Abstract: A method is disclosed for facilitating conversational and non-conversational transactions between thin-clients and MFS-based IMS applications. The method includes storing conversation attributes associated with a conversational transaction between a thin-client and an MFS-based IMS application, the conversation attributes comprising connection information and conversation-specific information. Next, one or more transaction messages from the thin-client are preprocessed based on a transaction message type. The stored conversation attributes are updated in response changes in the conversation attributes caused by the one or more transaction messages. Then, a conversation output message is formatted for the thin-client.

Abstract: An apparatus is disclosed for facilitating conversational and non-conversational transactions between thin-clients and MFS-based IMS applications. The apparatus stores conversation attributes associated with a conversational transaction between a thin-client and an MFS-based IMS application, the conversation attributes comprising connection information and conversation-specific information. Next, one or more transaction messages from the thin-client are preprocessed based on a transaction message type. The stored conversation attributes are updated in response changes in the conversation attributes caused by the one or more transaction messages. Then, a conversation output message is formatted for the thin-client.

Abstract: A system is disclosed for facilitating conversational and non-conversational transactions between thin-clients and MFS-based IMS applications. The system includes components for storing conversation attributes associated with a conversational transaction between a thin-client and an MFS-based IMS application, the conversation attributes comprising connection information and conversation-specific information. Next, one or more transaction messages from the thin-client are preprocessed based on a transaction message type. The stored conversation attributes are updated in response changes in the conversation attributes caused by the one or more transaction messages. Then, a conversation output message is formatted for the thin-client.

Abstract: A method and system to transfer payment to a seller of a network-based commerce transaction are described herein. The method includes generating a risk model based on seller-specific criteria, and releasing funds from a holding account to the seller based on the risk model.

Abstract: The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Abstract: Polishing slurry is transported via piping to flow into the closed loop control system. First, the polishing slurry flows into the ultrasonic concentration detector. Original data of the polishing slurry that is determined by means of ultrasonic concentration detector is a fluid velocity at that time. This determined value can be converted into weight percent concentration at that time by memory data table. The converted data of weight percent concentration will be transmitted into program logic controller (PLC), and the data of liquid level volume in the distribution tank will be transmitted into program logic controller at present. The program logic controller will then analyze whether the quantity of oxidant is sufficient. If the quantity of oxidant does not reach the required criterion, the program logic controller will control the analog valve to transmit a supplementary quantity of oxidant into the distribution tank via the analog valve and piping.

Abstract: A pressure monitoring system arranged in a close loop circuit, intended to facilitate chemical mechanical polishing (CMP), is disclosed. The pressure monitoring circuit includes an air regulator, a pressure transducer, a pressure difference transducer and a pressure difference regulator. This hardware is equipped to facilitate finding three control parameters of the monitoring system—polishing pressure (Pp), pressure difference of the polishing pressure and a corresponding wafer pressure (Dp), and deviation of the output pressure difference from a set point pressure difference (Cp). By monitoring Pp, Dp and Cp, air streams in a CMP process can be effectively regulated on a real time basis and the troubleshooting procedure for the system hardware can be practically reduced.

Abstract: A substrate unit has a first surface and a corresponding second surface, and a plurality of nodes and at least a die pad are formed on the first surface of the substrate unit. A plurality of external nodes is formed on the second surface of the substrate unit, and the external nodes are electrically connected to the nodes. A multimedia chip has an active surface and a corresponding back surface, and a plurality of bonding pads are formed on the active surface of the multimedia chip. The back surface of the multimedia chip is adhered on the die pad of the substrate unit. A molding compound encapsulates the multimedia chip, the first surface of the substrate unit, and the conductive wires, and exposes the second surface of the substrate unit and the external nodes.

Abstract: A substrate unit has a first surface and a corresponding second surface, and a plurality of nodes and at least a die pad are formed on the first surface of the substrate unit. A plurality of external nodes is formed on the second surface of the substrate unit, and the external nodes are electrically connected to the nodes. A multimedia chip has an active surface and a corresponding back surface, and a plurality of bonding pads are formed on the active surface of the multimedia chip. The back surface of the multimedia chip is adhered on the die pad of the substrate unit. A molding compound encapsulates the multimedia chip, the first surface of the substrate unit, and the conductive wires, and exposes the second surface of the substrate unit and the external nodes.

Abstract: A substrate unit has a first surface and a corresponding second surface, and a plurality of nodes and at least a die pad are formed on the first surface of the substrate unit. A plurality of external nodes is formed on the second surface of the substrate unit, and the external nodes are electrically connected to the nodes. A multimedia chip has an active surface and a corresponding back surface, and a plurality of bonding pads are formed on the active surface of the multimedia chip. The back surface of the multimedia chip is adhered on the die pad of the substrate unit. A molding compound encapsulates the multimedia chip, the first surface of the substrate unit, and the conductive wires, and exposes the second surface of the substrate unit and the external nodes.

