Patents by Inventor Koji Matsui

Koji Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240118778
    Abstract: There are provided a display panel with a touch detector that allows the touch detection electrodes to be less visible, a touch panel, and an electronic unit having the display panel with a touch detector. The display panel with a touch detector includes: a display layer including a plurality of display elements arranged side by side; and an electrode layer alternately segmented into first regions and second regions along a first direction, the electrode layer including a plurality of first slits arranged side by side to extend in a second direction, and a plurality of second slits each allowing an adjacent pair of the plurality of first slits in the second regions to be in communication with one another.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Koji ISHIZAKI, Koji NOGUCHI, Masanobu IKEDA, Yasuyuki MATSUI
  • Publication number: 20240085344
    Abstract: The present invention includes a holding unit holding an annular product, a rotation drive unit causing the holding unit holding the annular product to rotate about a center axis of the annular product, a first illumination unit having a line-shaped light projector along a radial direction of the annular product and radiating a filmy illumination light from the light projector to an outside surface of the annular product, a line sensor camera having a line-shaped light receiving unit and arranged such that the light receiving unit is parallel to the light projector and imaging, from a direction identical to the radiating direction of the first illumination unit, the outside surface of the annular product illuminated by the first illumination unit as a region to be imaged, and a judgment device processing an image captured by the line sensor camera to judge whether the annular product is defective in appearance.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 14, 2024
    Applicant: DAIICHI JITSUGYO VISWILL CO., LTD.
    Inventor: Koji MATSUI
  • Publication number: 20230298153
    Abstract: A visual inspection system includes a conveyance device conveying an inspection target on a glass plate in a rotating direction of the glass plate, an outer-side-surface image capturing device capturing an image of the inspection target at an outer-side-surface image capturing position, and a judgment device judging based on the captured image whether the inspection target is defective in appearance or not. The outer-side-surface image capturing device has an illumination unit for inspection and three image capturing units arranged around the illumination unit. Each image capturing unit includes first and second mirrors receiving light reflected from an outer side surface of the inspection target at position below the illumination unit, a third mirror reflecting reflected light from the first and second mirrors upward, and an imaging camera arranged above the third mirror.
    Type: Application
    Filed: March 10, 2023
    Publication date: September 21, 2023
    Applicant: DAIICHI JITSUGYO VISWILL CO., LTD.
    Inventors: Koji MATSUI, Koichi SASAKI
  • Publication number: 20230167028
    Abstract: A sintered body including zirconia containing a stabilizer, wherein the sintered body has a monoclinic fraction of 0.5% or more and has a three-point bending strength of more than 1450 MPa as measured by a three-point bending test according to JIS R 1601.
    Type: Application
    Filed: April 20, 2021
    Publication date: June 1, 2023
    Applicant: TOSOH CORPORATION
    Inventors: Koji MATSUI, Kohei HOSOI
  • Publication number: 20220276011
    Abstract: A heat conducting sheet has an overall sheet structure with a plurality of heat conducting regions. Each heat conducting region is continuous between the two primary surfaces of the heat conducting sheet, and connecting regions connect adjacent side-walls of the plurality of heat conducting regions stacked laterally between the primary surfaces. The heat conducting regions include vacancies. The connecting regions consist of material that includes flexible resin material and unfilled layers are formed in part of the connecting regions. Some of the resin material can ingress into part of heat conducting region vacancies. This structure can achieve a highly elastic and flexible heat conducting sheet due to vacancies in the heat conducting regions and unfilled layers in the connecting region.
    Type: Application
    Filed: June 25, 2020
    Publication date: September 1, 2022
    Applicant: SHOWA MARUTSUTSU COMPANY, LTD.
    Inventors: Eiichi TOYA, Koji MATSUI, Yuya TOYOKAWA, Kazuki SHIBATA, Katsuhiko KAGAWA, Takayuki YAMAGUCHI
  • Publication number: 20220212999
    Abstract: There is provided a raw material for a zirconia sintered body formed by pressureless sintering and having a high fracture toughness value measured by an SEPB method, a sintered body formed from the raw material, and a method for producing at least one of the raw material and the sintered body. Also provided is a sintered body that includes zirconia that contains a stabilizer and having a monoclinic fraction of 0.5% or more. Such a sintered body is produced by a method including using a powder that contains a stabilizer and zirconia with a monoclinic fraction of more than 70%, wherein monoclinic zirconia has a crystallite size of more than 23 nm and 80 nm or less.
