Patents by Inventor Kevin M. O'Connell

Kevin M. O'Connell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180056598
    Abstract: A shape memory polymer thermal interface material (SMP TIM) pad may be deformed to a deformed SMP TIM pad. The deformed SMP TIM pad may be mated to a first surface of a computing chip. A heat dissipating structure may be mated to the deformed SMP TIM pad opposite of the first surface of the computing chip. A loading force may be applied to the SMP TIM pad. The deformed SMP TIM pad may be heated to a reformation temperature. The heat dissipating structure may be fastened to the computing chip using one or more fasteners.
    Type: Application
    Filed: September 1, 2016
    Publication date: March 1, 2018
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9894801
    Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: February 13, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Christopher M. Marroquin, Kevin M. O'Connell, Mark D. Schultz, Shurong Tian
  • Publication number: 20180042123
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.
    Type: Application
    Filed: August 8, 2016
    Publication date: February 8, 2018
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Publication number: 20180027666
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 25, 2018
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Publication number: 20180027665
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 25, 2018
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Patent number: 9873774
    Abstract: Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: January 23, 2018
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9872399
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill vias during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a plug is inserted into each via and the plug is lowered to a depth just below a desired signal trace layer. A thin anti-electroplate coating is applied onto the walls of the via below the signal trace. Then the plugs are removed and a standard board plating process for the PCB is performed.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: January 16, 2018
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Patent number: 9872398
    Abstract: A method and structure are provided for implementing enhanced via creation without creating a via barrel stub. The need to backdrill during printed circuit board (PCB) manufacturing is eliminated. After the vias have been drilled, but before plating, a via plug with a specialized geometry and including a capillary is inserted into each via to allow electroplating on only preferred wall surfaces of the vias. Then a board plating process of the PCB manufacturing is performed.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: January 16, 2018
    Assignee: International Business Machines Corporation
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Publication number: 20180004980
    Abstract: An electromagnetic radiation (EMR) receiver is located upon a printed circuit board (PCB) glass security layer. EMR flux is transmitted by the glass security layer and received by the EMR receiver. When the PCB is subject to a tamper event the EMR transmitted by glass security layer is increased. A monitoring device that monitors the flux or interference pattern of the EMR received by the EMR receiver detects a change in flux or interference pattern and passes a tamper signal to one or more computer system devices to respond to the tamper event. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.
    Type: Application
    Filed: June 29, 2016
    Publication date: January 4, 2018
    Inventors: Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell
  • Publication number: 20170278505
    Abstract: Disclosed aspects relate to managing a set of devices using a set of acoustic emission data which indicates device-health of the set of devices. The set of devices is coupled with a set of acoustic emission sensors. Based on the set of acoustic emission data, a triggering event related to a first device of the set of devices is detected. Using the set of acoustic emission data, an event response which includes a first modification with respect to operation of the first device is determined. Establishment of the event response which includes the first modification with respect to operation of the first device is initiated.
    Type: Application
    Filed: March 28, 2016
    Publication date: September 28, 2017
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9732821
    Abstract: A system for mitigating vibration of a mass may include an elastic membrane enclosing at least one interior space and having an outer surface, where at least a bottom portion of the outer surface is coupled to a transportable supportive surface, and at least a top portion of the outer surface supports a load. The system may further include at least one port coupling the outer surface to the at least one interior space, where the port provides a source of fluid ingress into the interior space and fluid egress out of the interior space. The system may additionally include granular material distributed within the at least one interior space, where a packing density of the granular material is adjustable between a first jammed state having a first packing density of granular materials and a second jammed state having a second packing density of granular materials to accommodate different loads.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: August 15, 2017
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9726837
    Abstract: Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: August 8, 2017
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis, Kory W. Weckman
  • Patent number: 9721855
    Abstract: A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: August 1, 2017
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Publication number: 20170090129
    Abstract: Light can be transmitted between a light source and a light detector or target by using at least two mating connector sections of a light pipe connector. A protrusion of one of the connector sections is designed to be received within a receptacle of another of the connector sections, which can make the light pipe connector mechanically compliant. The two connector sections are fabricated from an optically transmissive material, and have optically reflective surfaces in orthogonal orientations to optically transmissive surfaces adjacent to the light source and the light detector. When the protrusion of one of the connector sections is engaged within the receptacle of another connector section, light can be transmitted through optically transmissive surfaces adjacent to a light source and a light detector, while the orthogonally oriented optically reflective surfaces direct light towards the light detector.
    Type: Application
    Filed: October 22, 2015
    Publication date: March 30, 2017
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis, Kory W. Weckman
  • Publication number: 20170037925
    Abstract: A system for mitigating vibration of a mass may include an elastic membrane enclosing at least one interior space and having an outer surface, where at least a bottom portion of the outer surface is coupled to a transportable supportive surface, and at least a top portion of the outer surface supports a load. The system may further include at least one port coupling the outer surface to the at least one interior space, where the port provides a source of fluid ingress into the interior space and fluid egress out of the interior space. The system may additionally include granular material distributed within the at least one interior space, where a packing density of the granular material is adjustable between a first jammed state having a first packing density of granular materials and a second jammed state having a second packing density of granular materials to accommodate different loads.
    Type: Application
    Filed: October 26, 2016
    Publication date: February 9, 2017
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Publication number: 20170042023
    Abstract: In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.
    Type: Application
    Filed: August 18, 2015
    Publication date: February 9, 2017
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Publication number: 20170042019
    Abstract: In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate.
    Type: Application
    Filed: August 6, 2015
    Publication date: February 9, 2017
    Inventors: Matthew S. Doyle, Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Publication number: 20160362224
    Abstract: A system for mitigating vibration of a mass may include an elastic membrane enclosing at least one interior space and having an outer surface, where at least a bottom portion of the outer surface is coupled to a transportable supportive surface, and at least a top portion of the outer surface supports a load. The system may further include at least one port coupling the outer surface to the at least one interior space, where the port provides a source of fluid ingress into the interior space and fluid egress out of the interior space. The system may additionally include granular material distributed within the at least one interior space, where a packing density of the granular material is adjustable between a first jammed state having a first packing density of granular materials and a second jammed state having a second packing density of granular materials to accommodate different loads.
    Type: Application
    Filed: June 11, 2015
    Publication date: December 15, 2016
    Inventors: Joseph Kuczynski, Kevin M. O'Connell, Chelsie M. Peterson, Mark D. Plucinski, Timothy J. Tofil
  • Patent number: 9508614
    Abstract: A method for aligning a chip onto a substrate is disclosed. The method includes, depositing a ferrofluid, onto a substrate that has one or more pads that electrically couple to a semiconductor layer. The method can include a chip with solder balls electrically coupled to the logic elements of the chip, which can be placed onto the deposited ferrofluid, where the chip is supported on the ferrofluid, in a substantially coplanar orientation to the substrate. The method can include determining if the chip is misaligned from a desired location on the substrate. The method can include adjusting the current location of the chip in response to determining that the solder balls of the chip are misaligned from the desired location on the pads of the substrate, until the chip is aligned in the desired location.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: November 29, 2016
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Patent number: 9494752
    Abstract: A method and structure are provided for implementing a dual optical and electrical land grid array (LGA) contact. A contact for electrical and optical connection between a module and a printed circuit board (PCB) includes material providing electrical connection and an integrated material providing an optical connection; and the contact is used in a land grid array (LGA) arrangement.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 15, 2016
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis