Patents by Inventor Kirankumar Savandaiah

Kirankumar Savandaiah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11049701
    Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: June 29, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Adolph Miller Allen, William Johanson, Viachslav Babayan, Zhong Qiang Hua, Carl R. Johnson, Vanessa Faune, Jingjing Liu, Vaibhav Soni, Kirankumar Savandaiah, Sundarapandian Ramalinga Vijayalaks Reddy
  • Publication number: 20200357616
    Abstract: Embodiments of the invention generally provide a processing chamber used to perform a physical vapor deposition (PVD) process and methods of depositing multi-compositional films. The processing chamber may include: an improved RF feed configuration to reduce any standing wave effects; an improved magnetron design to enhance RF plasma uniformity, deposited film composition and thickness uniformity; an improved substrate biasing configuration to improve process control; and an improved process kit design to improve RF field uniformity near the critical surfaces of the substrate. The method includes forming a plasma in a processing region of a chamber using an RF supply coupled to a multi-compositional target, translating a magnetron relative to the multi-compositional target, wherein the magnetron is positioned in a first position relative to a center point of the multi-compositional target while the magnetron is translating and the plasma is formed, and depositing a multi-compositional film on a substrate.
    Type: Application
    Filed: July 24, 2020
    Publication date: November 12, 2020
    Inventors: Adolph Miller ALLEN, Lara HAWRYLCHAK, Zhigang XIE, Muhammad M. RASHEED, Rongjun WANG, Xianmin TANG, Zhendong LIU, Tza-Jing GUNG, Srinivas GANDIKOTA, Mei CHANG, Michael S. COX, Donny YOUNG, Kirankumar SAVANDAIAH, Zhenbin GE
  • Patent number: 10763090
    Abstract: Embodiments of the invention generally provide a processing chamber used to perform a physical vapor deposition (PVD) process and methods of depositing multi-compositional films. The processing chamber may include: an improved RF feed configuration to reduce any standing wave effects; an improved magnetron design to enhance RF plasma uniformity, deposited film composition and thickness uniformity; an improved substrate biasing configuration to improve process control; and an improved process kit design to improve RF field uniformity near the critical surfaces of the substrate.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: September 1, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Adolph Miller Allen, Lara Hawrylchak, Zhigang Xie, Muhammad M. Rasheed, Rongjun Wang, Xianmin Tang, Zhendong Liu, Tza-Jing Gung, Srinivas Gandikota, Mei Chang, Michael S. Cox, Donny Young, Kirankumar Savandaiah, Zhenbin Ge
  • Patent number: 10648071
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: May 12, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Siew Kit Hoi, John Mazzocco, Kirankumar Savandaiah, Prashant Prabhu
  • Patent number: 10546733
    Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments, a one-piece process kit shield includes a cylindrical body having an upper portion and a lower portion; a heat transfer channel extending through the upper portion; and a cover ring section extending radially inward from the lower portion.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: January 28, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kirankumar Savandaiah, Ryan Hanson, Ruxiao An
  • Patent number: 10312116
    Abstract: Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: June 4, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jallepally Ravi, Steven V. Sansoni, Kirankumar Savandaiah
  • Patent number: 10262877
    Abstract: Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: April 16, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sriskantharajah Thirunavukarasu, Kirankumar Savandaiah, Cheng-Hsiung Tsai, Kai Liang Liew
  • Patent number: 10199204
    Abstract: Embodiments of target retaining apparatus and substrate processing chambers incorporating same are provided herein. In some embodiments, a target retaining apparatus includes a housing including a first slot and a second slot; a cam movably disposed in the housing, wherein movement of the cam is constrained along the first slot; a retaining arm movably coupled to the cam, wherein movement of the retaining arm is constrained along the second slot; a linking member including a first end rotatably coupled to the cam and a second end rotatably coupled to the retaining arm; and a biasing element biasing the cam towards a first position in which the retaining arm extends away from the housing.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: February 5, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Srinivasa Yedla, Sundarapandian Reddy, Uday Pai, Kirankumar Savandaiah, Thanh X. Nguyen, Muhammad M. Rasheed, Jallepally Ravi
  • Publication number: 20190019658
    Abstract: Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 17, 2019
    Inventors: Irena H. Wysok, Kirankumar Savandaiah, Anthony Chih-Tung Chan, Jiao Song, Prashant Prabhu
  • Patent number: 10115573
    Abstract: Apparatus for extending process kit components lifetimes are disclosed. In some embodiments, a process kit includes: a first ring having an inner wall defining an inner diameter, an outer wall defining an outer diameter, an upper surface between the inner wall and the outer wall, and an opposing lower surface between the inner wall and the outer wall, wherein a first portion of the upper surface proximate the inner wall is concave, and wherein a second portion of the upper surface extends horizontally away from the first portion; and a second ring having an upper surface and an opposing lower surface, wherein a first portion of the lower surface is configured to rest upon the second portion of the first ring, wherein a second portion of the lower surface is convex and extends into but does not touch the concave first portion of the upper surface of the first ring.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: October 30, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Junqi Wei, Kirankumar Savandaiah, Ananthkrishna Jupudi, Zhitao Cao, Yueh Sheng Ow
  • Patent number: 10103012
    Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments, a one-piece process kit shield configured for use in a processing chamber for processing a substrate having a given diameter includes: a cylindrical body having an upper portion and a lower portion; an annular heat transfer channel disposed within the upper portion; and a cover ring section extending radially inward from the lower portion and having an annular leg extending from a bottom surface of the cover ring section, wherein the annular leg is configured to interface with a deposition ring to form a tortuous path between the bottom surface and the deposition ring.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: October 16, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah
  • Publication number: 20180151325
    Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 31, 2018
    Inventors: ADOLPH MILLER ALLEN, WILLIAM JOHANSON, VIACHSLAV BABAYAN, ZHONG QIANG HUA, CARL R. JOHNSON, VANESSA FAUNE, JINGJING LIU, VAIBHAV SONI, KIRANKUMAR SAVANDAIAH, SUNDARAPANDIAN RAMALINGA VIJAYALAKS REDDY
  • Publication number: 20180142340
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 24, 2018
    Inventors: WILLIAM JOHANSON, SIEW KIT HOI, JOHN MAZZOCCO, KIRANKUMAR SAVANDAIAH, PRASHANT PRABHU
  • Patent number: 9978569
    Abstract: Embodiments of the invention generally provide a process kit for use in a physical deposition chamber (PVD) chamber. In one embodiment, the process kit provides adjustable process spacing, centering between the cover ring and the shield, and controlled gas flow between the cover ring and the shield contributing to uniform gas distribution, which promotes greater process uniformity and repeatability along with longer chamber component service life.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: May 22, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Lara Hawrylchak, Kirankumar Savandaiah
  • Patent number: 9957601
    Abstract: Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad Rasheed, Kirankumar Savandaiah, Alan A. Ritchie, Isaac Porras, Keith A. Miller
  • Patent number: 9960023
    Abstract: Embodiments of the present disclosure include methods and apparatus for controlling titanium-tungsten (TiW) target nodule formation. In some embodiments, a target includes: a source material comprising predominantly titanium (Ti) and tungsten (W), formed from a mixture of titanium powder and tungsten powder, wherein a grain size of a predominant quantity of the titanium powder is less than or equal to a grain size of a predominant quantity of the tungsten powder.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Junqi Wei, Zhitao Cao, Yueh Sheng Ow, Ananthkrishna Jupudi, Kirankumar Savandaiah, Xin Wang, Sriskantharajah Thirunavukarasu
  • Patent number: 9960021
    Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Uday Pai, William Fruchterman, Keith A. Miller, Muhammad M. Rasheed, Thanh X. Nguyen, Kirankumar Savandaiah
  • Patent number: 9953812
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes: a one-piece process kit shield having a cylindrical body having an upper portion and a lower portion; an adapter section extending radially outward and having a resting surface to support the one-piece process kit shield on walls of a chamber and a sealing surface on which a chamber lid rests to seal off an inner volume of the chamber when the one-piece process kit shield is placed in the chamber; a heat transfer channel extending through the adapter section; and a protruding section extending radially inward from the lower portion; a resting bracket having an upper portion coupled to the adapter section and a lower portion extending radially inward; a cover ring disposed beneath the protruding section; and a deposition ring disposed beneath the cover ring.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 24, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Xin Wang, Prashant Prabhu
  • Patent number: D851613
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 18, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Anthony Chih-Tang Chan, Siew Kit Hoi, Prashant Prabhakar Prabhu
  • Patent number: D894137
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: August 25, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Anthony Chih-Tang Chan, Siew Kit Hoi, Prashant Prabhakar Prabhu