Abstract: According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic board, and a second electrode layer is formed on the second surface of the ceramic board. The first electrode layer and the second electrode layer are not electrically connected to each other. A first copper plated layer as a wiring pattern is formed on the first electrode layer, and a second copper plated layer is formed on the second electrode layer. The first copper plated layer and the second copper plated layer are not electrically connected to each other. A heat spreader is thermally connected to the second copper plated layer.

Abstract: According to one embodiment, a luminaire includes a light-emitting part to emit a blue light with a peak wavelength of 430 nanometers or more and less than 460 nanometers, and a phosphor that is excited by the emitted light of the light-emitting part and emits a light having a color different from blue. In an emission spectrum including the emitted light of the light-emitting part and the light emitted from the phosphor, an intensity peak in a range of a light wavelength of 430 nanometers to 490 nanometers is in a range of a wavelength of 470 nanometers to 490 nanometers.

Abstract: A bulb-type lamp includes a base body, a heat pipe, a light-emitting body, a cap and a lighting circuit. One end side of the heat pipe protrudes from one end side of the base body, and the other end side of the heat pipe is connected to the one end side of the base body. The light-emitting body includes plural LED elements, is connected to the one end side of the heat pipe, and is attached to the heat pipe to enable heat conduction. The cap is provided at the other end side of the base body. The lighting circuit is housed in the base body.

Abstract: A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing.

Abstract: A light source module includes a module substrate, a metal conductor, a plurality of semiconductor light emitting elements, a white diffuse reflection layer, and translucent sealing members. The metal conductor is provided in a predetermined pattern on a front surface of the module substrate. The semiconductor light emitting elements are electrically connected to the metal conductor and mounted on the front surface of the module substrate. The white diffuse reflection layer includes a plurality of holes in which the semiconductor light emitting elements are located, is thinner than the semiconductor light emitting elements, and is laminated to the front surface of the module substrate. The translucent sealing members bury the semiconductor light emitting elements, project below the diffuse reflection layer, and are mixed with a phosphor.

Abstract: According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Abstract: According to one embodiment, a light-emitting device includes a substrate, a reflecting layer formed on the substrate, a light-emitting element placed on the reflecting layer, and a sealing resin layer that covers the reflecting layer and the light-emitting element. The oxygen permeability of the sealing resin layer is equal to or lower than 1200 cm3/(m2·day·atm), and the ratio of the area of the reflecting layer covered by the sealing resin layer to the entire area on the resin substrate covered by the sealing resin layer is between 30% and 75% inclusive.

Abstract: A lamp with ferrule 10 includes a substrate 12 in which a solid light-emitting device 11 is implemented on one surface side thereof; a thermal radiation member 14 which is fixed to the other surface side of the substrate 12 by a fluid fixing member 13 having thermal conductivity; a light-emitting portion 15 constituted by the substrate 12 and the thermal radiation member 14; a thermally conductive support member 17 which constitutes a three-dimensional light source body 16 using a plurality of light-emitting portions 15; a thermally conductive main body 18 which is provided with the support member 17 so as to project the three-dimensional light source body 16 to the one end portion side; and a ferrule member 19 that is provided on the other end portion side of the main body 18.

Abstract: According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.

Abstract: A light-emitting device includes a substrate having a front surface on which a semiconductor light-emitting element is mounted. A front cover is provided which thermally contacts the front surface of the substrate at a periphery of the semiconductor light-emitting element and is disposed on a front side of the substrate. A heat conduction path is formed along which heat generated by the semiconductor light-emitting element is conducted in order of the substrate and the front cover and the heat is radiated from a front surface of the front cover, so that a heat radiation property from a front surface of the light-emitting device is improved.

Abstract: The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.

Abstract: According to one embodiment, a light emitting device includes a substrate, a lead pattern and a plurality of mounting pads, and a plurality of light emitting elements. The substrate includes an insulating layer. The lead pattern and the plurality of mounting pads are formed on a surface of the substrate. The lead pattern and the plurality of mounting pads are conductive. The plurality of mounting pads are configured not to electrically conduct. The lead pattern is configured to electrically conduct. The plurality of light emitting elements are mounted on the mounting pads and electrically connected to the lead pattern.

Abstract: A light-emitting device includes a substrate, and a plurality of light-emitting elements mounted on the substrate. The light-emitting elements are placed to meet conditions that the number B of light-emitting elements per unit area (cm2) of a mounting part is not less than 0.4 and a mean mounting density D is not less than 58 to not greater than 334, when a relationship of formula “D=A×B” is established, assuming D as a mean mounting density of light-emitting elements on a substrate, A as a current (mA) flowing through one light-emitting element, and B as the number of light-emitting elements per unit area (cm2) of a substantial mounting part for light-emitting elements.