Patents by Inventor Klaus Reingruber

Klaus Reingruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device and Method of Manufacturing a Semiconductor Device Including Grinding Steps
    Publication number: 20130049205
    Abstract: A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.
    Type: Application
    Filed: August 25, 2011
    Publication date: February 28, 2013
    Applicant: Intel Mobile Communications GmbH
    Inventors: Thorsten Meyer, Klaus Reingruber, David O'Sullivan