Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

Abstract: An electronic control apparatus for vehicles has at least two microcomputers, each having a non-volatile flash memory which stores a vehicle control program and data. Each microcomputer is reset when an abnormality is detected. Each microcomputer is applied with an identification signal indicative of a main one or sub one. When a data rewriting instruction is applied from an external writing device, one microcomputer which receives the identification signal indicative of the main one operates to release the other microcomputer from the reset condition after an elapse of a delay time period. A new control program and data transmitted from the external writing device is written into the corresponding flash memory in place of the previously stored control program and data.

Abstract: In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

Abstract: A slip ring apparatus includes a pair of slip rings electrically insulated from each other and disposed coaxially, a pair of electric conductive elements for providing electric connection between the pair of slip rings and a field coil of an automotive alternator, and an insulating member for holding the pair of slip rings and the pair of electric conductive elements. The electric conductive elements have at least one deformation absorbing portion for absorbing a deformation of the electric conductive elements.

Abstract: A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Abstract: An electronic component unit includes an interposer with a plurality of holes and a circuit wiring layer disposed on one surface of the interposer. The electronic component is electrically connected to the circuit wiring layer. A plurality of solder bumps are electrically connected to one surface of the circuit wiring layer through the holes formed in the interposer. The circuit wiring layer is electrically connected to an outside circuit through the solder bumps. A junction interface between the circuit wiring layer and each of the solder bumps is made of ductile metal.

Abstract: A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24, which are bottomed by the conductor layers, are formed in the resin film. Then interlayer connecting material is packed in the via-holes 24 to form a single-sided conductor layer film having the interlayer connecting material. A plurality of single-sided conductor layer films are formed and stacked such that surfaces having the conductor layers face in the same direction. Then, the single-sided conductor layer films are pressed and heated to complete the multilayer circuit board. The multilayer circuit board is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.

Abstract: A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Abstract: A conductor pattern is formed on a resin film which is made of a thermoplastic resin. Each single-sided conductor pattern film has via-holes filled with an electrically conductive paste. A printed conductor pattern and a printed resistor are formed on a ceramic substrate. The single-sided conductor pattern films are laminated on the ceramic substrate. Then, the multilayered assembly is heated and pressed from both sides thereof to obtain a printed circuit board. During the heat and press treatment, respective single-sided conductor pattern films and the ceramic substrate bond together while the interlayer connection is obtained between the conductor patterns as well as between the conductor pattern and the printed conductor pattern.

Abstract: A video game apparatus includes an external ROM. This external ROM has a sound memory area storing sound sequence data. The sound sequence data includes a plurality of block sequences for each of three status of “move”, “fight” and “stop” of a player object. A CPU detects a status of the player object according to a mode flag, and read a block sequence to a RAM in compliance with the status detected. It is possible to output a series of game melodies in a manner matching the status of the player object by the repetition of using the plurality of block sequences.

Abstract: In a rotor for a vehicular alternating current generator, a field coil is wound around an insulating bobbin. A flange of the bobbin is formed with the first, second and third hook portions. A coil winding finishing end is wound around the first hook portion and is opposed to a winding direction of the field coil. The finishing end is then directed in a radially inward direction with the second hook portion, and extended further in the radially inward direction along the axial end surface of the flange. Then, the finishing end is directed in the axial direction with the third hook portion, radially inside of the outer peripheral end of the field coil. The finishing end forms an angle with itself of less than 90 degrees around the first hook portion when being viewed along an axial direction of the first hook portion.

Abstract: When any of push-button switches on a handheld controller is pressed in a sound input mode, a video game machine generates and temporarily stores frequency data of a tone corresponding to the depressed switch. When a joystick on the controller is tilted to a predetermined direction, the video game machine changes the generated frequency data according to the amount of tilt of the joystick. It is therefore possible to input various sounds in tone using a limited number of switches. The frequency data stored in the video game machine is read later to be converted into audio signals, and outputted from a speaker incorporated in a CRT display. When a melody based on the inputted sound coincides with a predetermined melody set, the video game machine makes various changes in the progress of the game. For example, a hero character can be warped to a position that is different from the present position, or provided with various items.

Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.

Abstract: In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively.

Abstract: A video game apparatus includes an external ROM. This external ROM has a sound memory area storing sound sequence data. The sound sequence data includes a plurality of block sequences for each of three status of “move”, “fight” and “stop” of a player object. A CPU detects a status of the player object according to a mode flag, and read a block sequence to a RAM in compliance with the status detected. It is possible to output a series of game melodies in a manner matching the status of the player object by the repetition of using the plurality of block sequences.

Abstract: A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

Abstract: A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

Abstract: A video game apparatus includes an external ROM. This external ROM has a sound memory area memorized with sound sequence data. The sound sequence data includes a plurality of block sequences for each of three status of “move”, “fight” and “stop” of a player object. A CPU detects a status of the player object according to a mode flag, and read to a RAM a block sequence in compliance with the status detected. It is possible to output a series of game melodies in a manner matched to the status of the player object by the repetition of using the plurality of block sequences.