    Type: Application
    Filed: April 6, 2020
    Publication date: July 7, 2022
    Applicant: TOSOH CORPORATION
    Inventors: Koji MATSUI, Kohei HOSOI
  • Publication number: 20210150303
    Abstract: A personal identification medium is provided that includes a decorative layer provided with an antenna, and a laser marking layer in which a personal information marking portion is marked on the decorative layer, where the antenna includes a non-decorative portion and a decorative portion connected to the non-decorative portion, and the personal information marking portion formed on the laser marking layer overlaps at least a portion of the decorative portion formed on the decorative layer.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 20, 2021
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Yoshiyuki MIZUGUCHI, Koji MATSUI, Naomichi MIMITA, Satoko TAKAHASHI, Yuko MASUNAGA, Shin KATAOKA, Yu KOKUBO
  • Patent number: 10466672
    Abstract: An apparatus for updating an operation plan of a high-temperature component based on operation performance. The apparatus includes: a display unit which displays an operation plan of multiple high-temperature components which are mounted upon a device; a storage unit which stores, for each device, at least initial setting data including information regarding operation start times of the high-temperature components and scheduled times for carrying out periodic inspections of the high-temperature components; an operation plan creation unit which, using the initial setting data, generates data of the operation plan including operation intervals of the high-temperature components from the operation start times to the scheduled times for carrying out the periodic inspections, and stores same in the storage unit for each device; and an operation plan update unit which updates the operation plan data which is displayed on the display unit, based on the high-temperature component operation performance information.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: November 5, 2019
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Naoya Kawamura, Hiroyuki Isu, Manabu Kasano, Aki Nakayama, Tsuyoshi Nakaji, Koji Matsui, Tomoaki Kitagawa
  • Patent number: 9510003
    Abstract: A moving picture coding device is a moving picture coding device which codes a moving picture, and includes: a VBV modeling unit which simulates an occupancy amount of a coded data buffer (VBV buffer occupancy amount) at the time of decoding; and a bit rate control unit which determines a quantization width (quantization scale) according to a rate of change of the occupancy amount of the coded data buffer so that the occupancy amount of the coded data buffer increases.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: November 29, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Koji Matsui
  • Publication number: 20150378338
    Abstract: An apparatus for updating an operation plan of a high-temperature component based on operation performance. The apparatus includes: a display unit which displays an operation plan of multiple high-temperature components which are mounted upon a device; a storage unit which stores, for each device, at least initial setting data including information regarding operation start times of the high-temperature components and scheduled times for carrying out periodic inspections of the high-temperature components; an operation plan creation unit which, using the initial setting data, generates data of the operation plan including operation intervals of the high-temperature components from the operation start times to the scheduled times for carrying out the periodic inspections, and stores same in the storage unit for each device; and an operation plan update unit which updates the operation plan data which is displayed on the display unit, based on the high-temperature component operation performance information.
    Type: Application
    Filed: February 10, 2014
    Publication date: December 31, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Naoya KAWAMURA, Hiroyuki ISU, Manabu KASANO, Aki NAKAYAMA, Tsuyoshi NAKAJI, Koji MATSUI, Tomoaki KITAGAWA
  • Patent number: 8997713
    Abstract: A vehicular air intake is configured to produce a turbulent intake air flow in a cylinder of an engine. The air flow may be provided as a vortex. A throttle valve, for controlling an amount of intake air provided to the engine, has a pivot shaft with an axis which is offset from a center axis of an air intake passage in which the throttle valve is installed, and a throttle plate affixed to the pivot shaft. The pivot axis is offset and spaced away from the central axis of the throttle body such that a first portion of a throttle plate disposed on a first side of the pivot shaft, is larger than a second portion of the throttle plate disposed on a second side of the pivot shaft. This arrangement provides the non-uniform turbulent air flow into the engine.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: April 7, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yasuaki Nakajima, Tetsuya Nakayasu, Natsuki Miyashita, Makoto Kashiwabara, Hidetoshi Wakasa, Koji Matsui
  • Publication number: 20120222650
    Abstract: A vehicular air intake is configured to produce a turbulent intake air flow in a cylinder of an engine. The air flow may be provided as a vortex. A throttle valve, for controlling an amount of intake air provided to the engine, has a pivot shaft with an axis which is offset from a center axis of an air intake passage in which the throttle valve is installed, and a throttle plate affixed to the pivot shaft. The pivot axis is offset and spaced away from the central axis of the throttle body such that a first portion of a throttle plate disposed on a first side of the pivot shaft, is larger than a second portion of the throttle plate disposed on a second side of the pivot shaft. This arrangement provides the non-uniform turbulent air flow into the engine.
