Abstract: In double-side polishing of semiconductor wafers, not only the two main surfaces but also the surface of the edge portion can be polished in one operation with cost reduction and freedom from contamination. An apparatus with twin polishing turn tables is used in the double-side polishing and the inner peripheral edge of each carrier hole formed in a wafer carrier is profiled such that the sectional profile of the inner peripheral edge is substantially the copy of the edge of the wafer placed in the hole.

Abstract: A method of evaluating quantitatively in a design stage degrees of difficulty of works and processings to be performed on an article or parts at various stage of life thereof such as manufacturing, sale, use, maintenance/inspection/repair, recovery, dismantling, disassembling, recycling for resources, nontoxication and scrapping. Part elimination scores E.sub.i representing degrees of difficulty of the works and processings to be performed on the parts are regarded to be a function of indexes indicating the degrees of difficulty of the works and the processings for the parts and expressed by E.sub.i =f(G.sub.i), while an article evaluation score E representing the degrees of difficulty of the work and the processing for the article is regarded to be a function of a mean value of the part evaluation scores E.sub.i or an index G (=.SIGMA.G.sub.i) indicating the degrees of difficulty of the work and the processing for the article and expressed by E=f(G)=f(.SIGMA.G.sub.i).

Abstract: A semiconductor wafer polishing agent contains mainly a silica containing polishing agent and is added with a polyolefin type fine particle material. The novel semiconductor wafer polishing agent is capable of low brightness polishing to the back face of the wafer, sensor detection of the front and back faces of the wafer, and suppression of dust to be generated by chipping of the back face of the wafer, thereby to increase the yield of semiconductor devices. A polishing method using the polishing agent and a novel semiconductor wafer having a back face with an unconventional surface shape are also disclosed.

Abstract: A duplex pallet for the transport or storage of articles of the present invention has a deck surface easily switchable between a configuration matching with, e.g., the ISO (International Standards Organization) standards and a configuration matching with, e.g., JIS (Japanese Industrial Standards). While the deck surface is held in the configuration matching with the ISO standards, a hook and a contact guide are respectively released from a clamp post and a pallet body so as to release one longer edge of a movable deck from one shorter edge of the pallet body. Subsequently, the movable deck is rotated away from the pallet body by 90 degrees, then shifted inward, and then further rotated in the same direction by 180 degrees until the hook mates with another clamp post. At the same time, another contact guide is inserted into a space between an upper deck and a lower deck.

Abstract: A semiconductor wafer polishing agent contains mainly a silica containing polishing agent and is added with a polyolefin type fine particle material. The novel semiconductor wafer polishing agent is capable of low brightness polishing to the back face of the wafer, sensor detection of the front and back faces of the wafer, and suppression of dust to be generated by chipping of the back face of the wafer, thereby to increase the yield of semiconductor devices. A polishing method using the polishing agent and a novel semiconductor wafer having a back face with an unconventional surface shape are also disclosed.

Abstract: A keratan sulfate hydrolase of an endo-.beta.-N-acetylglucosaminidase type, obtained by culturing Bacillus circulans such as Bacillus circulans KsT202, has reactivity on keratan polysulfate at high concentrations, an optimum pH of 4.5-6, stability at a pH of 6-7, an optimum temperature of 50.degree.-60.degree. C., thermostability at a temperature of 45.degree. C., and a molecular weight of approximately 200,000 dalton.

Abstract: A method of manufacturing semiconductor mirror wafers includes a double side primary mirror polishing step and a single side final mirror polishing step. The method having the double side mirror polishing step is capable of higher flatness level wafer processing, suppression of fine dust or particles, thereby to increase the yield of semiconductor devices, higher productivity due to simplification of processes, higher quality processing with lower manufacturing cost than conventional methods.

Abstract: A polishing pad composed of a rigid polyurethane added with CaCO.sub.3 particles is able to provide polished wafers having a surface roughness which is comparable to that attained by the conventional final polishing process. Even when polishing is achieved under a high load condition to improve the productivity, the polished wafers are free from deformation, such as concaving, and have an excellent flatness.

Abstract: A method of manufacturing semiconductor mirror wafers includes a double side primary mirror polishing step, a back side low brightness polishing step and a front side final mirror polishing step, wherein a silica containing polishing agent is used together with a polyolefin type fine particle material for the back side low brightness polishing. The method is capable of low brightness polishing of the back side, sensor detection of the front and back sides, suppression of generation of fine dust or particles from back side, thereby to increase the yield of semiconductor devices, manufacturing mirror wafers with higher flatness level, and higher productivity due to simplification of processes.

Abstract: A bearing includes a bearing portion and an oil basin. The bearing portion is formed integrally with a side frame and projects cylindrically from a surface of the side frame. The oil basin is integrally formed with the bearing portion and annularly provided to part of the bearing portion. The oil basin has a recessed groove for storing oil between a rotating shaft inserted in the bearing portion and an inner circumferential surface of the bearing portion. A method of forming the bearing is also disclosed.

