Patents by Inventor Kenji Furuta

Kenji Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11195757
    Abstract: A wafer processing method for processing a wafer with devices formed in regions on a side of a front surface of the wafer, the regions being defined by first scheduled division lines and second scheduled division lines includes a first modified layer forming step and a second modified layer forming step. In the first modified layer forming step, a laser beam is irradiated with its focal point set at a height leveled with a height of a first region located inside the wafer on the side of the front surface of the wafer, whereby first modified layers are formed. In the second modified layer forming step, the laser beam is irradiated with its focal point set at a height leveled with a height of a second region located inside the wafer on a side of a back surface of the wafer, whereby second modified layers are formed.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: December 7, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kenji Furuta
  • Patent number: 11168236
    Abstract: The present invention provides an acrylic PSA composition. The acrylic PSA composition comprises an acrylic polymer as its base polymer and at least one species selected among tackifier resins and (meth)acrylic oligomers. The acrylic polymer has a weight average molecular weight higher than 70×104. The acrylic polymer has a dispersity (Mw/Mn) below 15.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: November 9, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenta Jozuka, Naoaki Higuchi, Kenji Furuta, Naohiro Kato, Yasushi Buzojima
  • Patent number: 11149171
    Abstract: A thermally-conductive pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K·cm2/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 ?m.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: October 19, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Yoshio Terada
  • Publication number: 20210193521
    Abstract: A device chip manufacturing method includes adhering a protective member to a side of one surface of a front surface and a back surface of a workpiece including a device wafer, positioning the one surface on a lower side and holding the workpiece under suction by a holding surface, measuring the height of a lower surface and the height of an upper surface of the workpiece, applying a laser beam to the workpiece while adjusting the height of a focal point of the laser beam, to thereby form two or more modified layers at different heights inside the workpiece, and dividing the workpiece into device chips. The applying the laser beam includes forming a first modified layer on the lower surface side according to the height of the lower surface, and forming a second modified layer on the upper surface side according to the height of the upper surface.
    Type: Application
    Filed: December 14, 2020
    Publication date: June 24, 2021
    Inventors: Koichi SHIGEMATSU, Kei TANAKA, Kenji FURUTA
  • Publication number: 20210079270
    Abstract: Provided is a PSA sheet having excellent moisture resistance with reduced gas emission. The sheet body provided by this invention is a laminate sheet body having a PSA layer on at least one face. The sheet body has a moisture permeability of less than 90 ?g/cm2 per 24 hour measurement period in in-plane direction of bonding interface of PSA layer, with the sheet body having an internal volume (bulk) forming a permeation channel that has a prescribed length of 2.5 mm, the moisture permeability determined based on a modified MOCON method, at a permeation cell temperature of 40° C., with humidistat gas at a temperature of 40° C. and 90% relative humidity supplied to a wet chamber. It also has an amount of thermally released gas of 10 ?g/cm2 or less, determined at 130° C., over 30 minutes, by gas chromatography/mass spectrometry.
    Type: Application
    Filed: December 27, 2018
    Publication date: March 18, 2021
    Inventors: Kenji FURUTA, Tatsuya SUZUKI, Minami WATANABE
  • Publication number: 20200399510
    Abstract: Provided is a PSA composition capable of achieving excellent moisture resistance. The PSA composition provided by the present invention comprises a polymer A and a polymer B different from the polymer A. In each of the polymer A and the polymer B, isobutylene is polymerized at a ratio of 50% by weight or higher.
    Type: Application
    Filed: December 27, 2018
    Publication date: December 24, 2020
    Inventors: Kenji FURUTA, Tatsuya SUZUKI, Minami WATANABE
  • Patent number: 10864598
    Abstract: Disclosed herein is an evaluation jig that is a jig to be used for evaluation of a height position detection unit that detects the height position of a holding surface of a chuck table of a laser processing apparatus. The evaluation jig includes a to-be-irradiated surface which is to be irradiated with a detection laser beam, an actuator that moves the to-be-irradiated surface in a Z-axis direction, a base section that supports the actuator and is mounted on the holding surface of the chuck table, and a control unit that controls movement of the actuator.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: December 15, 2020
    Assignee: DISCO CORPORATION
    Inventor: Kenji Furuta
  • Patent number: 10815396
    Abstract: Provided is a thermally conductive PSA sheet that comprises a PSA layer comprising a thermally conductive filler. The PSA sheet has a thermal resistance less than 6.0 cm2·K/W, and also has an adhesive strength N1 at 30 minutes of standing at 23° C. after applied to a stainless steel plate and an adhesive strength N2 at 23° C. after subjected to 5 minutes of heating at 80° C. after applied to a stainless steel plate, satisfying N2/N1?2.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: October 27, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Tatsuya Suzuki, Hiroki Ieda, Akira Hirao, Kenji Furuta
  • Publication number: 20200266104
    Abstract: A wafer processing method for processing a wafer with devices formed in regions on a side of a front surface of the wafer, the regions being defined by first scheduled division lines and second scheduled division lines includes a first modified layer forming step and a second modified layer forming step. in the first modified layer forming step, a laser beam is irradiated with its focal point set at a height leveled with a height of a first region located inside the wafer on the side of the front surface of the wafer, whereby first modified layers are formed. In the second modified layer forming step, the laser beam is irradiated with its focal point set at a height leveled with a height of a second region located inside the wafer on a side of a back surface of the wafer, whereby second modified layers are formed.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Inventor: Kenji FURUTA
  • Publication number: 20200224000
    Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.
