Patents by Inventor Klaus Elian

Klaus Elian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including a magnetic sensor chip
    Patent number: 8362579
    Abstract: A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: January 29, 2013
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Klaus Elian, Martin Petz
  • Sensor
    Patent number: 8289019
    Abstract: A sensor including a substrate and magnetic material. The substrate has a main major surface and includes at least two spaced apart ferromagnetic layers. The magnetic material encapsulates the substrate such that the magnetic material is adjacent the main major surface.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: October 16, 2012
    Assignee: Infineon Technologies AG
    Inventors: Adolf Koller, Klaus Elian
  • Pressure sensor and method
    Patent number: 8278727
    Abstract: A method for providing a pressure sensor substrate comprises creating a first cavity that extends inside the substrate in a first direction perpendicular to a main surface of the substrate, and that extends inside the substrate, in a second direction perpendicular to the first direction, into a first venting area of the substrate; creating a second cavity that extends in the first direction inside the substrate, that extends in parallel to the first cavity in the second direction, and that does not extend into the first venting area; and opening the first cavity in the first venting area.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: October 2, 2012
    Assignee: Infineon Technologies AG
    Inventors: Thoralf Kautzsch, Marco Müller, Dirk Meinhold, Ben Rosam, Klaus Elian, Stefan Kolb
  • Semiconductor device including a magnetic sensor chip
    Patent number: 8253210
    Abstract: A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: August 28, 2012
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Klaus Elian
  • Method for multiple irradiation of a resist
    Patent number: 8227177
    Abstract: The invention relates to a method with contrast reversal which, inter alia, opens up new areas of application for resists.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: July 24, 2012
    Assignee: Infineon Technologies AG
    Inventors: Kang-Hoon Choi, Klaus Elian, Christoph Hohle, Johannes Kretz, Frank Thrum
  • SENSOR DEVICE AND METHOD
    Publication number: 20120126344
    Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
    Type: Application
    Filed: January 26, 2012
    Publication date: May 24, 2012
    Applicant: Infineon Technologies AG
    Inventors: Klaus Elian, Georg Meyer-Berg, Horst Theuss
  • Sensor device having a porous structure element
    Patent number: 8124953
    Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: February 28, 2012
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Georg Meyer-Berg, Horst Theuss
  • Sensor Package and Method of Manufacturing Thereof
    Publication number: 20120038352
    Abstract: A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment comprises a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on and/or around the encapsulation, wherein the soft magnet comprises a composition of an insulating material and a material having soft magnetic properties.
    Type: Application
    Filed: August 16, 2010
    Publication date: February 16, 2012
    Inventors: Klaus Elian, Horst Theuss, Guenther Ruhl
  • Semiconductor Package with Integrated Inductor
    Publication number: 20110298088
    Abstract: A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.
    Type: Application
    Filed: June 7, 2010
    Publication date: December 8, 2011
    Inventors: Klaus Elian, Horst Theuss, Georg Meyer-Berg
  • Semiconductor Package
    Publication number: 20110241190
    Abstract: A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation.
    Type: Application
    Filed: March 31, 2010
    Publication date: October 6, 2011
    Inventors: Klaus Elian, Beng-Keh See, Horst Theuss
  • Bias field generation for a magneto sensor
    Publication number: 20110187359
    Abstract: Embodiments related to the generation of magnetic bias fields for a magneto sensor are described and depicted.
    Type: Application
    Filed: March 17, 2011
    Publication date: August 4, 2011
    Inventors: Tobias Werth, Klaus Elian, Robert Hermann, James Sterling
  • Pressure Sensor and Method
    Publication number: 20110163395
    Abstract: A method for providing a pressure sensor substrate comprises creating a first cavity that extends inside the substrate in a first direction perpendicular to a main surface of the substrate, and that extends inside the substrate, in a second direction perpendicular to the first direction, into a first venting area of the substrate; creating a second cavity that extends in the first direction inside the substrate, that extends in parallel to the first cavity in the second direction, and that does not extend into the first venting area; and opening the first cavity in the first venting area.
    Type: Application
    Filed: January 4, 2010
    Publication date: July 7, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Thoralf Kautzsch, Marco Müller, Dirk Meinhold, Ben Rosam, Klaus Elian, Stefan Kolb
  • Electronic device and method of manufacturing same
    Patent number: 7964448
    Abstract: This application relates to a method of manufacturing a semiconductor device comprising: providing a metal carrier; placing the metal carrier into a mold for forming a molded structure holding the metal carrier; segmenting the metal carrier into at least two disconnected metal carrier segments; and attaching a semiconductor chip to the molded structure.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: June 21, 2011
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Jochen Dangelmaier
  • GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER
    Publication number: 20110127998
    Abstract: An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.
    Type: Application
    Filed: November 30, 2009
    Publication date: June 2, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Elian, Martin Petz, Uwe Schindler, Horst Theuss, Adolf Koller
  • Method for structuring a substrate using a metal mask layer formed using a galvanization process
    Patent number: 7928011
    Abstract: A method and intermediate product for structuring a substrate is disclosed. At least one seed layer including a first metal compound is positioned at least partially on the substrate. The seed layer is subjected to a solution comprising ions of a second metal compound. The ions are reduced in the solution by reduction means so that the second metal compound is deposited as mask layer on the seed layer.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: April 19, 2011
    Assignee: Qimonda AG
    Inventors: Klaus Elian, Michael Sebald
  • Bias field generation for a magneto sensor
    Publication number: 20110068779
    Abstract: Embodiments related to the generation of magnetic bias fields for a magneto sensor are described and depicted.
    Type: Application
    Filed: September 17, 2010
    Publication date: March 24, 2011
    Inventors: Tobias WERTH, Klaus ELIAN, James STERLING
  • SEMICONDUCTOR DEVICE
    Publication number: 20100295140
    Abstract: A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic.
    Type: Application
    Filed: May 20, 2009
    Publication date: November 25, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Horst Theuss, Klaus Elian, Martin Petz
  • SEMICONDUCTOR DEVICE
    Publication number: 20100276769
    Abstract: A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer.
    Type: Application
    Filed: April 30, 2009
    Publication date: November 4, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Horst Theuss, Klaus Elian
  • SENSOR DEVICE AND METHOD
    Publication number: 20100230766
    Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 16, 2010
    Applicant: Infineon Technologies AG
    Inventors: Klaus Elian, Georg Meyer-Berg, Horst Theuss
  • Sensor device including two sensors embedded in a mold material
    Patent number: 7793550
    Abstract: A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded the first and second sensors.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: September 14, 2010
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Albert Auburger