Abstract: In a touch sensor device comprising at least a printed wiring board with a wiring pattern made of cured conductive ink containing conductive particles formed on a transparent substrate, and a front cover having a plate surface parallel to the printed wiring board and configured with a transparent dielectric, one face of the front cover being a contact input surface, the whole of the wiring pattern formed in an area seen through the contact input surface on the substrate is formed on one face of the substrate on a side opposite to a side where the front cover is located.

Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.

Abstract: A method of forming, on a substrate having on a surface thereof a film having a trench of a preset pattern and a via at a bottom of the trench, a Cu wiring by burying Cu or Cu alloy in the trench and the via includes forming a barrier film (process 2); forming, on a surface of the barrier film, a wetting target layer of Ru or the like (process 3); forming, on a surface of the wetting target layer, a Cu-based seed film by PVD (process 4); filling the via by heating the substrate and flowing the Cu-based seed film into the via (process 5); and forming, on the substrate surface, a Cu-based film made of the Cu or Cu alloy by PVD under a condition where the Cu-based film is flown on the wetting target layer to bury the Cu-based film in the trench (process 6).

Abstract: In a Cu wiring manufacturing method, a MnOx film which becomes a self-formed barrier film by reaction with an interlayer insulating film of a substrate is formed on a surface of a recess formed in the interlayer insulating film by ALD. A hydrogen radical process is performed on a surface of the MnOx film to reduce the surface of the MnOx film. A Ru film is formed by CVD on the surface of the MnOx film which has been reduced by the hydrogen radical process. A Cu-based film is formed on the Ru film by PVD to be filled in the recess. When the Ru film is formed, a film-formation condition of the MnOx film and a condition of the hydrogen radical process are set such that nucleus formation is facilitated and the Ru film is formed in a state where a surface smoothness is high.

Abstract: A front panel, a touchpad, and a display cell are adhered and fixed, and these and a back light are held by a bracket to construct a display body unit. When the display body unit is mounted on a support, the front panel is fixed to the support with an adhesive layer therebetween. In this state, each of mounting portions has position adjustability in the vertical direction (Z direction). In the state having position adjustability, the mounting portion is fixed to the support by a fixing mechanism.

Abstract: A surface of a steel material cut to a desired shape and carbonitrided is heated by excitation and thereafter repeatedly heated/cooled a predetermined number of times, such that an ultrafine crystal layer is formed immediately under the surface of the steel material and at least a predetermined number of cracks are formed under the formed ultrafine crystal layer, thereby enabling to increase toughness of the surface or immediately thereunder and enhance tenacity and inhibiting growth of cracks.

Abstract: A lens member includes a light-incident side; a light-exit side that is opposite to the light-incident side, a Fresnel lens arranged on a center axis that passes through a center of the light-incident side, and a diffraction grating structure arranged around a periphery of the Fresnel lens and having a center through which the center axis passes. Also, it is disclosed that the Fresnel lens may include a first Fresnel lens and a second Fresnel lens, the first Fresnel lens includes annular prisms that are divided from a convex lens and having a center through which the center axis of the light-incident side passes, and the second Fresnel lens includes annular prisms that are divided from a TIR lens and arranged around the periphery of the first Fresnel lens, centering around the center axis of the light-incident side.

Abstract: An object of the present invention is to provide electronic eyeglass and liquid crystal lens production methods that eliminate the need for forming a liquid crystal injection path in the liquid crystal lens, while making provisions so as to be able to sufficiently maintain a prescribed gap between substrates. The electronic eyeglass and liquid crystal lens production methods includes the steps of placing a sealing agent so as to form a closed planar region on at least one of first and second transparent substrates, dropping a liquid crystal material into an inside space enclosed by the sealing agent, bonding the other of the transparent substrates onto the one transparent substrate on which the liquid crystal material has been dripped, and filling a resin into a space created outside the sealing agent.

Abstract: An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Abstract: Structure of control valve body of automatic transmission has valve body enclosures having channels on opposing surfaces thereof; a separate plate sandwiched between the valve body enclosures for defining oil passages on both sides of the separate plate; and an orifice provided at the separate plate. The oil passages on both sides of the separate plate, which are upstream and downstream side oil passages located on upstream and downstream sides of the separate plate, communicate with each other through the orifice. Depth h, in a part facing to the orifice, of the channel corresponding to the downstream side oil passage is set to be shallower than depth of the channel corresponding to the upstream side oil passage, and the depth h of the channel in the part facing to the orifice and a diameter d of the orifice are set so as to satisfy relationship of h?3d.

Abstract: There is provided a control unit for use in a liquid ejecting apparatus using a tank containing a liquid and a storage material attachable to and detachable from the liquid ejecting apparatus, and storing an amount of the liquid in the tank. After the storage material is not mounted on a predetermined place, the control unit receives an answer for a question to ask whether or not the liquid is injected to the tank.

