Abstract: A printed-circuit board according to the present invention includes: a plurality of insulating layers; a plurality of conductive patterns formed in each insulating layer; and a plurality of closed and curved patterns each formed around the conductive patterns in each insulating layer, and each formed by a material having a coefficient of linear thermal expansion smaller than that of the insulating layer. In this case, each closed and curved pattern is made of copper and formed of same material as that of each conductive pattern. Further, when the coefficient of linear thermal expansion of each insulating layer is &agr;1, when the coefficient of linear thermal expansion of each conductive layer is &agr;2, and when the coefficient of linear thermal expansion of each closed and curved pattern is &agr;3, the following condition, i.e., &agr;1>&agr;2≧&agr;3, is satisfied.

Abstract: A soldered product having secure reliable joints, without the use of flux, is disclosed. The soldered product includes a first member having a connected portion and a second member, also having a connected portion, facing the first member. The connected portions of the first and second members are electrically connected by a connecting material. A layer of hydrocarbon, including alkane, alkene or alkyne, is disposed around the periphery of the connecting material.

Abstract: A printed circuit board, having a plurality of via-holes provided in an area where circuit elements are arranged, includes a thermally conductive material having thermally good conductivity, for example copper, and the thermally good conductive material is formed in an inner wall of each of the plurality of via-holes. Each of the plurality of via-holes has, for example, a circular shape, and is arranged in the form of hexagonal or triangular lattice in the area where the circuit elements are arranged. Further, preferably, a diameter of each of the plurality of via-holes is equal to a hole pitch having an allowance .+-.0.3 mm. According to above structure, it is possible to provide a plurality of via-holes per unit area with high density on the printed circuit board and to improve the thermal conductivity of the printed circuit board by effectively radiating the heat generated from the circuit elements.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: The present invention relates to a pharmaceutical composition in a unit dosage form for peroral administration in a human or lower animal, having a gastrointestinal tract comprising a small intestine and a colon with a lumen therethrough having an inlet to the colon from the small intestine, comprising:a. a safe and effective amount of a therapeutically active agent incorporated into a compressed, bi-convex tablet, with a maximum diameter of about 4 mm to about 10 mm;b. a non-pH dependent smoothing coat applied to the tablet to provide a smooth tablet surface free from edges or sharp curves; andc. an enteric polymer coating material comprising at least one inner coating layer and only one outer coating layer;wherein the therapeutically active agent is released at a point near the inlet to, or within the colon; each of the inner coating layer(s) is an enteric polymer that begins to dissolve in an aqueous media at a pH between about 5 to about 6.

Abstract: An electroless plating solution having high stability and capable of preventing the formation of nodules is disclosed. The electroless plating solution includes metal ions which includes nickel ions and copper and/or cobalt ions, a complexing agent containing a hydroxycarboxylic acid and a reducing agent and having a pH of at least 7, and an anionic surfactant. The electroless plating solution further includes iron ions provided by a source selected from potassium ferrocyanide and potassium ferricyanide. The completing agent is preferably used in a molar amount at least equal to that of the metal ions. The electroless plating solution is preferred to contain from 1 mg/L to 0.2 g/L of iron ions and from 10 ppm to 10 g/L of the anionic surfactant.

Abstract: The present invention relates to a pharmaceutical composition in a unit dosage form for peroral administration in a human or lower animal, having a gastrointestinal tract comprising a small intestine and a colon with a lumen therethrough having an inlet to the colon from the small intestine, comprising:a. a safe and effective amount of rapidly dissolving bisacodyl incorporated into a compressed, bi-convex tablet, with a maximum diameter of about 4 mm to about 10 mm;b. a non-pH dependent smoothing coat applied to the tablet to provide a smooth tablet surface free from edges and sharp curves; andc. an enteric polymer coating material comprising at least one inner coating layer and only one outer coating layer;wherein the rapidly dissolving bisacodyl is released at a point near the inlet to, or within the colon; each of the inner coating layer(s) is an enteric polymer that begins to dissolve in an aqueous media at a pH between about 5 to about 6.

Abstract: A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C.sub.14 H.sub.30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning.

Abstract: A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.

Abstract: According to the present invention, the changing rate of the predetermined component concentration is determined, based on the difference between the predetermined component concentration in a chemical treating solution (a plating solution) which is analyzed this time and the predetermined component concentration analyzed last time, both measured by an analytical means, and the difference of each sampling time for analysis of each component concentration by the analytical means (140). Subsequently, the correction amount for the analyzed result of this time based on the changing rate obtained above and the elapsed time from the sampling point of time of the plating solution of this time for analysis of the plating solution by the analytical means to the current point of time (150), and then the analyzed result is corrected based on the resulting correction amount to compute or calculate the current concentration (160).

Abstract: A communication control device includes (a) a rate adapting unit for inputting thereto a receive clock for receiving a signal and outputting the receive clock of which waveform is partially deformed; and (b) a receiver for receiving the signal based on the receive clock outputted from the rate adapting unit.

Abstract: The present invention relates to a solution for catalytic treatment, which is effective for applying a catalyst-metal onto the surface of a substrate, which can provide a film having excellent properties such as adhesion, precision and selectivity through electroless plating or the like, and which does not cause a premature and undesirable decomposition in a bath. The solution for catalytic treatment comprises a catalyst-metal in the form of ions, which permits the deposition of the metal serving as a catalyst on a substrate by applying the solution onto the surface of the substrate and then irradiating the substrate with light rays. The present invention also relates to a method of applying a catalyst onto a substrate and a method of forming an electrical conductor in which such a solution for catalytic treatment is employed.

Abstract: An extra super multi-story building having one piece of extra super multi-story of about 200 story construction, two pieces of extra super multi-stories of about 150 story construction and one piece of extra super multi-story of about 100 story construction. Each extra super multi-story includes two through four pieces of tower-like super multi-stories of about 50 story construction and of about 50 m in diameter (floor area: about 200 m.sup.2 /story). A sky lobby is provided about every 50 stories connecting the extra super multi-stories. Four shuttle elevators lead from the ground to the sky lobbies, and a sightseeing tower and high-rise garden (sky dome) are provided at the rooftop of the extra super multi-story building. Main facilities such as offices, hotels and residences are arranged in each extra multi-story.

Abstract: Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.

Abstract: A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.

Abstract: By forming a first copper layer on a substrate by using a complexing agent for copper ion, which has a low copper complex stability constant, a uniform second layer can be stably formed by a second complexing agent for a copper ion, which has a high copper complex stability constant, even if the substrate is composed of a material having a low catalytic activity, such as tungsten, or even if the catalytic activity of the substrate is uneven. A similar effect can also be obtained by adding a small amount of a complexing agent for a copper ion, having a low stability constant, to an electroless copper plating bath containing a complexing agent for a copper ion, having a low stability constant. In this case, an effect of preventing stopping of the reaction of the complexing agent of a copper ion, having a high stability constant, is attained.

Abstract: A practically fast electroless copper deposition is obtained by using a trialkanolmonoamine as a complexing agent for copper ion and as an accelerator, by adding it in an excess amount of 1.2 to 30 times the mole concentration of the copper ion. An optimum increased deposition rate of 100 .mu.m/hr is obtained even if additives such as potassium ferrocyanide, 2,2'-bipyridyl, polyethylenegrycol and an anionic surfactant are added.

Abstract: A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.

Abstract: In a chemical copper-plating bath comprising a copper sulfate, a complexing agent, a reducing agent, and a pH-adjusting agent, borofluoride is added to enhance the deposition speed of Cu, thus eliminating the problems of a complicated control of the bath.

Abstract: A process for preparing a tape guide cylinder is disclosed, which includes the steps of deep-drawing a sheet metal material progressively to form an elongated cylinder with a bottom, subjecting the resulting cylinder to flange-machining to form a flange at its open end, thereafter removing the bottom of the cylinder, subsequently trimming the flange from the cylinder, and finally subjecting the resulting cylinder at either of its ends to a beat-machining for finishing the shape of the elongated cylinder.The tape guide cylinder thus prepared may further be subjected at its circumference, to a precision finish for providing an outer diameter of less than 6 mm but more than 5.2 mm.