Patents by Inventor Kuan-Ting Wu
Kuan-Ting Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11952665Abstract: A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.Type: GrantFiled: June 11, 2019Date of Patent: April 9, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Hsing-Hung Hsieh, Super Liao
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Patent number: 11947212Abstract: An electronic device which is capable of being bent in a first direction and includes a plurality of light-emitting units and a plurality of conductive patterns overlapping with at least a portion of the plurality of light-emitting units and extending in a second direction. The first direction and the second direction have an angle ? of not greater than 30 degrees.Type: GrantFiled: January 21, 2021Date of Patent: April 2, 2024Assignee: InnoLux CorporationInventors: Yuan-Lin Wu, Yu-Chia Huang, Yu-Ting Huang, Kuan-Feng Lee, Chia-Hung Hsieh
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Patent number: 11939677Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.Type: GrantFiled: June 11, 2019Date of Patent: March 26, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing-Hung Hsieh
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Publication number: 20240097005Abstract: Disclosed is a semiconductor device and semiconductor fabrication method. A semiconductor device includes: a gate structure over a semiconductor substrate, having a high-k dielectric layer, a p-type work function layer, an n-type work function layer, a dielectric anti-reaction layer, and a glue layer; and a continuous metal cap over the gate structure formed by metal material being deposited over the gate structure, a portion of the anti-reaction layer being selectively removed, and additional metal material being deposited over the gate structure. A semiconductor fabrication method includes: receiving a gate structure; flattening the top layer of the gate structure; precleaning and pretreating the surface of the gate structure; depositing metal material over the gate structure to form a discontinuous metal cap; selectively removing a portion of the anti-reaction layer; depositing additional metal material over the gate structure to create a continuous metal cap; and containing growth of the metal cap.Type: ApplicationFiled: January 12, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Hang Chiu, Jui-Yang Wu, Kuan-Ting Liu, Weng Chang
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Patent number: 11920244Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.Type: GrantFiled: July 24, 2018Date of Patent: March 5, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chi-Hao Chang, Ya-Ting Yeh, Kuan-Ting Wu, Chih-Hsiung Liao
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Publication number: 20240071285Abstract: In examples, an electronic device comprises an expandable display having a primary portion and first and second auxiliary portions. The expandable display has a default mode in which the first and second auxiliary portions are hidden and an expanded mode in which the first and second auxiliary portions are visible on opposing horizontal ends of the primary portion. The electronic device includes first and second timing controllers (TCONs) to control pixels in the expandable display.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Hsing-Hung HSIEH, Super LIAO, Kuan-Ting WU
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Patent number: 11910538Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.Type: GrantFiled: August 8, 2019Date of Patent: February 20, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Yi-Chen Chen, Kun Cheng Tsai, Kuan-Ting Wu, Ying-Hung Ku, Hsueh Chen Hung
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Patent number: 11892728Abstract: A device comprises a display that includes an aperture layer, a plurality of light sources, and a piezo material. The aperture layer includes a plurality of apertures. The plurality of light sources is arranged to correspond to the plurality of the aperture. The piezo material is coupled to the light sources and is configured to alter a distance between the light sources and the corresponding apertures.Type: GrantFiled: October 9, 2019Date of Patent: February 6, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi-Hao Chang
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Patent number: 11887993Abstract: The present disclosure is drawn to thin-film transistors, electronic displays that include thin-film transistors, and methods of making thin-film transistors. In one example, a thin-film transistor can include a nonconductive substrate, a semiconductor layer on the nonconductive substrate, a source electrode adjacent a first side of the semiconductor layer and partially overlapping a first peripheral portion of the semiconductor layer, a drain electrode adjacent a second side of the semiconductor layer and partially overlapping a second peripheral portion of the semiconductor layer, an etch stop layer on the semiconductor layer, a gat insulator layer on the etch stop layer, and a gate electrode on the gate insulator layer. The source electrode and the drain electrode do not overlap the etch stop layer.Type: GrantFiled: May 13, 2019Date of Patent: January 30, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Super Liao
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Patent number: 11808316Abstract: An electronic device can include a first electronic component, a second electronic component, and an energy dampener positioned between and in contact with the first electronic component and the second electronic component. The energy dampener in this example includes a carbon nanotube-aerogel matrix including carbon nanotubes embedded in an aerogel with a rubber composited therewith.Type: GrantFiled: June 29, 2022Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Chung-Hua Ku, Chi Hao Chang