Abstract: A substrate unit has a first surface and a corresponding second surface, and a plurality of nodes and at least a die pad are formed on the first surface of the substrate unit. A plurality of external nodes is formed on the second surface of the substrate unit, and the external nodes are electrically connected to the nodes. A multimedia chip has an active surface and a corresponding back surface, and a plurality of bonding pads are formed on the active surface of the multimedia chip. The back surface of the multimedia chip is adhered on the die pad of the substrate unit. A molding compound encapsulates the multimedia chip, the first surface of the substrate unit, and the conductive wires, and exposes the second surface of the substrate unit and the external nodes.

Abstract: A method of plasma etching of silicon that utilizes the plasma to provide laterally defined recess structures through a mask. The method is based on the variation of the plasma parameters to provide a well-controlled anisotropic etch, while achieving a very high etch rate, and a high selectivity with respect to a mask. A mixed gas is introduced into the vacuum chamber after the chamber is evacuated, and plasma is generated within the chamber. The substrate's surface is exposed to the plasma. Power sources are used for formation of the plasma discharge. An integrated control system is used to modulate the plasma discharge power and substrate polarization voltage levels.

Abstract: The present invention relates to improved chemical mechanical polishing apparatus, which reduce air sharp pressure on the polish head for preventing the breakage unpolished wafer. The improved chemical mechanical polishing apparatus of present invention is composed of a wafer head, a polish head, a damper and a sensor. The flowing speed of gas is reduced by making the diameter of the gas line connected to the damper air inlet smaller than the diameter of the gas line connected to the damper air outlet. The initial air sharp pressure is reduced and make &Dgr;P=Pwafer−Ppolish<0, by adding an air temporary storage machine in between the inlet and the outlet.

Abstract: A method of plasma etching of silicon that utilizes the plasma to provide laterally defined recess structures through a mask. The method is based on the variation of the plasma parameters to provide a well-controlled anisotropic etch, while achieving a very high etch rate, and a high selectivity with respect to a mask. A mixed gas is introduced into the vacuum chamber after the chamber is evacuated, and plasma is generated within the chamber. The substrate's surface is exposed to the plasma. Power sources are used for formation of the plasma discharge. An integrated control system is used to modulate the plasma discharge power and substrate polarization voltage levels.

Abstract: The present invention is an ultra-thin circuit package with a thinned electronic device having a thickness of less than about 100 &mgr;m; a flexible circuit substrate; and an adhesive layer with a thickness of less than about 25 &mgr;m between the electronic device and the circuit substrate. The circuit package is less than about 275 &mgr;m thick. In another embodiment, the circuit packages may be stacked on one another and laminated together to create an extremely high-density three-dimensional electronic circuit package.

Abstract: A method of making a semiconductor package comprises applying a coating layer to a degating region of a substrate on which a runner and a gate of an encapsulating mold are located, allowing the adhesion between the coating layer and the surface of the substrate to be less than that between the coating layer and a molding compound subsequently molded over the coating layer. A semiconductor chip is then attached to the substrate followed by a cleaning treatment to the surfaces of the substrate and semiconductor chip. The semiconductor chip is then electrically connected to the substrate by wire bonding. After that, the molding compound is transfer molded to enclose the semiconductor chip and part of the surface of the substrate. The molding compound solidified and formed in the runner and gate of the encapsulating mold is then removed from the substrate by breaking away, together with the coating layer adhered thereto.

Abstract: An encapsulating method of a substrate-based electronic device of the present invention comprises:the substrate-based electronic device to be encapsulated is placed in the cavity of an encapsulating mold, then an encapsulant is put in a pot of the encapsulating mold, and said encapsulating mold is closed;said encapsulant in the pot is liquidized by heating, and let the liquidized encapsulant go in the cavity through a runner and a gate, and then fill in a semiconductor die;after the encapsulant filled in said semiconductor die is substantially solidified, said encapsulating mold is opened and an encapsulated substrate-based electronic device is taken out from said cavity;which is characterized by that, before encapsulant injection, a degate shim is pre-placed on the substrate of said substrate-based electronic device locating at the position where the runner passes through, in order to let this degate shim substantially makes said encapsulant have no contact with said substrate during injection of encapsulant

Abstract: A hologram decal structure including a photopolymer hologram layer having hologram fringes recorded therein, a transparent pressure sensitive adhesive layer disposed on a first surface of the photopolymer hologram layer, and a transparent urethane coating disposed on a second surface of the photopolymer hologram layer, and techniques for making the hologram decal.

Abstract: An encoded hologram that produces a first image and a second image pursuant to playback illumination, wherein the first image is resolvable by human vision while the second image is not resolvable by human vision when the playback illumination comprises non-coherent broad band illumination, and wherein the second image is machine readable when the hologram is illuminated with playback illumination that is based on the original reference beam.

Abstract: Multiple layers or holographic exposures and methods for preparing multiple layers of holographic exposures are described. The multiple layers of holographic exposure combine to form holographic stacks and are fabricated from layers of exposed and processed photosensitive recording films, each of which has at least one independently recorded hologram. The holographic stacks are useful for providing wide bandwidth holograms and holograms having superimposed images.