Abstract: A method of forming, on a substrate having on a surface thereof a film having a trench of a preset pattern and a via at a bottom of the trench, a Cu wiring by burying Cu or Cu alloy in the trench and the via includes forming a barrier film (process 2); forming, on a surface of the barrier film, a wetting target layer of Ru or the like (process 3); forming, on a surface of the wetting target layer, a Cu-based seed film by PVD (process 4); filling the via by heating the substrate and flowing the Cu-based seed film into the via (process 5); and forming, on the substrate surface, a Cu-based film made of the Cu or Cu alloy by PVD under a condition where the Cu-based film is flown on the wetting target layer to bury the Cu-based film in the trench (process 6).

Abstract: In a Cu wiring manufacturing method for manufacturing Cu wiring that fills a recess formed in a predetermined pattern on a surface of an interlayer insulating film of a substrate, a MnOx film that becomes a self-formed barrier film by reaction with the interlayer insulating film is formed at least on a surface of the recess by ALD. A CuOx film that becomes a liner film is formed on a surface of the MnOx film by CVD or ALD. An annealing process is performed on the substrate on which the CuOx film is formed and the CuOx film is reduced to a Cu film by oxidation-reduction reaction between the MnOx film and the CuOx film. A Cu-based film is formed on the Cu film obtained by reducing the CuOx film by PVD to fill the Cu-based film in the recess.

Abstract: A capacitive distance sensor includes a first guard electrode, a conductor, a second guard electrode, and insulators. The conductor includes a sensor electrode and a lead portion and is arranged on a side of a measurement target with respect to the first guard electrode. The second guard electrode is arranged on the side of the measurement target with respect to the conductor. The first guard electrode includes portions overlapping the sensor electrode and the lead portion. The second guard electrode includes a portion overlapping the lead portion and does not overlap the sensor electrode.

Abstract: An object is to improve a user's convenience. There is provided a control unit for use in a liquid ejecting apparatus using a tank containing a liquid and a storage material attachable to and detachable from the liquid ejecting apparatus, and storing an amount of the liquid in the tank. After the storage material is not mounted on a predetermined place, the control unit receives an answer for a question to ask whether or not the liquid is injected to the tank.

Abstract: The novel bisphosphonic acid ester derivatives represented by the following formula (1): Y—Cy—(NH)m—(CH2)n—C(X)(PO(OR1)(OR2))2 ??(1) wherein each symbol is as defined in the DESCRIPTION, which has an amino group substituted by a heterocyclic group or a heterocyclic group containing a nitrogen atom, and the acid moiety is esterified with a POM group, an n-butanoyloxymethyl (BuOM) group and the like, exhibit a superior direct or indirect cytotoxicity effect on tumor cells and virus infected cells.

Abstract: A touch panel includes first sensor electrode arrays in which first island-shaped electrode portions are arrayed along a first direction and connected through connecting portions, second sensor electrode arrays in which second island-shaped electrode portions are arrayed at intervals along a second direction, jumper wiring portions being superimposed through insulating portions and connecting the second island-shaped electrode portions arranged adjacent to each other along the second direction, and a lead-out wiring portion connected to the first and second sensor electrode arrays, the first and second sensor electrode arrays being formed of a first transparent conductor layer having a first thickness, the jumper wiring portions being formed of a second transparent conductor layer having a second thickness, the lead-out wiring portion being formed of a third transparent conductor layer having a third thickness that is larger than the first thickness.

Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.

Abstract: A light modulating device 103 includes: a selective diffraction device (10, 10?) which generates diffracted light beams of a plurality of orders by diffracting illumination light into one of a plurality of directions, the illumination light being linearly polarized light having a polarization plane oriented in a first polarization direction, and which causes a phase difference between the diffracted light beams of the plurality of orders; and a polarization plane rotating device 14 which rotates the polarization plane of the diffracted light beam of each order so as to be oriented in a direction perpendicular to a direction radiating from an optical axis.

Abstract: A method of manufacturing a semiconductor device includes preparing a substrate having an interlayer insulating film and a hard mask provided on the interlayer insulating film and having a predetermined pattern, etching the interlayer insulating film to form a trench, forming a MnOx film through an ALD method in a state where the hard mask is left on the interlayer insulating film, the MnOx film being turned into a self-forming barrier film by reacting with the interlayer insulating film, performing a hydrogen radical processing on the MnOx film, forming a Ru film through a CVD method, forming a Cu-based film through a PVD method or by forming a Cu seed through the PVD method, and then performing a Cu plating processing so as to embed the Cu-based film within the trench, and performing a CMP method to remove the hard mask and to form a Cu wiring.