Abstract: A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 ?m, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

Abstract: A dispenser used for discharging a mixture of gas and a paste material includes: a nozzle part provided in a tip end part of a body and having a tip end opening through which the mixture is discharged; a flow path extending from a mixture introduction part to the tip end opening through a hollow space of the nozzle part; a needle part movable in the flow path of the nozzle part to open and close the flow path; a driving part that drives the needle part; and a stopper part that limits an operation range of the needle part. The nozzle part has a tapered section in which an inside diameter of the flow path of the nozzle part decreases toward the tip end opening. Also provided is a stopper position adjusting part that adjusts a stop position defined by the stopper part.

Abstract: The present invention allows measurement of a precise amount of gas by preventing sudden flow rate fluctuations of gas. A gas supply system 1a for a mixing-discharging apparatus 90 to mix gas and paste material includes a regulator 2 adapted to control pressure of gas supplied to the mixing-discharging apparatus, a flow meter 3 adapted to measure flow rate of the gas, a gas storage portion 4 adapted to store the gas, and a valve 5 adapted to open and close a gas introduction path 11 to the mixing-discharging apparatus 90. The flow meter 3 is placed in front of the gas storage portion 4 and behind the regulator 2 with respect to a flow of the gas.

Abstract: A dispenser for discharging a mixture of gas and paste material includes: a nozzle part (2) provided in a tip end part of a body (11) and having a tip end opening; a flow path (4) for the mixture extending from an introduction part (5) for the mixture to the tip end opening through a hollow space of the nozzle part; a needle part (3) movable in the flow path of the nozzle part to open and close the flow path; a driving part (7, 8, and 9) that drives the needle part; and a stopper part (10, 14, and 16) that limits an operation range of the needle part. The nozzle part has a tapered section in which an inside diameter of the flow path of the nozzle part relative to an operation range of a tip end of the needle part decreases toward the tip end opening.

Abstract: An object of the present invention is to provide a polyurethane composition, in which reduction in the strength of the foam is suppressed when the foam has been greatly deformed. The present invention relates to a polyurethane composition comprising a base resin and a curing agent, wherein the base resin comprises a compound (A-1) comprising a polyalkylene skeleton comprising neither an aromatic skeleton nor an alicyclic skeleton, and having two or more functional groups having an active hydrogen atom, a compound (A-2) comprising an aromatic skeleton and/or alicyclic skeleton, and having two or more functional groups having an active hydrogen atom, a blowing agent (B), and an amine-based catalyst (C); a polyurethane foam therefrom; and a method for soundproofing and reinforcing a vehicle.

Abstract: In order to provide a filling apparatus which is capable of advantageously delivering a foamable material having a necessary amount into a closed cross section of a vehicle body, in an embodiment of the present invention, there is provided a filling apparatus for filling a closed cross section of a vehicle body with a foamable material is provided, wherein the foamable material is a foamable two-liquid polyurethane material, wherein the filling apparatus comprises a delivering part for delivering the foamable material into the closed cross section of the vehicle body, and wherein the filling apparatus further comprises an input part into which a delivery command value and correction values to set a real delivery amount are input.

Abstract: In order to provide a filling apparatus which is capable of advantageously delivering a foamable material having a necessary amount into a closed cross section of a vehicle body, in an embodiment of the present invention, there is provided a filling apparatus for filling a closed cross section of a vehicle body with a foamable material is provided, wherein the foamable material is a foamable two-liquid polyurethane material, wherein the filling apparatus comprises a delivering part for delivering the foamable material into the closed cross section of the vehicle body, and wherein the filling apparatus further comprises an input part into which a delivery command value and correction values to set a real delivery amount are input.

Abstract: An object of the present invention is to provide a polyurethane composition, in which reduction in the strength of the foam is suppressed when the foam has been greatly deformed. The present invention relates to a polyurethane composition comprising a base resin and a curing agent, wherein the base resin comprises a compound (A-1) comprising a polyalkylene skeleton comprising neither an aromatic skeleton nor an alicyclic skeleton, and having two or more functional groups having an active hydrogen atom, a compound (A-2) comprising an aromatic skeleton and/or alicyclic skeleton, and having two or more functional groups having an active hydrogen atom, a blowing agent (B), and an amine-based catalyst (C); a polyurethane foam therefrom; and a method for soundproofing and reinforcing a vehicle.

Abstract: An apparatus for mixing a high-viscosity material with a gas and transferring the high-viscosity material mixed with the gas. The apparatus includes a piston pump, a high-viscosity material supply device for supplying a high-viscosity material to the cylinder, a gas supply device for supplying a gas to the cylinder, a piston drive device for driving the piston of the piston pump, a piston stopping device fixed in the cylinder for stopping the piston, a valve device for a high-viscosity material for selectively opening and closing a passage for communication between the high-viscosity material supply device and the cylinder of the piston pump, and a valve device for a gas for selectively opening and closing a passage for communication between the gas supply device and the cylinder of the piston pump.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: A gas mixing/supplying device and a method includes of introducing a gas into a high-viscosity material. The method the steps of effecting a first suction stroke in which the piston (25) is moved in the cylinder (27); supplying a high-viscosity material to the cylinder, using a suction force in the cylinder generated in said first suction stroke;stopping the piston after the first suction stroke; effecting a second suction stroke in which the piston is moved in the cylinder after the supply of the high-viscosity material; supplying a gas to the cylinder, using a suction force in the cylinder generated in the second suction stroke;effecting a pressurizing stroke in which the piston is moved in the cylinder after completion of the supply of the gas; and effecting a discharge stroke in which the high-viscosity material and the gas are discharged into a conduit. Then, the high-viscosity material is foamed under atmospheric pressure.

Abstract: A gas mixing/supplying device and a method includes of introducing a gas into a high-viscosity material. The method the steps of effecting a first suction stroke in which the piston (25) is moved in the cylinder (27); supplying a high-viscosity material to the cylinder, using a suction force in the cylinder generated in said first suction stroke; stopping the piston after the first suction stroke; effecting a second suction stroke in which the piston is moved in the cylinder after the supply of the high-viscosity material; supplying a gas to the cylinder, using a suction force in the cylinder generated in the second suction stroke; effecting a pressurizing stroke in which the piston is moved in the cylinder after completion of the supply of the gas; and effecting a discharge stroke in which the high-viscosity material and the gas are discharged into a conduit. Then, the high-viscosity material is foamed under atmospheric pressure.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: The present invention provides a small and inexpensive gas mixing/supplying device for introducing a gas into a high-viscosity material, by use of which a high-viscosity material can be directly supplied from a container such as a cartridge.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: A process of reinforcing a closed sectional portion of a vehicle body with a two-pack urethane foam composition. The process including the operations of injecting a two-pack urethane foam composition into the closed sectional portion of a vehicular body member; foaming and curing the two-pack urethane foam composition within said closed sectional portion; and then viewing the cured urethane foam-filling confirming opening to confirm whether the closed sectional portion has been sufficiently filled by the two-pack urethane foam composition. The closed sectional portion has a cured urethane foam-filling confirming opening, which is a hole extending through a wall of the closed sectional portion, The opening dimension of the cured urethane foam-filling confirming opening is 10 mm or less in order to assure rigidity of the vehicular body member.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.

Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.