    Type: Application
    Filed: August 7, 2018
    Publication date: July 16, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusuke YAMANARI, Makoto SAITO, Akira HIRAO, Kenji FURUTA
  • Patent number: 10682728
    Abstract: The invention relates to a method of processing a substrate. The substrate has on a first surface a device area with a plurality of devices partitioned by a plurality of division lines. A pulsed laser beam is applied to the substrate at least in a plurality of positions along each of the division lines, with a focal point located at a distance from the first surface in the direction from the first surface towards a second, opposite surface, so as to form a plurality of modified regions in the substrate along each of the division lines. The second surface of the substrate is then ground to adjust the substrate thickness. After forming modified regions and/or hole regions in the substrate, a plasma can be applied to the substrate so as to form a plurality of grooves extending along the division lines.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: June 16, 2020
    Assignee: DISCO CORPORATION
    Inventors: Karl Heinz Priewasser, Hitoshi Hoshino, Kenji Furuta
  • Patent number: 10647891
    Abstract: Provided is a PSA sheet that has a high level of moisture resistance while maintaining good holding power with reduced gas emission. The PSA sheet provided by this invention comprises a moisture-impermeable layer and a PSA layer provided to one face of the moisture-impermeable layer. The PSA layer comprises a polymer A having a weight average molecular weight of 5×104 or higher as a base polymer and a polymer B having a number average molecular weight of 1000 or higher and a weight average molecular weight lower than 5×104.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: May 12, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Akira Hirao, Tatsuya Suzuki
  • Publication number: 20200126597
    Abstract: Provided is an electronic device capable of bringing about excellent airtightness. The electronic device provided by this invention comprises a housing that forms an internal space to house components, and a cover seal. The housing has an opening and/or gap through which gases can move between the internal space and outside of the housing. The cover seal is bonded to the housing, covering the opening and/or gap. The cover seal is formed of at least one PSA sheet having a gas barrier layer and a PSA layer provided at least on one face of the gas barrier layer. The bonding interface between the housing and the cover seal has, along its surface, a first bonding area, a non-bonding area and a second bonding area in this order from the opening and/or gap towards the outside.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 23, 2020
    Inventors: Kenji FURUTA, Akira HIRAO, Tatsuya SUZUKI, Hiroki IEDA
  • Patent number: 10593353
    Abstract: Provided is a PSA sheet that achieves both bonding reliability at a high temperature and reduction of outgassing. The PSA sheet provided by this invention comprises a substrate layer and a PSA layer provided to one face of the substrate layer. The PSA sheet exhibits a 180° peel strength of 1 N/20 mm or greater to stainless steel at 60° C. It has an amount of thermally released gas of 10 ?g/cm2 or less, determined at 130° C. for 30 minutes by GC-MS.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: March 17, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Akira Hirao, Tatsuya Suzuki, Hiroki Ieda, Akira Chinen, Minami Watanabe
  • Patent number: 10525668
    Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: January 7, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenji Furuta, Yoshio Terada, Tadashi Takahashi, Mitsuhiro Kanada
  • Publication number: 20190389008
    Abstract: A laser beam applying unit of a laser processing apparatus for processing a wafer includes a laser oscillator for emitting a pulsed laser beam having a wavelength transmittable through the wafer, a beam condenser for converging the pulsed laser beam emitted from the laser oscillator onto the wafer held on a chuck table, a beam splitter assembly disposed between the laser oscillator and the beam condenser, for splitting the pulsed laser beam emitted from the laser oscillator to form at least two converged spots on the wafer that are spaced from each other in X-axis directions, and a mask assembly disposed between the laser oscillator and the beam condenser, for reducing the width of the converged spots on the wafer in Y-axis directions to keep the converged spots on the wafer within the width of the projected dicing lines on the wafer.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 26, 2019
    Inventor: Kenji FURUTA
  • Patent number: 10490450
    Abstract: An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: November 26, 2019
    Assignee: Disco Corporation
    Inventors: Sakae Matsuzaki, Noriko Ito, Ken Togashi, Kenji Furuta
  • Publication number: 20190284447
    Abstract: Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage SMD in its machine direction and a thermal shrinkage STD in its transverse direction (direction perpendicular to the machine direction) of both ?2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm2 or less when determined at 80° C. for 3 hours by GC/MS.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Inventors: Kenji FURUTA, Akira HIRAO, Tatsuya SUZUKI, Hiroki IEDA
  • Publication number: 20190284445
    Abstract: Provided is a PSA sheet that has a high level of moisture resistance while maintaining good holding power with reduced gas emission. The PSA sheet provided by this invention comprises a moisture-impermeable layer and a PSA layer provided to one face of the moisture-impermeable layer. The PSA layer comprises a polymer A having a weight average molecular weight of 5×104 or higher as a base polymer and a polymer B having a number average molecular weight of 1000 or higher and a weight average molecular weight lower than 5×104.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Inventors: Kenji FURUTA, Akira HIRAO, Tatsuya SUZUKI
  • Patent number: 10410901
    Abstract: An electrostatic chuck table includes a plate-shaped base portion capable of transmitting a laser beam to be applied to a workpiece and an electrostatic attraction electrode portion capable of transmitting the laser beam. The laser beam has a transmission wavelength to the workpiece. The base portion has a first surface and a second surface opposite to the first surface. The electrode portion is formed on the first surface of the base portion. A method for using the electrostatic chuck table includes a workpiece holding step of applying a voltage to the electrode portion formed on the first surface to thereby electrostatically hold the workpiece on the second surface, and a modified layer forming step of applying the laser beam through the first surface to a predetermined position inside the workpiece held on the second surface to thereby form a modified layer inside the workpiece.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: September 10, 2019
    Assignee: DISCO CORPORATION
    Inventors: Kenji Furuta, Yuriko Sato, Sakae Matsuzaki