Patents by Inventor Kevin M. O'Connell

Kevin M. O'Connell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10383216
    Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: August 13, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 10331911
    Abstract: An electromagnetic radiation (EMR) receiver is located upon a printed circuit board (PCB) glass security layer. EMR flux is transmitted by the glass security layer and received by the EMR receiver. When the PCB is subject to a tamper event the EMR transmitted by glass security layer is increased. A monitoring device that monitors the flux or interference pattern of the EMR received by the EMR receiver detects a change in flux or interference pattern and passes a tamper signal to one or more computer system devices to respond to the tamper event. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: June 25, 2019
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Patent number: 10299366
    Abstract: In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: May 21, 2019
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark. D. Plucinski, Timothy J. Tofil
  • Patent number: 10253157
    Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: April 9, 2019
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 10231356
    Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: March 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Christopher M. Marroquin, Kevin M. O'Connell, Mark D. Schultz, Shurong Tian
  • Publication number: 20180332719
    Abstract: A method and associated apparatus are disclosed for forming a conductive via that extends partly through a multi-layer assembly, wherein the method comprises forming a cavity from a surface of the multi-layer assembly to a first depth. The cavity extends through a plurality of layers of the multi-layer assembly. The plurality of layers comprises a healing layer comprising a plurality of microcapsules. Forming the cavity ruptures some of the plurality of microcapsules to release encapsulated material into the cavity. The released encapsulated material defines a second depth from the surface, the second depth being closer to the surface than the first depth. The method further comprises depositing conductive material within the cavity to form the conductive via that extends to the second depth.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 15, 2018
    Inventors: Matthew S. DOYLE, Joseph KUCZYNSKI, Phillip V. MANN, Kevin M. O'CONNELL
  • Patent number: 10076045
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: September 11, 2018
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Patent number: 10045437
    Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: August 7, 2018
    Assignee: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9992900
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: June 5, 2018
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Patent number: 9974202
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: May 15, 2018
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Publication number: 20180132345
    Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.
    Type: Application
    Filed: November 8, 2016
    Publication date: May 10, 2018
    Applicant: International Business Machines Corporation
    Inventors: Sarah K. Czaplewski, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Publication number: 20180124949
    Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.
    Type: Application
    Filed: November 6, 2017
    Publication date: May 3, 2018
    Inventors: Christopher M. MARROQUIN, Kevin M. O'CONNELL, Mark D. SCHULTZ, Shurong TIAN
  • Publication number: 20180116066
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Application
    Filed: October 26, 2016
    Publication date: April 26, 2018
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Publication number: 20180116067
    Abstract: A divider can be installed within an electronic equipment rack drawer to enhance the structural strength of the drawer. The divider can include two members, formed from plates of material, each member having a rectangular center section with a height spanning a distance between a top plate and an upper base plate of an electronic equipment rack drawer. The two members can each have a header and a footer extending outwardly from the center section. The headers can be attached to the top plate, and the footers can be attached to the upper base plate of the electronic equipment rack drawer. The center sections of the two members can be fastened, in an adjacent, coplanar orientation to each other.
    Type: Application
    Filed: August 15, 2017
    Publication date: April 26, 2018
    Inventors: Michael S. Good, Curtis E. Larsen, Kevin M. O'Connell
  • Patent number: 9937662
    Abstract: A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: April 10, 2018
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9940920
    Abstract: Disclosed aspects relate to managing a set of devices using a set of acoustic emission data which indicates device-health of the set of devices. The set of devices is coupled with a set of acoustic emission sensors. Based on the set of acoustic emission data, a triggering event related to a first device of the set of devices is detected. Using the set of acoustic emission data, an event response which includes a first modification with respect to operation of the first device is determined. Establishment of the event response which includes the first modification with respect to operation of the first device is initiated.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: April 10, 2018
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Publication number: 20180094113
    Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.
    Type: Application
    Filed: December 6, 2017
    Publication date: April 5, 2018
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Publication number: 20180098438
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
    Type: Application
    Filed: November 22, 2017
    Publication date: April 5, 2018
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Publication number: 20180084652
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.
    Type: Application
    Filed: November 21, 2017
    Publication date: March 22, 2018
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Patent number: 9915316
    Abstract: A system for mitigating vibration of a mass may include an elastic membrane enclosing at least one interior space and having an outer surface, where at least a bottom portion of the outer surface is coupled to a transportable supportive surface, and at least a top portion of the outer surface supports a load. The system may further include at least one port coupling the outer surface to the at least one interior space, where the port provides a source of fluid ingress into the interior space and fluid egress out of the interior space. The system may additionally include granular material distributed within the at least one interior space, where a packing density of the granular material is adjustable between a first jammed state having a first packing density of granular materials and a second jammed state having a second packing density of granular materials to accommodate different loads.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil