Abstract: A glass includes a first glass portion and a second glass portion. The first glass portion has a higher ion packing density than the second glass portion (has a composition that forms a glass in which, out of plastic deformation characteristics, plastic flow is dominant). The second glass has a lower ion packing density than the first glass portion (has a composition that forms a glass in which, out of the plastic deformation characteristics, densification is dominant).

Abstract: Described herein is a technique capable of uniformly processing a substrate. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a microwave generator configured to supply a microwave to the process chamber to perform a heat treatment on the substrate; a substrate retainer configured to accommodate the substrate and a heat retainer provided above the substrate and retaining a temperature of the substrate heated by the microwave; and a first ring plate provided on an outer circumference of the heat retainer and whose outer diameter is greater than that of the substrate.

Abstract: According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) heating a heat insulating plate in a substrate retainer to a processing temperature by an electromagnetic wave, and measuring a temperature change of the heat insulating plate by a non-contact type thermometer until the processing temperature; (b) heating a test object provided with a chip that does not transmit a detection light of the thermometer and accommodated in the substrate retainer to the processing temperature, and measuring a temperature change of the chip by the thermometer until the processing temperature; (c) acquiring a correlation between the temperature change of the heat insulating plate and that of the chip based on measurement results; and (d) controlling a heater to heat the substrate based on the correlation and the temperature of the heat insulating plate measured by the thermometer.

Abstract: According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber in which a substrate is processed; a first gas supply system configured to supply a first gas onto the substrate in the process chamber and including a plurality of tanks configured to store the first gas, wherein the first gas is heated in the plurality of the tanks; and a controller configured to control the first gas supply system such that the first gas is supplied onto the substrate in the process chamber while switching among the plurality of the tanks.

Abstract: There is provided a technique that includes: process chamber processing substrate; gas supply system supplying precursor gas into the process chamber; exhaust pipe connected to vacuum pump and evacuating inside of the process chamber; gas concentration sensor configured to measure concentration of the precursor gas passing through the exhaust pipe at front stage of the vacuum pump; a pressure sensor measuring pressure in the exhaust pipe at rear stage of the vacuum pump; dilution gas supply system supplying dilution gas into the vacuum pump or the exhaust pipe at the front stage; and a controller controlling the dilution gas supply system to supply the dilution gas into the vacuum pump or the exhaust pipe at the front stage at low rate corresponding to the measured concentration of the precursor gas and the measured pressure in the exhaust pipe at the rear stage.

Abstract: A display panel and the like with a novel structure are provided. In the display panel, a first functional layer includes a pixel circuit and a first insulating film. A second functional layer includes a coloring film and a second insulating film. The first insulating film and the second insulating film each have a thickness of 0.5 ?m to 3 ?m and a Young's modulus of 3 GPa to 12 GPa. A sealing material is provided between a first base and a second base. A structure body is provided between the first base and the second base, and keeps a predetermined gap between the first and second bases. A pixel is surrounded by the first base, the second base, and the sealing material. A display element in the pixel is electrically connected to a pixel circuit and overlaps with a coloring film and a liquid crystal material.

Abstract: Provided are a conductive pattern manufacturing method and a conductive pattern formed substrate, capable of easily achieving a narrow pitch. A metal nanowire layer 12 is formed on the entirety of a part of at least one of the main faces of a substrate 10, pulsed light is irradiated thereto through a mask 14 provided with a light transmission portion 14a formed in a predetermined pattern, and the metal nanowires in the metal nanowire layer 12 at the region having the above predetermined pattern were sintered, to thereby obtain conductivity at the predetermined patterned region. Accordingly, a substrate provided with a conductive pattern having any selected pattern can be produced by simple steps.