Abstract: The invention provides N-phenyltetrahydrophthalamic acid derivatives represented by the general formula ?I!, methods of producing the same, herbicides containing the same as the effective components, imidoylchloride derivatives as the intermediate products and methods of producing the same, ##STR1## wherein X and Y each individually represent hydrogen atoms or halogen atoms, R.sup.1 represents a lower alkoxycarbonylalkylthio group, R.sup.2 represents a lower alkyl group, a halogenated lower alkyl group or a substituted or unsubstituted phenyl group, and R.sup.3 represents a lower alkoxy group, a lower alkenyloxy group, a lower alkynyloxy group, or a lower alkoxyalkoxy group. The herbicides of the present invention, which are very useful, can be widely applied to upland, paddy field, orchard, turf, forest, non-crop land, etc., and are not harmful to crops.

Abstract: A polishing agent used for polishing a silicon wafer is composed of a colloidal silica polishing agent containing an ethyl silicate monomer and/or an ethyl silicate polymer. Even when the polishing agent is used with a rigid polishing pad, it is able to provide a polished wafer having an excellent flatness and whose surface has a roughness comparable to that obtained by the conventional final polishing process.

Abstract: A method of evaluating quantitatively in a design stage degrees of difficulty of works and processings to be performed on an article or parts at various stage of life thereof such as manufacturing, sale, use, maintenance/inspection/repair, recovery, dismantling, disassembling, recycling for resources, nontoxication and scrapping. Part elimination scores E.sub.i representing degrees of difficulty of the works and processings to be performed on the parts are regarded to be a function of indexes indicating the degrees of difficulty of the works and the processings for the parts and expressed by E.sub.i =f(G.sub.i), while an article evaluation score E representing the degrees of difficulty of the work and the processing for the article is regarded to be a function of a mean value of the part evaluation scores E.sub.i or an index G (.SIGMA.G.sub.i) indicating the degrees of difficulty of the work and the processing for the article and expressed by E=f(G)=f(.SIGMA.G.sub.i).

Abstract: The invention provides N-acyl-N-phenylmaleamic acid derivatives represented by the general formula I!, a method of producing the same, and a herbicide containing the same as the effective components, ##STR1## wherein X and Y each individually represent hydrogen atoms or halogen atoms, R.sup.1 represents a hydrogen atom, a halogen atom, a lower alkyl group, a lower alkenyl group, a lower alkynyl group, a lower alkoxyalkyl group or a lower alkoxycarbonylalkyl group, R.sup.2 represents a lower alkyl group, a halogenated lower alkyl group or a substituted or unsubstituted phenyl group, R.sup.3 represents a hydrogen atom or a lower alkyl group, and R.sup.4 represents a hydroxyl, a lower alkoxy group, a lower alkenyloxy group, a lower alkynyloxy group, a lower alkoxyalkoxy group, a benzyloxy group or a lower alkoxycarbonylalkoxy group. This herbicide which is very useful can be widely applied to upland, paddy field, orchard, turf, forest, non-crop land, etc., and is not harmful to crops.

Abstract: The invention provides N-aryloxyacyl-N-phenyltetrahydrophthalamic acid derivatives represented by the general formula [I], a method of producing the same, and a herbicide containing the same as the effective components, ##STR1## wherein X and Y each individually represent hydrogen atoms or halogen atoms, Ar represents a substituted or unsubstituted phenyl group or naphthyl group, R.sup.1 represents a hydrogen atom, a halogen atom, a lower alkyl group, a lower alkoxy group, a lower alkenyloxy group, a lower alkynyloxy group, a lower alkoxyalkoxy group or a lower alkoxycarbonylalkoxy group, R.sup.2 represents a hydrogen atom or a lower alkyl group, R.sup.3 represents a hydroxyl, a lower alkoxy group, a lower alkenyloxy group, a lower alkynyloxy group, a lower alkoxyalkoxy group, a benzyloxy group or a lower alkoxycarbonylalkoxy group, and m is an integer ranging from 0 to 5. This herbicide which is very useful can be widely applied to upland, paddy field, orchard, turf, forest, non-crop land, etc.

Abstract: The invention provides N-acyl-N-phenyltetrahydrophthalamic acid derivatives represented by the general formula [I], methods of producing the same, herbicides containing the same as the effective components, imidoylchloride derivatives as the intermediate products and methods of producing the same, ##STR1## wherein R.sup.1 represents an alkyl group, an alkenyl group, an alkynyl group, an alkoxyalkyl group, a haloalkyl group, a haloalkenyl group, a haloalkynyl group or a cyanoalkyl group, R.sup.2 represents a lower alkyl group or a halogenated lower alkyl group, and R.sup.3 represents a lower alkoxy group, a lower alkenyloxy group, a lower alkynyloxy group, a lower alkoxyalkoxy group, a substituted or unsubstituted benzyloxy group, a lower haloalkyloxy group or a lower alkoxycarbonylalkoxy group. The herbicides of the present invention, which are very useful, can be widely applied to upland, paddy field, orchard, turf, forest, non-crop land, etc., and are not harmful to crops.