahashi, Mitsuhiro Kanada
  • Publication number: 20190389008
    Abstract: A laser beam applying unit of a laser processing apparatus for processing a wafer includes a laser oscillator for emitting a pulsed laser beam having a wavelength transmittable through the wafer, a beam condenser for converging the pulsed laser beam emitted from the laser oscillator onto the wafer held on a chuck table, a beam splitter assembly disposed between the laser oscillator and the beam condenser, for splitting the pulsed laser beam emitted from the laser oscillator to form at least two converged spots on the wafer that are spaced from each other in X-axis directions, and a mask assembly disposed between the laser oscillator and the beam condenser, for reducing the width of the converged spots on the wafer in Y-axis directions to keep the converged spots on the wafer within the width of the projected dicing lines on the wafer.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 26, 2019
    Inventor: Kenji FURUTA
  • Patent number: 10501643
    Abstract: Provided are an aerosol coating composition excellent in a matte effect and capable of preventing co-rotation from occurring. The aerosol coating composition contains a modified alkyd resin, inorganic microparticles and an organic solvent. Herein, the modified alkyd resin is a non-aqueous dispersion resin which is a copolymer of a vinyl based monomer and an alkyd resin. The inorganic microparticles are made of one selected from silica, titanium oxide, zinc oxide, alumina, calcium carbonate, talc and clay or the like. The inorganic microparticles have a mean particle diameter of 1.0 to 10.0 ?m, and a content of 0.1 to 5 mass %. There is also provided a metallic mechanical part coated with the aerosol coating composition.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: December 10, 2019
    Assignee: NHK SPRING CO., LTD.
    Inventors: Kenji Minami, Yasutaka Furuta, Yuki Ogami
  • Patent number: 10490450
    Abstract: An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: November 26, 2019
    Assignee: Disco Corporation
    Inventors: Sakae Matsuzaki, Noriko Ito, Ken Togashi, Kenji Furuta
  • Publication number: 20190284447
    Abstract: Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage SMD in its machine direction and a thermal shrinkage STD in its transverse direction (direction perpendicular to the machine direction) of both ?2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm2 or less when determined at 80° C. for 3 hours by GC/MS.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Inventors: Kenji FURUTA, Akira HIRAO, Tatsuya SUZUKI, Hiroki IEDA
  • Publication number: 20190284445
    Abstract: Provided is a PSA sheet that has a high level of moisture resistance while maintaining good holding power with reduced gas emission. The PSA sheet provided by this invention comprises a moisture-impermeable layer and a PSA layer provided to one face of the moisture-impermeable layer. The PSA layer comprises a polymer A having a weight average molecular weight of 5×104 or higher as a base polymer and a polymer B having a number average molecular weight of 1000 or higher and a weight average molecular weight lower than 5×104.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Inventors: Kenji FURUTA, Akira HIRAO, Tatsuya SUZUKI
  • Patent number: 10410901
    Abstract: An electrostatic chuck table includes a plate-shaped base portion capable of transmitting a laser beam to be applied to a workpiece and an electrostatic attraction electrode portion capable of transmitting the laser beam. The laser beam has a transmission wavelength to the workpiece. The base portion has a first surface and a second surface opposite to the first surface. The electrode portion is formed on the first surface of the base portion. A method for using the electrostatic chuck table includes a workpiece holding step of applying a voltage to the electrode portion formed on the first surface to thereby electrostatically hold the workpiece on the second surface, and a modified layer forming step of applying the laser beam through the first surface to a predetermined position inside the workpiece held on the second surface to thereby form a modified layer inside the workpiece.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: September 10, 2019
    Assignee: DISCO CORPORATION
    Inventors: Kenji Furuta, Yuriko Sato, Sakae Matsuzaki
  • Patent number: 10347122
    Abstract: In an anomaly detection apparatus mounted in a vehicle, a model storage stores a driving model which is set corresponding to a travel location of the vehicle traveling on a roadway and represents a normal driving state as the vehicle is traveling at the travel location. A data acquirer acquires driving performance data representing the driving state of the vehicle. A degree-of-anomaly calculator calculates a degree of anomaly in the driving state based on the driving model stored in the model storage and the driving performance data acquired by the data acquirer. A vehicle-mounted transmitter, if the degree of anomaly calculated by the degree-of-anomaly calculator exceeds an anomaly determination value for determining the presence of an anomaly in the driving state, transmits at least the degree of anomaly and the travel location corresponding to the degree of anomaly to a monitoring center located external to the vehicle and detects an anomaly in the road condition based on the degree of anomaly.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: July 9, 2019
    Assignee: DENSON CORPORATION
    Inventors: Kazuhito Takenaka, Kenji Muto, Masumi Egawa, Seiichi Furuta
  • Publication number: 20190206427
    Abstract: Provided is a PSA sheet that achieves both bonding reliability at a high temperature and reduction of outgassing. The PSA sheet provided by this invention comprises a substrate layer and a PSA layer provided to one face of the substrate layer. The PSA sheet exhibits a 180° peel strength of 1 N/20 mm or greater to stainless steel at 60° C. It has an amount of thermally released gas of 10 ?g/cm2 or less, determined at 130° C. for 30 minutes by GC-MS.
