Abstract: A piston 14 for sliding in a cylinder 12, a rod 16 of the piston 14, and a sleeve 15 fitted over the rod 16 and passing through a rod hole 13 of the cylinder are provided. A lock portion 18 is provided to an outer periphery of a tip end portion of the rod 16. The sleeve 15 having an outer peripheral face for airtightly sliding in the rod hole 13 in the cylinder 12 and an inner peripheral face for airtightly sliding on an outer peripheral face of the rod 16 is provided with an engaging portion 22 on an inner end side to be engaged with an inside of the rod hole 13 of the cylinder and an engaging portion 23 at an outer end side to be engaged with the lock portion 18 of the rod 16. Supply/discharge ports 18A and 19A for supplying and discharging pressure fluid to and from pressure chambers 18 and 19 on opposite sides of the piston 14 in the cylinder are provided and intermediate stop is possible by supplying and discharging pressure fluid to and from the ports.

Abstract: A process for fabricating thin multi-layer circuit boards which allow the electrical conduction of remodeling pads to be easily cut do not use etching for gold, avoid the lift-off method for forming a thin chromium film on the wiring pattern layer, allow a defective wiring pattern layer to be removed, and which uses uniform heating of the substrate, from the back side thereof, at the time of pre-baking. A barrier metal (60) is excluded from a portion where the electrical conduction of a remodeling pad (62b) is to be cut (FIGS. 1 to 16). Alternatively, gold-plating resist is formed in order to avoid the etching for gold (FIGS. 17 to 19). Alternatively, a thin chromium film is formed in advance by etching on the wiring pattern layer (FIGS. 27 to 33). Alternatively, a metallic barrier film (122) is formed on each of the wiring pattern layers so that the wiring pattern layer can be removed without affecting other wiring pattern layers (FIGS. 36 to 42).

Abstract: In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device.

Abstract: A thin multi-layer circuit board having alternately stacked wiring pattern layers, including a top wiring pattern layer and insulating layers on an insulating plate-like substrate. The wiring pattern layers are electronically connected through vias in the insulating layers to form a predetermined circuit pattern by said wiring pattern layers. A metallic barrier layer is formed on the top wiring pattern layer, except at an exclusion zone of the metallic barrier layer. An electronic part-mounting pad layer and a remodeling pad layer are formed on the metallic barrier layer. The remodeling pad layer is arranged adjacent the electronic part-mounting pad layer, with the exclusion zone therebetween.

Abstract: A cylinder apparatus includes a base plate, a piston fixed to the base plate and having a piston head and a piston rod connected thereto, a cylinder body having a cylinder chamber defined on one side of the piston head and a cylinder chamber defined on another side of the piston head around the piston rod, the cylinder body being supported for reciprocating movement with respect to the base plate in axial directions of the piston, an upper plate fixed to the cylinder body, and a bushing held in slidable contact with an outer circumferential wall surface of the cylinder body for guiding the reciprocating movement of the cylinder body.

Abstract: A process for fabricating thin multi-layer circuit boards which allow the electrical conduction of remodeling pads to be easily cut do not use etching for gold, avoid the lift-off method for forming a thin chromium film on the wiring pattern layer, allow a defective wiring pattern layer to be removed, and which uses uniform heating of the substrate, from the back side thereof, at the time of pre-baking. A barrier metal (60) is excluded from a portion where the electrical conduction of a remodeling pad (62b) is to be cut (FIGS. 1 to 16). Alternatively, gold-plating resist is formed in order to avoid the etching for gold (FIGS. 17 to 19). Alternatively, a thin chromium film is formed in advance by etching on the wiring pattern layer (FIGS. 27 to 33). Alternatively, a metallic barrier film (122) is formed on each of the wiring pattern layers so that the wiring pattern layer can be removed without affecting other wiring pattern layers (FIGS. 36 to 42).

Abstract: A cylinder apparatus includes a base plate, a piston fixed to the base plate and having a piston head and a piston rod connected thereto, a cylinder body having a cylinder chamber defined on one side of the piston head and a cylinder chamber defined on another side of the piston head around the piston rod, the cylinder body being supported for reciprocating movement with respect to the base plate in axial directions of the piston, an upper plate fixed to the cylinder body, and a bushing held in slidable contact with an outer circumferential wall surface of the cylinder body for guiding the reciprocating movement of the cylinder body.

Abstract: A conductive pattern layer structure includes an insulating member containing polyimide, a patterned thin film formed on the insulating member, and a patterned conductive layer formed on the thin film. The patterned conductive layer contains copper. Further, the layer structure includes a patterned barrier layer covering an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

Abstract: A method of forming a conductive pattern layer structure includes providing an insulating member containing polyimide, forming a patterned thin film on the insulating member, and forming a patterned conductive layer on the thin film. The patterned conductive layer contains copper. Further, a barrier layer can be patterned to cover an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

Abstract: A conductive pattern layer structure includes an insulating member containing polyimide, a patterned thin film formed on the insulating member, and a patterned conductive layer formed on the thin film. The patterned conductive layer contains copper. Further, the layer structure includes a patterned barrier layer covering an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

Abstract: A DC-DC converter converts a DC input to a predetermined high-voltage DC output according to a predetermined control signal. An output unit has a pair of high- and low-voltage-side output paths and supplies the predetermined high-voltage DC output to a load. An output variation detecting unit has a resistor voltage dividing circuit including high- and low-voltage-side resistors connected in series between the pair of output paths and detects a variation in predetermined high-voltage DC output that follows a variation in the load. An inner shield shields the exterior of the resistor voltage dividing circuit. The inner shield is electrically connected to a node of the high- and-low voltage-side resistors. An outer shield shields the exterior of the inner shield. The outer shield is electrically connected to the low voltage-side output path of the pair of output paths.