Abstract: The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.

Abstract: Disclosed is a resin composition which has high heat dissipation properties and high electrical insulation properties at the same time, while having low-temperature bondability to a conductor circuit or the like. The resin composition contains (A) a thermoplastic polyimide resin having a glass transition temperature of 160 DEG C or less and (B) an inorganic filler. The aspect ratio, that is the value of length/thickness, of the inorganic filler (B) is 9 or more, and the content of the inorganic filler (B) is 40-70 weight % relative to the total weight of the resin composition. The resin composition has a melt viscoelasticity of 10-300 MPa (inclusive) at 170 DEG C.

Abstract: A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole.

Abstract: A printed circuit board includes a cell portion which includes cells having a plurality of through bores are arranged in a base material; and a base material portion which exists around an outer edge of the cell portion. The base material is formed of a prepreg, the prepreg includes a fiber material in which fiber threads are oriented in a first direction and in a second direction which is perpendicular to the first direction, and a resin material in which the fiber material is impregnated. The through bores are arranged along a third direction between the first direction and the second direction, wherein one side of the outer edges of the cell extends along the third direction.

Abstract: A junction block (40) includes a generally rectangular flat plate portion (42) attached to a side surface of an assembled battery. A control device (50) is disposed over a portion of the flat plate portion (42) which includes a middle of the flat plate portion (42) and which is positionally biased toward a lower side end of the flat plate portion (42). A connector-connecting portion (47) is provided in one of the four corners of the flat plate portion (42) that is a rear end corner of an upper side end opposite the lower side end of the flat plate portion (42). A rib (48) and a connector-connecting portion (49) are provided at a location on the flat plate portion (42) at which the rib (4) and the connector-connecting portion (49) clamp the electric power cable (28) that is connected to the connector-connecting portion (47) and that is laid along the upper side of the flat plate portion (42).

Abstract: The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.

Abstract: The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.

Abstract: The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.

Abstract: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Abstract: Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.

Abstract: A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the substrate to a surface on a back side of the substrate, the wiring through-hole portions being made using a dielectric material having a thermal expansion coefficient different from a thermal expansion coefficient of the substrate; and thermal-expansion adjusting portions produced by filling prepared-holes with the dielectric material, the prepared-holes being produced at a surface of the substrate. The surface is partitioned into predetermined blocks, in each of which the thermal-expansion adjusting portions are placed in a layout that minimizes a difference between a thermal expansion coefficient in the block in a length direction and a thermal expansion coefficient in the block in a width direction according to a placement of the wiring through-hole portions in the block.

Abstract: A crosslinkable rubber composition includes, as essential components: (A) an ethylene-?-olefin-nonconjugated polyene random copolymer rubber in which the nonconjugated polyene has a terminal vinyl group-containing norbornene compound represented by the following general formula (1) or (II), wherein n is an integer of 0 to 10, R1 is H or an alkyl group, and R2 is H or an alkyl group, wherein R3 is H or an alkyl group, and which has a viscosity of not less than 10 Pa·s and less than 1,000 Pa·s at 25° C. under a shear rate of 10 s?1; (B) an organopolysiloxane which has three repeating units of siloxane represented by the following formula and which has three Si-bonded hydrogen atoms per molecule, wherein R4 is a monovalent hydrocarbon group; (C) a reinforcing filler; (D) a curing catalyst; and (E) a curing reaction retarder.

Abstract: A connection unit includes a first relay connected between a first electrode of a first battery and a first power feed line towards a vehicle load, a second relay connected between a second electrode of the first battery and a second power feed line towards the vehicle load, a third relay and a current limiting resistor connected in series between the second electrode of the first battery and the second power feed line, a fourth relay connected between an electrode of a second battery having a polarity identical to the polarity of the first electrode and the first power feed line towards the vehicle load, and a conductor line connecting an electrode of the second battery having a polarity identical to the polarity of the second electrode with the second electrode of the first battery. There can be provided a connection unit suppressed in the number of components, suitable for usage in a vehicle incorporating a plurality of power storage devices, and a vehicle incorporating the connection unit.

Abstract: The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.

Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

Abstract: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a plate-shaped support; electrically connecting the core substrate to the wiring patterns of the build-up layer on the support; and removing the support from the build-up layer so as to form the wiring board, in which the build-up layer is connected to the core substrate. By separably forming the build-up layer and the core substrate, the wiring board effectively exhibiting characteristics thereof can be produced.

Abstract: A power supply apparatus is equipped an assembled battery, a case that accommodates the assembled battery, and a connecting mechanism that is attached to an outside of the case, wherein the connecting mechanism connects two selected cells. The connecting mechanism includes a fixation portion and a disconnection portion. The fixation portion includes a first conductive plate that is directly connected to a positive electrode terminal of one of the two selected cells, and a second conductive plate that is directly connected to a negative electrode terminal of the other of the two selected cells, wherein the fixation portion is attached to the case. The disconnection portion is removable from the fixation portion, electrically connects the first conductive plate to the second conductive plate when attached to the fixation portion, and electrically disconnects the first conductive plate from the second conductive plate when removed from the fixation portion.

Abstract: A power storage apparatus includes a power storage module having a plurality of power storage elements which are aligned in one direction; a device placed adjacently to the power storage module in the direction of the alignment of the power storage elements; a high-voltage cable used in charge and discharge of the power storage module; and a support structure configured to support the high-voltage cable at a plurality of points to position the high-voltage cable along a reference path. The high-voltage cable is configured to electrically connect an electrode terminal of the power storage module to the device. The electrode terminal is one of two electrode terminals of the power storage module and is located on a farther side of the power storage module from the device.

Abstract: A connection unit includes a first relay connected between a first electrode of a first battery and a first power feed line towards a vehicle load, a second relay connected between a second electrode of the first battery and a second power feed line towards the vehicle load, a third relay and a current limiting resistor connected in series between the second electrode of the first battery and the second power feed line, a fourth relay connected between an electrode of a second battery having a polarity identical to the polarity of the first electrode and the first power feed line towards the vehicle load, and a conductor line connecting an electrode of the second battery having a polarity identical to the polarity of the second electrode with the second electrode of the first battery. There can be provided a connection unit suppressed in the number of components, suitable for usage in a vehicle incorporating a plurality of power storage devices, and a vehicle incorporating the connection unit.

Abstract: A printed circuit board includes a first insulation layer that is formed of a resin material into which fiber cloth is embedded. A second insulation layer is formed of a resin material, and is stacked on a front surface of the first insulation layer on which a heating process has been performed. A conductive land is formed on a front surface of the second insulation layer. A via is provided in a through hole penetrating through the first insulation layer and the second insulation layer. The through hole is filled with a conductive material, and the via is connected to the conductive land.