    Type: Application
    Filed: February 27, 2012
    Publication date: September 6, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yasuaki NAKAJIMA, Tetsuya NAKAYASU, Natsuki MIYASHITA, Makoto KASHIWABARA, Hidetoshi WAKASA, Koji MATSUI
  • Publication number: 20110274160
    Abstract: A moving picture coding device is a moving picture coding device which codes a moving picture, and includes: a VBV modeling unit which simulates an occupancy amount of a coded data buffer (VBV buffer occupancy amount) at the time of decoding; and a bit rate control unit which determines a quantization width (quantization scale) according to a rate of change of the occupancy amount of the coded data buffer so that the occupancy amount of the coded data buffer increases.
    Type: Application
    Filed: February 28, 2011
    Publication date: November 10, 2011
    Inventor: Koji MATSUI
  • Patent number: 7917500
    Abstract: A structured document search system comprises an index storage unit and a search unit. The index storage unit stores indexes caused to correspond to the nodes included in the structured documents stored in a database. The indexes include node information items about the nodes to which the indexes are caused to correspond and position information items about related nodes. The node information items include position information items about the nodes to which the indexes are caused to correspond. The search unit, when the search condition specified in the search request made by the client includes value search conditions covering the values of nodes and is a specific search condition specifying a search of a related node common to the nodes, searches the index storage unit for indexes complying with the value search conditions and acquires a position information item about a related node common to the indexes searched for.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: March 29, 2011
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Solutions Corporation
    Inventors: Miyuki Sakai, Koji Matsui, Motoki Nakanishi
  • Patent number: 7829199
    Abstract: An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.
    Type: Grant
    Filed: April 21, 2005
    Date of Patent: November 9, 2010
    Assignee: NEC Corporation
    Inventors: Takuo Funaya, Osamu Myohga, Koji Matsui
  • Patent number: 7696007
    Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: April 13, 2010
    Assignee: NEC Corporation
    Inventors: Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui, Kazuhiro Baba
  • Patent number: 7585699
    Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: September 8, 2009
    Assignee: NEC Corporation
    Inventors: Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui, Kazuhiro Baba
  • Publication number: 20090162974
    Abstract: A semiconductor package board for mounting thereon a semiconductor chip includes a metal base having an opening for receiving therein the semiconductor chip and a multilayer wiring film layered onto the metal base. The semiconductor chip is flip-chip bonded onto the metal pads disposed on the multilayer wiring film within the opening. The surface of the metal base is flush with the top surface of the semiconductor chip received in the opening. The resultant semiconductor device has a larger number of external pins and a smaller deformation without using a stiffener.
    Type: Application
    Filed: February 23, 2009
    Publication date: June 25, 2009
    Applicant: NEC Corporation
    Inventors: Katsumi KIKUCHI, Tadanori Shimoto, Koji Matsui, Kazuhiro Baba
  • Publication number: 20080235252
    Abstract: A structured document search system comprises an index storage unit and a search unit. The index storage unit stores indexes caused to correspond to the nodes included in the structured documents stored in a database. The indexes include node information items about the nodes to which the indexes are caused to correspond and position information items about related nodes. The node information items include position information items about the nodes to which the indexes are caused to correspond. The search unit, when the search condition specified in the search request made by the client includes value search conditions covering the values of nodes and is a specific search condition specifying a search of a related node common to the nodes, searches the index storage unit for indexes complying with the value search conditions and acquires a position information item about a related node common to the indexes searched for.
    Type: Application
    Filed: March 11, 2008
    Publication date: September 25, 2008
    Inventors: Miyuki SAKAI, Koji Matsui, Motoki Nakanishi
  • Patent number: 7352069
    Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.
    Type: Grant
    Filed: December 24, 2003
    Date of Patent: April 1, 2008
    Assignees: Nitto Denko Corporation, NEC Corporation
    Inventors: Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro