Abstract: A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

Abstract: In order to provide a semiconductor IC unit such as a microprocessor, etc., which satisfies both fast operation and lower power consumption properties with its high quality kept, the semiconductor IC unit of the present invention is composed so as to include a main circuit (LOG) provided with transistors, which is formed on a semiconductor substrate, and a substrate bias controlling circuit (VBC) used for controlling a voltage to be applied to the substrate, and the main circuit includes switching transistors (MN1 and MP1) used for controlling a voltage to be applied to the substrate and control signals output from the substrate bias controlling circuit is entered to the gate of each of the switching transistors and the control signal is returned to the substrate bias controlling circuit.

Abstract: A semiconductor integrated circuit with memory redundancy circuit to address the problems of increased area, power consumption and access time which is caused by using an ECC circuit for error correction. The circuit comprises: a plurality of memory mats; a local bus, parallel to word lines, which transfers read data and write data from memory cells; a global bus for writing, parallel to data lines, which transfers write data from an input pad IO; a global bus for reading, parallel to data lines, which transfers read data to an output pad IO; and at least one error correction circuit located at an intersection of the global buses and the local bus. Reading and writing may each be completed in a single cycle, and during a write operation, data which is different from data previously read is written. By this configuration, an increase in area and power consumption can be avoided and errors such as soft errors can be corrected.

Abstract: The semiconductor integrated circuit has so-called SOI type first MOS transistors (MNtk, MPtk) and second MOS transistors (MNtn, MPtn). The first MOS transistors have a gate isolation film thicker than that the second MOS transistors have. The first and second MOS transistors constitute a power-supply-interruptible circuit (6) and a power-supply-uninterrupted circuit (7). The power-supply-interruptible circuit has the first MOS transistors each constituting a power switch (10) between a source line (VDD) and a ground line (VSS), and the second MOS transistors connected in series with the power switch. A gate control signal for the first MOS transistors each constituting a power switch is made larger in amplitude than that for the second MOS transistors. This enables power-source cutoff control with a high degree of flexibility commensurate with the device isolation structure, which an SOI type semiconductor integrated circuit has originally.

Abstract: A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

Abstract: An integrated circuit device includes at least one functional module which outputs save data in synchronism with a saving clock signal, a power supply control unit which selects one of the functional modules, and controls stop and resumption of power supply to the selected functional module, a save data storage unit which stores save data output from a functional module selected by the power supply control unit, and an error checking and correction unit which performs error checking and correction for the save data stored in the save data storage unit when the save data is to be restored to the functional module in synchronism with a restoration clock signal.

Abstract: A static memory cell, composed of cross-coupled MOS transistors having a relatively high threshold voltage, is equipped with MOS transistors for controlling the power supply line voltage of the memory cell. To permit the voltage difference between two data storage nodes in the inactivated memory cell to exceed the voltage difference between the two nodes when write data is applied from a data line pair DL and /DL to the two nodes in the activated memory cell, the power supply line voltage control transistors are turned on to apply a high voltage VCH to the power supply lines after the word line voltage is turned off. The data holding voltage in the memory cell can be activated to a high voltage independent of the data line voltage, and the data holding voltage can be dynamically set so that read and write operations can be performed at high speed with low power consumption.

Abstract: A static memory cell, composed of cross-coupled MOS transistors having a relatively high threshold voltage, is equipped with MOS transistors for controlling the power supply line voltage of the memory cell. To permit the voltage difference between two data storage nodes in the inactivated memory cell to exceed the voltage difference between the two nodes when write data is applied from a data line pair DL and /DL to the two nodes in the activated memory cell, the power supply line voltage control transistors are turned on to apply a high voltage VCH to the power supply lines after the word line voltage is turned off. The data holding voltage in the memory cell can be activated to a high voltage independent of the data line voltage, and the data holding voltage can be dynamically set so that read and write operations can be performed at high speed with low power consumption.

Abstract: A memory using an SRAM memory cell intended for low-voltage operation is designed to decrease the threshold value of MOS transistors constituting the memory cell without substantial decrease in the static noise margin, which is the operational margin of the memory cell. To this end, a voltage Vdd? higher than a power supply voltage Vdd of a power supply line for peripheral circuits is supplied from a power supply line for memory cells as a power supply voltage for memory cells. Since the conductance of driver MOS transistors is in-creased, the threshold voltage of the MOS transistors within the memory cells can be reduced without reducing the static noise margin. Further the ratio of width between the driver MOS transistor and a transfer MOS transistor can be set to 1, thereby allowing a reduction in the memory cell area.

Abstract: A semiconductor device having a functional circuit block with predictive power controller is provided so as to construct a system LSI manufactured in a practicable number of design steps, which is extensible and in which power is reduced. The functional circuit block includes a prediction circuit and a predictive power shutdown circuit having a power status control circuit. The prediction circuit controls a power status of the functional circuit block by using the power status control circuit, based on input information thereto. When no information is inputted for a predetermined a period of time, the power status control circuit shifts from a power status of the functional circuit block to a low-power status.

