Abstract: A display panel and the like with a novel structure are provided. In the display panel, a first functional layer includes a pixel circuit and a first insulating film. A second functional layer includes a coloring film and a second insulating film. The first insulating film and the second insulating film each have a thickness of 0.5 ?m to 3 ?m and a Young's modulus of 3 GPa to 12 GPa. A sealing material is provided between a first base and a second base. A structure body is provided between the first base and the second base, and keeps a predetermined gap between the first and second bases. A pixel is surrounded by the first base, the second base, and the sealing material. A display element in the pixel is electrically connected to a pixel circuit and overlaps with a coloring film and a liquid crystal material.

Abstract: A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.

Abstract: Provided are a conductive pattern manufacturing method and a conductive pattern formed substrate, capable of easily achieving a narrow pitch. A metal nanowire layer 12 is formed on the entirety of a part of at least one of the main faces of a substrate 10, pulsed light is irradiated thereto through a mask 14 provided with a light transmission portion 14a formed in a predetermined pattern, and the metal nanowires in the metal nanowire layer 12 at the region having the above predetermined pattern were sintered, to thereby obtain conductivity at the predetermined patterned region. Accordingly, a substrate provided with a conductive pattern having any selected pattern can be produced by simple steps.

Abstract: Disclosed is an input device for a capacitive touch panel, which is an input device for inputting the position on the touch panel by making the input device contact with the touch panel, including an insulating layer (11) having flexibility and optical permeability, and a conductive layer (12) having optical permeability and laminated onto the insulating layer (11), and the input device (10) is integrally formed into a cylindrical shape so that the insulating layer (11) and the conductive layer (12) become a portion to be contacted with the touch panel. Thereby, users less likely to have a sense of wear and tear of fingers, the position pointed by the input device on the touch panel is precisely recognized with ease, the accuracy of the position detected by the touch panel is improved, and input means is less likely to be lost though the input device is lost.

Abstract: A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.

Abstract: A substrate processing apparatus capable of increasing the life span of a lamp for heating a substrate is provided. The substrate processing apparatus includes: a light receiving chamber for processing a substrate; a substrate support unit inside the light receiving chamber; a lamp including an electrical wire, and a seal accommodating the electrical wire to hermetically seal the lamp with a gas therein, the lamp irradiating the substrate with a light; a lamp receiving unit outside the light receiving chamber to accommodate the lamp therein, the lamp receiving unit including a lamp connector connected to the lamp to supply an electric current through the electrical wire, a heat absorption member including a material having a thermal conductivity higher than that of the seal, and a base member fixing the heat absorption member; and an external electrical wire connected to the lamp connector to supply current to the lamp connector.

Abstract: Provided are a transparent conductive substrate production method for an electrostatic capacitance touch panel having a high pattern recognition property, by simple steps without using a vacuum process and a wet etching method, as well as a transparent conductive substrate and an electrostatic capacitance touch panel. An electrode drawing lead wiring pattern is formed on at least one main face of a transparent film using a conductive paste. An electrode pattern forming unit prints an electrode pattern with a transparent conductive pattern forming ink containing metal nanowires or metal nanoparticles so that the electrode pattern is connected to the electrode drawing lead wiring pattern, and dries the printed electrode pattern. The dried electrode pattern is subjected to pulsed light irradiation by a photoirradiation unit 18, to sinter the metal nanowires or the metal nanoparticles contained in the transparent conductive pattern forming ink.

Abstract: A method for producing a transparent conductive pattern having an improved conductivity by pulse light irradiation. A transparent conductive pattern is produced by coating and drying a dispersion liquid having metal nanowires dispersed therein on a substrate, to deposit the metal nanowires, and irradiating pulsed light having a pulse width of 20 microseconds to 50 milliseconds to the metal nanowires deposited on the substrate, to thereby join intersections of the metal nanowires.

Abstract: Disclosed is an input device for a capacitive touch panel, which is an input device for inputting the position on the touch panel by making the input device contact with the touch panel, including an insulating layer (11) having flexibility and optical permeability, and a conductive layer (12) having optical permeability and laminated onto the insulating layer (11), and the input device (10) is integrally formed into a cylindrical shape so that the insulating layer (11) and the conductive layer (12) become a portion to be contacted with the touch panel. Thereby, users less likely to have a sense of wear and tear of fingers, the position pointed by the input device on the touch panel is precisely recognized with ease, the accuracy of the position detected by the touch panel is improved, and input means is less likely to be lost though the input device is lost.

Abstract: Disclosed is an input device for a capacitive touch panel, which is an input device for inputting the position on the touch panel by making the input device contact with the touch panel, including an insulating layer (11) having flexibility, and a conductive layer (12) laminated onto the insulating layer (11), and the plural units that are configured by the insulating layer (11) and the conductive layer (12) are laminated to be a laminated body, and the input device (10) forms a cylindrical shape. Thereby, users less likely to have a sense of wear and tear of fingers, the accuracy of the position detected by the touch panel is improved, input means is less likely to be lost though the input device is lost, and it is less likely to produce distortions and the like on the surface of the touch panel.