    Type: Application
    Filed: December 18, 2018
    Publication date: July 4, 2019
    Inventors: Kenji Furuta, Akira Hirao, Tatsuya Suzuki, Hiroki Ieda, Akira Chinen, Minami Watanabe
  • Publication number: 20190127610
    Abstract: Provided is a PSA sheet having first and second faces. The first face is an adhesive face formed of one surface of a PSA layer. The first face has a maximum static friction force of 4.0 N/cm2 or less and an adhesive strength N2 of 8 N/20mm or greater at 23° C. after subjected to 5 minutes of heating at 80 ° C. after the first face is applied to a stainless steel plate.
    Type: Application
    Filed: October 30, 2018
    Publication date: May 2, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsuya SUZUKI, Hiroki IEDA, Akira HIRAO, Kenji FURUTA
  • Publication number: 20190127611
    Abstract: Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm2·K/W, and also has an adhesive strength N1 at 30 minutes of standing at 23° C. after applied to a stainless steel plate and an adhesive strength N2 at 23° C. after subjected to 5 minutes of heating at 80° C. after applied to a stainless steel plate, satisfying N2/N1?2.
    Type: Application
    Filed: October 30, 2018
    Publication date: May 2, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tatsuya SUZUKI, Hiroki IEDA, Akira HIRAO, Kenji FURUTA
  • Publication number: 20190106608
    Abstract: The present invention provides an acrylic PSA composition. The acrylic PSA composition comprises an acrylic polymer as its base polymer and at least one species selected among tackifier resins and (meth)acrylic oligomers. The acrylic polymer has a weight average molecular weight higher than 70×104. The acrylic polymer has a dispersity (Mw/Mn) below 15.
    Type: Application
    Filed: October 5, 2018
    Publication date: April 11, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kenta JOZUKA, Naoaki HIGUCHI, Kenji FURUTA, Naohiro KATO, Yasushi BUZOJIMA
  • Publication number: 20190077999
    Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves both low initial adhesiveness and strong adhesiveness upon use and has excellent transparency of the PSA layer. The PSA sheet provided herein includes a PSA layer having a haze value of 1.0% or less. The PSA sheet is configured so that a pressure-sensitive adhesive strength N1, after the PSA layer is attached to a stainless steel plate and left at 23° C. for 30 minutes, is 1.5 N/20 mm or less, and a pressure-sensitive adhesive strength N2, after the PSA layer is attached to a stainless steel plate and heated at 80° C. for 5 minutes, is 10.0 N/20 mm or more.
    Type: Application
    Filed: November 20, 2017
    Publication date: March 14, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroki IEDA, Tatsuya SUZUKI, Kenji FURUTA, Minami WATANABE, Takeshi NAKANO, Shogo SASAKI
  • Publication number: 20190071589
    Abstract: The present invention provides a pressure-sensitive adhesive (PSA) sheet that achieves, in the form having a support substrate, both low initial adhesiveness and strong adhesiveness during use. The PSA sheet provided in this application includes a support substrate and a PSA layer laminated on at least one side of the support substrate. The PSA layer has a thickness of 3 ?m or more but less than 100 ?m. The support substrate has a thickness of 30 ?m or more. The PSA sheet is configured so that a relationship between an elastic modulus Et? [MPa] of the PSA sheet and a thickness Ts [mm] of the support substrate fulfils the following formula: 0.1 [N·mm]<Et?×(Ts)3. The adhesive strength N2 after the PSA layer is attached to a stainless steel plate (SUS304BA plate) and heated at 80° C. for 5 minutes is 20 times or more of an adhesive strength N1 after the PSA layer is attached to a stainless steel plate (SUS304BA plate) and left at 23° C. for 30 minutes.