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Patent number: 11789548Abstract: An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.Type: GrantFiled: July 17, 2020Date of Patent: October 17, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsiao-Jou Lin, Kuan-Ting Wu, Alexander Williams
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Patent number: 11775017Abstract: The present disclosure is drawn to bendable displays for electronic devices. In one example, a first display region including a glass panel that is rigid, the glass panel including a first interlocking edge. A second display region can include a plastic panel that is bendable, the plastic panel including a second interlocking edge that is shaped to inversely correspond with the first interlocking edge. An interlock zone where the first interlocking edge can be joined with the second interlocking edge such that the first display region and the second display region form a continuous display panel that is bendable at a location along the second display region.Type: GrantFiled: April 3, 2020Date of Patent: October 3, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Super Liao, Kuan-Ting Wu, Hsing-Hung Hsieh
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Publication number: 20230298516Abstract: A display having an area of non-transparent pixels, an area of transparent pixels, a camera positioned behind the transparent pixels to capture an image when light passes through the transparent pixels, and a display controller for driving the non-transparent pixels at a first brightness and driving the transparent pixels at a second brightness greater than the first brightness during image capture by the camera.Type: ApplicationFiled: May 26, 2023Publication date: September 21, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Dehuei Chen
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Patent number: 11762427Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an aluminum or aluminum alloy cover frame having an opening. A magnesium or magnesium alloy cover panel supported by the aluminum or aluminum alloy cover frame within or over the opening. A protective coating can be over a surface of the aluminum or aluminum alloy cover frame and a surface of the magnesium or magnesium alloy cover panel. A chamfered edge can include a chamfer at an edge of the aluminum or aluminum alloy cover frame. The chamfer can expose the aluminum or aluminum alloy cover frame beneath the protective coating, and the chamfer at the same time does not expose the magnesium or magnesium alloy cover panel.Type: GrantFiled: February 1, 2019Date of Patent: September 19, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Ya-Ting Yeh, Chih-Hsiung Liao
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Publication number: 20230280842Abstract: An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.Type: ApplicationFiled: July 17, 2020Publication date: September 7, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jsiao-Jou Lin, Kuan-Ting Wu, Alexander Williams
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Publication number: 20230262912Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a light metal substrate including a first surface. A first micro-arc oxidation layer may be on the first surface of the light metal substrate, the first micro-arc oxidation layer can include a cationic dye bonded to the first surface via an anionic inorganic bridging compound.Type: ApplicationFiled: July 31, 2020Publication date: August 17, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: CHIEN-CHIH CHIU, HSIN-CHIEN CHU, KUAN-TING WU
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Publication number: 20230262933Abstract: The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.Type: ApplicationFiled: July 23, 2020Publication date: August 17, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: HENDRY HUANG, KUAN-TING WU, CHI HAO CHANG
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Publication number: 20230259179Abstract: The present disclosure is drawn to housings for electronic devices. In one example, a housing for an electronic device can include a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate. A conductive metal antenna is conformally carried by the recessed region and positioned at the opening.Type: ApplicationFiled: July 27, 2020Publication date: August 17, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: CHI HAO CHANG, HENDRY HUANG, KUAN-TING WU
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Publication number: 20230222980Abstract: In examples, an electronic device comprises a camera and a display having a transparent area aligned with the camera. The display comprises a first line corresponding to a pixel row or column of the display, the first line extending from a first end of the display to the transparent area. The display comprises a second line corresponding to the pixel row or column and extending from a second end of the display to the transparent area, the first and second lines separated by a gap. The electronic device includes a controller coupled to the display, the controller to drive the first and second lines consecutively.Type: ApplicationFiled: May 15, 2020Publication date: July 13, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Super Liao, Kuan-Ting Wu
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Publication number: 20230211375Abstract: A coated substrate for an electronic device can include a substrate, a physical vapor deposition layer over the substrate, and an anti-fingerprint layer over the physical vapor deposition layer. The physical vapor deposition layer can include an alloy of gold and platinum. The anti-fingerprint layer can include an ultraviolet radiation-cured polymer mixed with an anti-fingerprint material. The anti-fingerprint material can include a silane, a fluorinated polymer, a hydrophobic polymer, or a combination thereof.Type: ApplicationFiled: April 15, 2020Publication date: July 6, 2023Inventors: CHI HAO CHANG, CHIEN-TING LIN, KUAN-TING WU