Abstract: A semiconductor integrated circuit with memory redundancy circuit to address the problems of increased area, power consumption and access time which is caused by using an ECC circuit for error correction. The circuit comprises: a plurality of memory mats; a local bus, parallel to word lines, which transfers read data and write data from memory cells; a global bus for writing, parallel to data lines, which transfers write data from an input pad IO; a global bus for reading, parallel to data lines, which transfers read data to an output pad IO; and at least one error correction circuit located at an intersection of the global buses and the local bus. Reading and writing may each be completed in a single cycle, and during a write operation, data which is different from data previously read is written. By this configuration, an increase in area and power consumption can be avoided and errors such as soft errors can be corrected.

Abstract: A semiconductor integrated circuit device which includes a logical circuit containing a MIS transistor on a semiconductor substrate, a control circuit for controlling a threshold voltage of the MIS transistor in the logical circuit, an oscillation circuit containing a MIS transistor on the semiconductor substrate, and a buffer circuit, the control circuit compares the frequency of the oscillation output and frequency of a clock signal to output a first control signal, the first control signal controls a threshold voltage of the MIS transistor of the oscillation circuit, and the buffer circuit is inputted with the first control signal to output a second control signal corresponding to the first control signal, the second control signal controlling the threshold voltage of the MIS transistor of the logical circuit.

Abstract: A memory using an SRAM memory cell intended for low-voltage operation is designed to decrease the threshold value of MOS transistors constituting the memory cell without substantial decrease in the static noise margin, which is the operational margin of the memory cell. To this end, a voltage Vdd? higher than a power supply voltage Vdd of a power supply line for peripheral circuits is supplied from a power supply line for memory cells as a power supply voltage for memory cells. Since the conductance of driver MOS transistors is increased, the threshold voltage of the MOS transistors within the memory cells can be reduced without reducing the static noise margin. Further the ratio of width between the driver MOS transistor and a transfer MOS transistor can be set to 1, thereby allowing a reduction in the memory cell area.

Abstract: A data retaining circuit has been disclosed in which, even if a soft error occurs, it is corrected and a normal value can be maintained, the configuration is simple, and high-speed operations are enabled. In this circuit, when a soft error occurs in the data to be put out, it is corrected by a pull-up path or a pull-down path, and when a soft error occurs in the data in the pull-up path or the pull-down path, the error data in the pull-up path or the pull-down path is prevented from affecting each other, as well as turning off the correcting function to prevent the influence on the data to be put out.

Abstract: A data retaining circuit has been disclosed in which, even if a soft error occurs, it is corrected and a normal value can be maintained, the configuration is simple, and high-speed operations are enabled. In this circuit, when a soft error occurs in the data to be put out, it is corrected by a pull-up path or a pull-down path, and when a soft error occurs in the data in the pull-up path or the pull-down path, the error data in the pull-up path or the pull-down path is prevented from affecting each other, as well as turning off the correcting function to prevent the influence on the data to be put out.

Abstract: To reduce cost of defect redundancy and trimming in a semiconductor integrated circuit having multiple layer wirings and copper wirings, an address for salvaging a defect of a memory cell array in a semiconductor is stored by using a nonvolatile memory element constituting a floating electrode by a first layer of polysilicon, or the nonvolatile memory element is programmed in testing the semiconductor integrated circuit. As a result, a special process is not needed in forming the nonvolatile memory element. In other words, the nonvolatile memory element can be formed in a process of forming a CMOS device and an apparatus of a laser beam for programming is not needed since the programming is carried out in testing. Thus, the time necessary for programming can be shortened, and, therefore, testing costs can be reduced.

Abstract: A semiconductor device and the operation control method thereof are provided, which realize a highly generalized frequency control mechanism so as to allow a microprocessor to operate in lower power consumption, but with higher performance, without depending on the OS. It is arranged such that where the jobs are executed, they start at a lower frequency and if the execution of said jobs continues at the elapse of the time as predetermined, they are automatically executed at a higher frequency.

Abstract: A logic circuit in a system LSI is provided with a power switch so as to cut off the switch at the time of standby, reducing leakage current. At the same time, an SRAM circuit of the system LSI controls a substrate bias to reduce leakage current.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: A semiconductor integrated circuit device includes a logic circuit to perform a predetermined process, a clock generator to supply a clock signal to the logic circuit, and a speed controller to control the operation speed of the logic circuit. The clock generator changes the frequency of the clock signal by a frequency control signal during a time when the logic circuit is operating, and the speed controller controls the operating speed of the logic circuit in accordance with a change in the clock signal.