    Type: Application
    Filed: November 20, 2017
    Publication date: March 7, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroki IEDA, Tatsuya SUZUKI, Kenji FURUTA, Minami WATANABE, Takeshi NAKANO, Shogo SASAKI
  • Publication number: 20190030648
    Abstract: The invention relates to a method of processing a substrate. The substrate has on a first surface a device area with a plurality of devices partitioned by a plurality of division lines. A pulsed laser beam is applied to the substrate at least in a plurality of positions along each of the division lines, with a focal point located at a distance from the first surface in the direction from the first surface towards a second, opposite surface, so as to form a plurality of modified regions in the substrate along each of the division lines. The second surface of the substrate is then ground to adjust the substrate thickness. After forming modified regions and/or hole regions in the substrate, a plasma can be applied to the substrate so as to form a plurality of grooves extending along the division lines.
    Type: Application
    Filed: July 25, 2018
    Publication date: January 31, 2019
    Inventors: Karl Heinz Priewasser, Hitoshi Hoshino, Kenji Furuta
  • Publication number: 20180304402
    Abstract: Disclosed herein is an evaluation jig that is a jig to be used for evaluation of a height position detection unit that detects the height position of a holding surface of a chuck table of a laser processing apparatus. The evaluation jig includes a to-be-irradiated surface which is to be irradiated with a detection laser beam, an actuator that moves the to-be-irradiated surface in a Z-axis direction, a base section that supports the actuator and is mounted on the holding surface of the chuck table, and a control unit that controls movement of the actuator.
    Type: Application
    Filed: April 25, 2018
    Publication date: October 25, 2018
    Inventor: Kenji Furuta
  • Publication number: 20180247853
    Abstract: An electrostatic chuck table includes a plate-shaped base portion capable of transmitting a laser beam to be applied to a workpiece and an electrostatic attraction electrode portion capable of transmitting the laser beam. The laser beam has a transmission wavelength to the workpiece. The base portion has a first surface and a second surface opposite to the first surface. The electrode portion is formed on the first surface of the base portion. A method for using the electrostatic chuck table includes a workpiece holding step of applying a voltage to the electrode portion formed on the first surface to thereby electrostatically hold the workpiece on the second surface, and a modified layer forming step of applying the laser beam through the first surface to a predetermined position inside the workpiece held on the second surface to thereby form a modified layer inside the workpiece.
    Type: Application
    Filed: February 26, 2018
    Publication date: August 30, 2018
    Inventors: Kenji Furuta, Yuriko Sato, Sakae Matsuzaki
  • Publication number: 20180066163
    Abstract: A magnetic disk drive includes a base having an opening, a cover configured to close the opening of the base, and a pressure-sensitive adhesive sheet configured to seal a gap between the base and the cover. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer, and a substrate layer configured to support the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1,680 N/cm to 3,000 N/cm. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm, the amount being the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the holding ability test is started. Helium gas is accommodated in a cavity defined by the base and the cover.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: Kenji FURUTA, Yoshio TERADA, Tadashi TAKAHASHI, Mitsuhiro KANADA
  • Publication number: 20180019168
    Abstract: An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.
    Type: Application
    Filed: July 10, 2017
    Publication date: January 18, 2018
    Inventors: Sakae Matsuzaki, Noriko Ito, Ken Togashi, Kenji Furuta
  • Patent number: 9786561
    Abstract: A wafer processing method for dividing a wafer into individual device chips along division lines is disclosed. The wafer processing method includes a back grinding step of grinding the back side of the wafer in the condition where a protective tape is attached to the front side of the wafer, thereby reducing the thickness of the wafer to a predetermined thickness, and a reinforcing insulation seal mounting step of mounting a reinforcing insulation seal capable of transmitting infrared light on the back side of the wafer. The wafer processing method further includes a modified layer forming step of applying a laser beam along each division line to thereby form a modified layer inside the wafer along each division line and a wafer dividing step of applying an external force to the wafer to thereby divide the wafer into the individual device chips along each division line.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: October 10, 2017
    Assignee: DISCO CORPORATION
    Inventors: Yohei Yamashita, Kenji Furuta, Yihui Lee