Abstract: A method for manufacturing a multilayer ceramic capacitor includes: producing a plurality of dielectric green sheets; producing therefrom a plurality of internal electrode-printed green sheets; producing therefrom a plurality of individually cut unsintered laminates by stacking some of the plurality of dielectric green sheets, as cover layers, and the plurality of internal electrode-printed green sheets together; producing therefrom element body precursors by applying a ceramic paste to side faces of the unsintered laminates for forming side margins thereon, wherein an application thickness of the ceramic paste is adjusted in a manner such that a thickness of the side margins is greater than a thickness of the cover layers in the final product; producing therefrom element bodies by sintering; and forming external electrodes on at least one of principal faces and on both end faces of the element bodies.

Abstract: In an embodiment, a capacitor body 11 of a multilayer ceramic capacitor 10 has, at a position adjoining a lower height-direction surface f6, a tapered part 11a whose width gradually decreases toward the lower height-direction surface f6 over the entire length of the part. Also, the first external electrode 12 and second external electrode 13 have, at their two ends in the width direction, engagement parts 12a, 13a that wrap around onto the width-direction outer surfaces f3a, f4a of the tapered part 11a, respectively. The multilayer ceramic capacitor, after it has been mounted on a circuit board, can mitigate the phenomenon of the first external electrode and second external electrode separating from the capacitor body without reducing the benefit of capacitance increase.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11. Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11. Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12c of the respective external electrodes 12, while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12b of the respective external electrodes 12. The multilayer ceramic electronic component can offer excellent heat dissipation property.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit and a cover. The capacitance forming unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers and mainly containing nickel. The cover covers the capacitance forming unit from the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The internal electrodes each include an oxidized area adjacent to the side margin and intensively including a metal element that forms an oxide together with nickel. The capacitance forming unit includes a first portion adjacent to the cover and a second portion adjacent to the first portion in the first direction and including the oxidized area having a smaller dimension in the second direction than that of the oxidized area of the first portion.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has a first metal layer 14 having many holes 14a, and a second metal layer 15 having many holes 15a, with a clearance CL provided in between in the length direction, on the other height-direction side face of the capacitor body; the first metal layer 14 is partially covered by a third part 12c of a first external electrode 12, while the remainder is exposed; and the second metal layer 15 is partially covered by a third part 13c of a second external electrode 13, while the remainder is exposed. The multilayer ceramic capacitor can have excellent heat dissipation property.

Abstract: In an embodiment, one length-direction end of each first internal electrode layer 111a of the capacitor body 110 is connected, via the conductive part 114a of the first relay layer 114 connected over a connection width equivalent to the width of each first internal electrode layer 111a, to the first external electrode 120 provided on one height-direction face of the capacitor body 110; also, the other length-direction end of each second internal electrode layer 111b is connected, via the conductive part 115a of the second relay layer 115 connected over a connection width equivalent to the width of each second internal electrode layer 111b, to the second external electrode 130 provided on one height-direction face of the capacitor body 110.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has a capacitor body 11 having a first face f1 and a second face f2 in a length direction, a third face f3 and a fourth face f4 in a width direction, a fifth face f5 and a sixth face f6 in a height direction, and a first tapering face f5a between face f1 and face f5 and a second tapering face f5b between face f2 and face 5f; a first external electrode 12 that has a first part 12a along face f1, a second part 12b along face f5, and continuously a third part 12c along face f5a; and a second external electrode 13 that has a first part 13a along face f2, a second part 13b along face f5, and continuously a third part 13c along face f5b.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit, a side margin, and a bonding unit. The multi-layer unit includes ceramic layers and internal electrodes. The ceramic layers are made of first ceramics and laminated in a first direction, the first ceramics having a first average crystal grain diameter. The internal electrodes are disposed between the ceramic layers. The side margin is made of second ceramics and covers the multi-layer unit from a second direction orthogonal to the first direction, the second ceramics having a second average crystal grain diameter. The bonding unit is made of third ceramics and disposed between the multi-layer unit and the side margin, the third ceramics having a third average crystal grain diameter that is larger than the first average crystal grain diameter and the second average crystal grain diameter.

Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce multi-layer chips each having side surfaces from which the internal electrodes are exposed; smoothing the side surfaces of the multi-layer chips; and providing side margins to the smoothed side surfaces of the multi-layer chips.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit, side margins, and bonding units. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margins cover the multi-layer unit from a second direction orthogonal to the first direction. The bonding units are each disposed between the multi-layer unit and each of the side margins and have higher silicon content than the ceramic layers and the side margins.

