Abstract: The hard coating layer includes at least a complex nitride or carbonitride layer (2) expressed by a composition formula: (Ti1-x-yAlxMey)(CzN1-z), Me being an element selected from Si, Zr, B, V, and Cr. The average content ratio X, the average content ratio Y, and the average content ratio Z satisfy 0.60?xavg, 0.005?yavg?0.10, 0?zavg?0.005, and 0.605?xavg+yavg?0.95. There are crystal grains having a cubic structure in the crystal grains constituting the complex nitride or carbonitride layer (2). A predetermined periodic content ratio change of Ti, Al and Me exists in the crystal grains having the cubic structure.

Abstract: A hard coating layer on a cutting tool includes at least a Ti and Al complex nitride or carbonitride layer and has an average layer thickness of 1 to 20 ?m. In a case where a composition of the complex nitride or carbonitride layer is expressed by: (Ti1-xAlx)(CyN1-y), a content ratio x and a content ratio y satisfy 0.60?x?0.95 and 0?y?0.005, where x and y are in atomic ratio. Crystal grains constituting the complex nitride or carbonitride layer include cubic phase crystal grains and hexagonal phase crystal grains. An area ratio occupied by the cubic phase crystal grains is 30-80%. An average grain width W is 0.05-1.0 ?m. An average aspect ratio A of the crystal grains with the cubic grain structure is 5 or less. A periodic content ratio change of Ti and Al in (Ti1-xAlx)(CyN1-y) exists in each of the cubic phase crystal grains.

Abstract: Provided is a coated tool in which a hard coating layer has excellent hardness and toughness and exhibits chipping resistance and defect resistance during long-term use. The hard coating layer includes at least a layer of a complex nitride or complex carbonitride expressed by the composition formula: (Ti1-x-yAlxMey) (CzN1-x) (here, Me is one element selected from among Si, Zr, B, V, and Cr), an average amount Xavg of Al, an average amount Yavg of Me, and an average amount Zavg of C satisfy 0.60?Xavg, 0.005?Yavg?0.10, 0?Zavg?0.005, and 0.605?Xavg+Yavg?0.95, crystal grains having a cubic structure are present in crystal grains constituting the layer of a complex nitride or complex carbonitride, and in the crystal grains having a cubic structure, a predetermined periodic concentration variation of Ti, Al, and Me is present, whereby the problems are solved.

Abstract: A surface-coated cutting tool has a hard coating layer on a tool body. The hard coating layer includes a (Ti1?xAlx)(CyN1?y) layer (the average amount Xavg of Al and the average amount Yavg of C satisfy 0.60?Xavg?0.95 and 0?Yavg?0.005). Crystal grains having an NaCl type face-centered cubic structure in the layer have {111} orientation, a columnar structure in which the average grain width of the individual crystal grains having an NaCl type face-centered cubic structure is 0.1 ?m to 2.0 ?m and the average aspect ratio is 2 to 10 is included, and in the individual crystal grains having an NaCl type face-centered cubic structure, a periodic compositional variation in Ti and Al in the composition formula: (Ti1?xAlx)(CyN1?y) is present and the difference between the average of maximum values of x and the average of minimum values thereof is 0.03 to 0.25.

Abstract: A surface-coated cutting tool includes a lower layer including a Ti compound layer, an intermediate layer including an ?-Al2O3 layer, and an upper layer including a Zr-containing ?-Al2O3 layer. The outermost layer of the lower layer contains 0.5 to 3 at % of oxygen. The frequencies of inclination angles between a normal line to a (0001) plane of Al2O3 grains of the intermediate layer and a normal line to a surface of a tool body have a highest peak in an inclination angle division of 0 to 10°. The ratio of the frequencies is 50 to 70%. The frequencies between the normal line to the (0001) plane of Al2O3 grains of the entirety of the intermediate and the upper layers and the normal line to the tool body surface have a highest peak in an inclination angle division of 0 to 10°. The ratio of the frequencies is 75% or more.

Abstract: A surface-coated cutting tool has a hard coating layer and a tool body, which is coated with a lower layer including a TiCN layer having at least an NaCl type face-centered cubic crystal structure and an upper layer formed of a TiAlCN layer having a single phase crystal structure of NaCl type face-centered cubic crystals or a mixed phase crystal structure of NaCl type face-centered cubic crystals and hexagonal crystals. The tool body is further coated with an outermost surface layer including an Al2O3 layer, when the layer of a complex nitride or complex carbonitride of Ti and Al is expressed by the composition formula: (Ti1-xAlx)(CyN1-y), the average amount Xave of Al in Ti and Al and the average amount Yave of C in C and N (both Xave and Yave are atomic ratios) respectively satisfy 0.60?Xave?0.95 and 0?Yave?0.005.

Abstract: The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (Ti1-xAlx)(CyN1-y). The average Al content ratio xavg the average C content ratio yavg satisfy 0.60?xavg?0.95 and 0?yavg?0.005, respectively, each of the xavg and yavg is in atomic ratio. The crystal grains constituting the complex nitride or complex carbonitride layer include a crystal grain having the cubic structure. Predetermined average crystal grain misorientation and inclined angle distribution exist in the crystal grains having the cubic structure.

Abstract: In a surface-coated cutting tool, a hard coating layer composed of a lower layer and an upper layer is deposited on a surface of a tool body made of a WC-based cemented carbide or a TiCN-based cermet. The lower layer has at least one Ti compound layer made of a TiCN layer and the upper layer is made of an ?-type Al2O3 layer. In a case where, regarding Al2O3 crystal grains of the entire upper layer, a constituent atom-sharing lattice point distribution is measured, a highest peak is present in ?3, and a distribution ratio of ?3 is 70% or more. A ratio of a ?3-coincidence grain boundary continuing from an interface between the lower layer and the upper layer to an outermost surface of the upper layer is 60% or more of a ?3-coincidence grain boundary of the upper layer.

Abstract: The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (Ti1-xAlx)(CyN1-y). The average Al content ratio xavg the average C content ratio yavg satisfy 0.60?xavg?0.95 and 0?yavg?0.005, respectively, each of the xavg and yavg is in atomic ratio. The crystal grains constituting the complex nitride or complex carbonitride layer include a crystal grain having the NaCl face-centered cubic structure. A predetermined average crystal grain misorientation exists in the crystal grains having the NaCl face-centered cubic structure.

Abstract: A surface-coated cutting tool of the present invention includes: a cutting tool body; and a hard coating layer provided on a surface of the cutting tool body, in which the hard coating layer includes a complex nitride or carbonitride layer, which is expressed by a composition formula: (Ti1-xAlx)(CyN1-y), the average content ratio Xavg of Al and the average content ratio Yavg of C in the complex nitride or carbonitride layer satisfy 0.60?Xavg?0.95 and 0?Yavg?0.005, provided that each of Xavg and Yavg is in atomic ratio, the complex nitride or carbonitride layer includes crystal grains with a cubic structure, and in the crystal grains with the cubic structure, a composition of Ti and Al is periodically changed in a direction of the normal line to the surface of the cutting tool body.

Abstract: A surface-coated cutting tool of the invention is a surface-coated cutting tool in which a surface of a tool body is coated with a lower layer and an upper layer, in which at least one layer of the lower layer is made of a TiCN layer, the upper layer has an average layer thickness of 2 to 15 ?m and is made of an Al2O3 layer having an ?-type crystal structure in a chemically deposited state, and in a coincidence grain boundary distribution graph, a highest peak is present in ?3 in the range of ?3 to ?29, a distribution ratio of ?3 occupies 35 to 70% of the whole coincidence grain boundary length of ?3 or more, and a coincidence grain boundary of ?31 or more occupies 25 to 60% of the whole coincidence grain boundary length of ?3 or more.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing device 50 mounted in the probe apparatus includes a surrounding member 52 which surrounds probe needles 24G and 24S between a probe card 16 and a mounting table 12; and a gas supply device 54 configured to supply a gas to a vicinity of the probe needles 24G and 24S through an inside or a vicinity of the surrounding member 52 to form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needles 24G and 24S when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact plate 34 also serves as the surrounding member 52.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: There is provided a recording apparatus which includes a transporting belt on which a recording medium and which transports the recording medium and performs efficient cleaning of the transporting belt without an excess cleaning. The recording apparatus (printing apparatus (100)) includes a recording section (10) performing recording by applying liquid (ink) to a recording medium (fabric (1)), a transporting belt (34) transporting the recording medium, and a cleaning section (50) having a plurality of cleaning units (51) cleaning the transporting belt (34). A cleaning unit (51) which is selected in accordance with a cleaning requirement level operates.

Abstract: A chemical vapor deposition apparatus includes: a reaction chamber in which deposition materials are housed a gas supply tube provided in the reaction chamber and a rotary drive device that rotates the gas supply tube about a rotation axis. A an inside of the gas supply tube is divided into a first gas flowing section and a second gas flowing section both of which extend along the rotation axis. A first gas ejection port ejects a first gas flowing in the first gas flowing section into the reaction chamber, and a second gas ejection port ejects a second gas flowing in the second gas flowing section into the reaction chamber. The first port and the second port form an ejection port pair in a plane perpendicular to the rotation axis.

Abstract: A coated tool with a hard coating layer, which has an excellent hardness and heat insulating effect; and exhibits an excellent chipping resistance and an excellent fracturing resistance for a long-term usage, is provided. The hard coating layer included in the coated tool has a chemically vapor deposited alternate laminated structure, which is made of: a region A layer and a region B layer, each of which is expressed by the composition formula of (Ti1-xAlx)(CyN1-y); and has the average total layer thickness of 1-10 ?m. In the region A layer, relationships, 0.70?x?0.80 and 0.0005?y?0.005, are satisfied; the average grain width W is 0.1 ?m or less; and the average grain length L is 0.1 ?m or less. In the region B layer, relationships, 0.85?x?0.95 and 0.0005?y?0.005, are satisfied; the average grain width W is 0.1-2.0 ?m; and the average grain length L is 0.5-5.0 ?m.

Abstract: A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

Abstract: A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

Abstract: A hard coating layer on a cutting tool includes at least a Ti and Al complex nitride or carbonitride layer and has an average layer thickness of 1 to 20 ?m. In a case where a composition of the complex nitride or carbonitride layer is expressed by: (Ti1-xAlx)(CyN1-y), a content ratio x and a content ratio y satisfy 0.60?x?0.95 and 0?y?0.005, where x and y are in atomic ratio. Crystal grains constituting the complex nitride or carbonitride layer include cubic phase crystal grains and hexagonal phase crystal grains. An area ratio occupied by the cubic phase crystal grains is 30-80%. An average grain width W is 0.05-1.0 ?m. An average aspect ratio A of the crystal grains with the cubic grain structure is 5 or less. A periodic content ratio change of Ti and Al in (Ti1-xAlx)(CyN1-y) exists in each of the cubic phase crystal grains.