Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

Abstract: Improved techniques for proactive identification of errors are provided. Documents are analyzed, using natural language processing (NLP) models, to identify entities in the documents. The documents are processed with the NLP models to identify relationships among the entities, and each of the entities is stored in a data store, where the data store further includes an indication of the identified relationships among the entities. A draft correspondence is received, and it is determined that the draft correspondence includes a first entity and a second entity, where the first entity and the second entity have a first relationship. Upon determining that the first relationship conflicts with at least one of the relationships stored in the data store, a suggested revision for the draft correspondence is generated.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.

Abstract: Improved techniques for proactive identification of errors are provided. Documents are analyzed, using natural language processing (NLP) models, to identify entities in the documents. The documents are processed with the NLP models to identify relationships among the entities, and each of the entities is stored in a data store, where the data store further includes an indication of the identified relationships among the entities. A draft correspondence is received, and it is determined that the draft correspondence includes a first entity and a second entity, where the first entity and the second entity have a first relationship. Upon determining that the first relationship conflicts with at least one of the relationships stored in the data store, a suggested revision for the draft correspondence is generated.

Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.

Abstract: An electromagnetic radiation (EMR) receiver is located upon a printed circuit board (PCB) glass security layer. EMR flux is transmitted by the glass security layer and received by the EMR receiver. When the PCB is subject to a tamper event the EMR transmitted by glass security layer is increased. A monitoring device that monitors the flux or interference pattern of the EMR received by the EMR receiver detects a change in flux or interference pattern and passes a tamper signal to one or more computer system devices to respond to the tamper event. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.

Abstract: In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate.

Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.

Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.

Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.

Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.

Abstract: A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.