Abstract: A substrate processing apparatus capable of increasing the life span of a lamp for heating a substrate is provided. The substrate processing apparatus includes: a light receiving chamber for processing a substrate; a substrate support unit inside the light receiving chamber; a lamp including an electrical wire, and a seal accommodating the electrical wire to hermetically seal the lamp with a gas therein, the lamp irradiating the substrate with a light; a lamp receiving unit outside the light receiving chamber to accommodate the lamp therein, the lamp receiving unit including a lamp connector connected to the lamp to supply an electric current through the electrical wire, a heat absorption member including a material having a thermal conductivity higher than that of the seal, and a base member fixing the heat absorption member; and an external electrical wire connected to the lamp connector to supply current to the lamp connector.

Abstract: Plural LEDs 21 are mounted on a top surface 20a of a circuit board 20, and a circuit pattern 22 for supplying power to the LEDs 21 and metallic film islands 23 for heat radiation are provided on a back surface 20b. Further, lens 30 is provided on the top surface 20a of the circuit board 20, that is, a surface where the circuit pattern 22 and the metallic film islands 23 are not provided, so as to cover each of the LEDs 21. The lens 30 is cured after dripping a liquid resin including a silicone resin containing silica. Therefore, distortion of the cover members formed on the substrate by dripping the liquid resin is suppressed.

Abstract: The light emitting module 11 includes: a mount body 20; and a support body 30 supporting the mount body 20. The mount body 20 includes: a circuit board 21 with wirings provided thereon; and a light emitting unit 40 to be mounted on the circuit board 21. The circuit board 21 includes: a base portion 22; and a rising portion 23, with the light emitting unit 40 being attached thereon, rising from one end, in a longitudinal direction, of the base portion 22 through a bending portion 24. The rising portion 23 is divided into seven, first to seventh sidewall portions 23a to 23g with slits 25a to 25f provided at six positions. First to seventh light emitting portions 40a to 40g forming the light emitting unit 40 are attached to the first to seventh sidewall portions 23a to 23g, respectively. Thereby, reduction in thickness of a light emitting device including solid-state light emitting elements is achieved.

Abstract: The display device includes: a display panel that displays an image; and a backlight that is disposed on a back surface of the display panel and emits light from the back surface of the display panel. The backlight includes: an output member that outputs incoming light to the display panel; and a light source that emits light to the output member from a side of the output member. The light source includes: plural board-shaped substrates that each have a light-emitting element mounted on a surface thereof; and a wiring board that is in contact with a side surface of each of the plural board-shaped substrates to hold, in an upright position, the plural board-shaped substrates which are arranged in a line, and that is arranged so that the each light-emitting element faces the side of the output member while the wiring board is electrically connected to the plural board-shaped substrates.

Abstract: The backlight system is provided with: a plurality of LED-substrates (12) equipped with a plurality of light emitting diodes (LEDs) (21), a circuit that supplies driving current to the plurality of light emitting diodes (LEDs) (21), and metallic film islands that conduct heat generated by the plurality of light emitting diodes (LEDs) (21); a backlight frame (11) that loads the plurality of LED-substrates (12); and bolts (17) that fix the plurality of LED-substrates (12) on the backlight frame (11) and that conduct heat through the metallic film islands to the backlight frame (11).

Abstract: A light guide member in which a light that has entered one major face from an illuminant is emitted from the other major face, includes a cut portion provided with a specified face inclined toward the other face at a section of one major face that faces the illuminant, and a reflecting portion, which reflects a light emitted from the illuminant, on the inclined face.

Abstract: The light emitting module 11 includes: a mount body 20; and a support body 30 supporting the mount body 20. The mount body 20 includes: a circuit board 21 with wirings provided thereon; and a light emitting unit 40 to be mounted on the circuit board 21. The circuit board 21 includes: a base portion 22; and a rising portion 23, with the light emitting unit 40 being attached thereon, rising from one end, in a longitudinal direction, of the base portion 22 through a bending portion 24. The rising portion 23 is divided into seven, first to seventh sidewall portions 23a to 23g with slits 25a to 25f provided at six positions. First to seventh light emitting portions 40a to 40g forming the light emitting unit 40 are attached to the first to seventh sidewall portions 23a to 23g, respectively. Thereby, reduction in thickness of a light emitting device including solid-state light emitting elements is achieved.

Abstract: Reflectors (50) are a member subjected to mirror reflection processing, and are arranged on a light irradiation side of a light source module (31). Each of the reflectors (50) includes a horizontal reflection portion (51) provided along a rear face portion of a backlight frame and a slant reflection portion (52) having a predetermined angle with respect to the horizontal reflection portion (51). In this manner, the horizontal reflection portion (51) is arranged in an area which is near the light source and has a high light intensity, while the slant reflection portion (52) is arranged in an area which is farther from the light source and has a low light intensity, so that uniformity in light reflection amount may be achieved and occurrence of luminance variation is suppressed. Further, provision of a light guide plate, for example, is unnecessary, and thus thickness reduction and weight reduction of the device may be achieved.

Abstract: Plural LEDs 21 are mounted on a top surface 20a of a circuit board 20, and a circuit pattern 22 for supplying power to the LEDs 21 and metallic film islands 23 for heat radiation are provided on a back surface 20b. Further, lens 30 is provided on the top surface 20a of the circuit board 20, that is, a surface where the circuit pattern 22 and the metallic film islands 23 are not provided, so as to cover each of the LEDs 21. The lens 30 is cured after dripping a liquid resin including a silicone resin containing silica. Therefore, distortion of the cover members formed on the substrate by dripping the liquid resin is suppressed.