Abstract: In an embodiment, a capacitor body 11 of a multilayer ceramic capacitor 10 has, at a position adjoining a lower height-direction surface f6, a tapered part 11a whose width gradually decreases toward the lower height-direction surface f6 over the entire length of the part. Also, the first external electrode 12 and second external electrode 13 have, at their two ends in the width direction, engagement parts 12a, 13a that wrap around onto the width-direction outer surfaces f3a, f4a of the tapered part 11a, respectively. The multilayer ceramic capacitor, after it has been mounted on a circuit board, can mitigate the phenomenon of the first external electrode and second external electrode separating from the capacitor body without reducing the benefit of capacitance increase.

Abstract: A multi-layer ceramic capacitor according to an embodiment of the present invention includes a multi-layer, side margins and offset sections. The multi-layer includes internal electrodes and dielectric layers alternately laminated. The side margins are configured of a dielectric and disposed to cover side faces of the multi-layer. The offset sections are made with amorphous areas or gap areas. The offset sections are formed between the internal electrodes and the side margins such that ends at side faces of the internal electrodes are offset from the side faces to an inward direction of the multi-layer.

Abstract: A multilayer ceramic capacitor includes an element body which is constituted by dielectric layers stacked alternately with internal electrode layers having different polarities and whose shape is roughly a rectangular solid having a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that the pair of side faces of the element body has a pair of side margins whose thickness is 30 ?m or less, and external electrodes are formed on the pair of end faces, and at least one of the pair of principle faces, of the element body. Despite the multilayer ceramic capacitor whose side margins are as thin as 30 ?m or less, leak current can be suppressed.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities, with a pair of cover layers formed on it to cover the top and bottom faces in the direction of lamination of the foregoing, and which has a pair of principal faces, a pair of end faces, and a pair of side faces, wherein external electrodes are formed on the pair of end faces and at least one of the pair of principal faces of the element body, and Tt representing the thickness of the external electrode and Tc representing the thickness of the cover layer satisfy the relationship of Tt?Tc. The multilayer ceramic capacitor has large capacitance and also exhibits excellent thermal shock resistance while sufficiently suppressing generation of cracks.

Abstract: A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that: external electrodes are formed on the pair of end faces and one principle face of the element body; and on a cross section taken in parallel with one end face of the multilayer ceramic capacitor near the end face, the ratio of area A constituted by the internal electrode layers connected to the external electrode on this end face side and the dielectric layers present between the internal electrode layers, and area B covering the part of the section excluding the external electrodes, A/B, is 0.75 or more.

Abstract: A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin ?Dcoa ?Tmax where Tmax is the maximum thickness of the dielectric layer and Tmin is the minimum thickness of the dielectric layer. The multilayer ceramic capacitor is capable of inhibiting deterioration of capacitance and capacity-temperature characteristics even when the internal electrode layer is made thin.

Abstract: A multilayer capacitor has dielectric layers and multiple internal electrode layers. The laminate includes a stack of multiple dielectric layers made of dielectric material and has a first principal face and a second principal face on the opposite side of the first principal face. In an embodiment, the multiple internal electrode layers have Ni as a primary component, contain at least one metal element selected from Pt, Ru, Rh, Re, Ir, Os, and Pd, and are arranged in parallel with the first principal face and second principal face inside the laminate in such a way that they alternate from the opposing sides with the dielectric layers placed in between, wherein each of the internal electrode layer closest to the first principal face and the internal electrode layer closest to the second principal face has a distance of 30 ?m or less from the corresponding principal face.

Abstract: A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 ?m or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 ?m or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured.

Abstract: A dielectric ceramic whose primary component is an ABO3 compound (A contains Ba and B contains Ti) has a per-layer thickness of approx. 0.5 ?m or less, where the volume ratio to all dielectric sintered grains of those whose grain size is in a range of 0.02 ?m to 0.15 ?m is adjusted to a grain size distribution of 1% to 10%. High dielectric constant and high reliability can be achieved at the same time with the dielectric ceramic.

Abstract: A speaker unit mounting structure includes a provisionally fastening mechanism for fastening a speaker unit to a ceiling with a cabinet section of the speaker unit inserted in a mounting hole of the ceiling. The provisionally fastening mechanism includes a provisionally fastening tab formed of resilient metal, fixed to the outer peripheral side surface of the cabinet section and having a stepped engaging section engageable with the inner peripheral edge portion of the mounting hole. Engagement of the engaging section with the inner peripheral edge portion of the mounting hole can be canceled by a human operator pressing, from the face side of the ceiling, an operating section of the tab, exposed to a gap between the front side and a flange portion of the speaker unit, to thereby resiliently deform the operating section.