Patents by Inventor Kuan-Ting Wu
Kuan-Ting Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12342504Abstract: The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.Type: GrantFiled: July 23, 2020Date of Patent: June 24, 2025Assignee: Hewlett-Packard Deveopment Company, L.P.Inventors: Hendry Huang, Kuan-Ting Wu, Chi Hao Chang
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Patent number: 12342488Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a light metal substrate including a first surface. A first micro-arc oxidation layer may be on the first surface of the light metal substrate, the first micro-arc oxidation layer can include a cationic dye bonded to the first surface via an anionic inorganic bridging compound.Type: GrantFiled: July 31, 2020Date of Patent: June 24, 2025Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Chih Chiu, Hsin-Chien Chu, Kuan-Ting Wu
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Patent number: 12324302Abstract: An example dual plate Organic Light-Emitting Field-Effect Transistor (OLET) display device includes a first plate device having a first substrate; a gate layer adjacent to the first substrate; and a dielectric layer adjacent to the gate layer. A second plate device is connected to the first plate device. The second plate device includes a second substrate; a source/drain layer adjacent to the second substrate; and a stacked active organic layer adjacent to the source/drain layer. The first plate device and the second plate device are to be independently fabricated and joined together to position the stacked active organic layer adjacent to the dielectric layer.Type: GrantFiled: February 11, 2020Date of Patent: June 3, 2025Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi Hao Chang
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Patent number: 12181743Abstract: A display device includes an aperture layer, a first plurality of light sources, a second plurality of light sources, and a piezo material coupled to the first plurality of light sources and the second plurality of light sources. The aperture layer includes a first plurality of apertures and a second plurality of apertures, and the first plurality of light sources is arranged to correspond to the first plurality of apertures, and the second plurality of light sources is arranged to correspond to the second plurality of apertures. The piezo material is configured to alter a first position of the first plurality of light sources relative to the first plurality of apertures, and to alter a second position of the second plurality of light sources relative to the second plurality of apertures.Type: GrantFiled: January 31, 2024Date of Patent: December 31, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi-Hao Chang
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Patent number: 12152310Abstract: The present subject matter relates to Nickel-free (Ni-free) sealing of anodized metal substrates. In an example mentation of the present subject matter, an anodized metal substrate is disposed with a first layer of a Ni-free sealing material over a surface of the anodized metal substrate. Further, a second layer of a second sealing material is disposed atop the first layer to sandwich the first layer of Ni-free sealing material between the surface of the anodized metal substrate and the second layer, to form a sealed metal substrate.Type: GrantFiled: June 22, 2018Date of Patent: November 26, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Ya-Ting Yeh, Chih-Hsiung Liao
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Patent number: 12125460Abstract: A system that can intelligently help a user judge the resolution requirement of the image content. In an example, the display panel can show in different virtual resolutions or the system can automatically judge whether the image content requires high or low resolution using a similarity judgement. The system can then inform the display panel what virtual resolution should be shown or what the optimal resolution is using the similarity judgment and send the image content to the display panel with that resolution.Type: GrantFiled: July 13, 2023Date of Patent: October 22, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Cheng-Chien Chen, Kuan-Ting Wu
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Patent number: 12118944Abstract: In examples, an electronic device comprises a camera and a display having a transparent area aligned with the camera. The display comprises a first line corresponding to a pixel row or column of the display, the first line extending from a first end of the display to the transparent area. The display comprises a second line corresponding to the pixel row or column and extending from a second end of the display to the transparent area, the first and second lines separated by a gap. The electronic device includes a controller coupled to the display, the controller to drive the first and second lines consecutively.Type: GrantFiled: May 15, 2020Date of Patent: October 15, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Super Liao, Kuan-Ting Wu
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Patent number: 12054654Abstract: The present disclosure is drawn to re-workable adhesives for electronic devices. In one example, a re-workable adhesive for an electronic device can include a hot-melt adhesive present in an amount from about 60 wt % to about 90 wt % with respect to the total weight of the re-workable adhesive. The hot-melt adhesive can have a reduced bond strength at an elevated temperature. The re-workable adhesive can also include a pressure-sensitive adhesive present in an amount from about 10 wt % to about 40 wt % with respect to the total weight of the re-workable adhesive, wherein the pressure-sensitive adhesive has a higher bond strength compared to the hot-melt adhesive when at the elevated temperature.Type: GrantFiled: May 15, 2019Date of Patent: August 6, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Super Liao, Chung-Hua Ku
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Publication number: 20240168332Abstract: Examples of light source distance alterations are described herein. An example device for providing light source distance alterations can include a display that includes a light source coupled to a piezo material to alter a distance between the light source and a corresponding aperture of an aperture layer.Type: ApplicationFiled: January 31, 2024Publication date: May 23, 2024Applicant: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi-Hao Chang
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Publication number: 20240158943Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a substrate can include a metal alloy. An acid anodizing layer can be formed on the substrate. A dye application can be applied on the acid anodizing layer. A first nickel-free sealing layer can be formed on the dye application. An alkaline anodizing layer can be formed on the first sealing layer. A second nickel-free sealing layer can be formed on the alkaline anodizing layer.Type: ApplicationFiled: March 19, 2021Publication date: May 16, 2024Inventors: Qingyong GUO, Ya-Ting YEH, Chi Hao CHANG, Kuan-Ting WU
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Publication number: 20240150590Abstract: A coated substrate for an electronic device can include a substrate, a basecoat layer on the substrate, and an anti-fingerprint topcoat layer on the basecoat layer. The substrate can include a metal or metal alloy. The basecoat layer can include pigment particles and a first one-part thermally cured polymeric resin. The anti-fingerprint topcoat layer can include a second one-part thermally cured polymeric resin and an anti-fingerprint material. The anti-fingerprint material can include a fluoropolymer, a silane, or a combination thereof. The basecoat layer can be cured before applying the anti-fingerprint topcoat layer on the basecoat layer.Type: ApplicationFiled: March 18, 2021Publication date: May 9, 2024Inventors: Kuan-Ting WU, Yong-Jun LI, Chi Hao CHANG, Xiao-Jun ZHU
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Patent number: 11952665Abstract: A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.Type: GrantFiled: June 11, 2019Date of Patent: April 9, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Hsing-Hung Hsieh, Super Liao
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Patent number: 11939677Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.Type: GrantFiled: June 11, 2019Date of Patent: March 26, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing-Hung Hsieh
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Patent number: 11920244Abstract: The application discloses examples of a device housing of an electronic device including a magnesium-alloy substrate. The device housing further including a treatment layer applied over the magnesium-alloy substrate and a metallic coating layer applied over the treatment layer to provide a metallic luster. Further, a paint coating layer is disposed over a first portion of the metallic coating layer. Further, a top coating layer is applied over the paint coating layer and a visible second portion of the metallic coating layer.Type: GrantFiled: July 24, 2018Date of Patent: March 5, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chi-Hao Chang, Ya-Ting Yeh, Kuan-Ting Wu, Chih-Hsiung Liao
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Publication number: 20240071285Abstract: In examples, an electronic device comprises an expandable display having a primary portion and first and second auxiliary portions. The expandable display has a default mode in which the first and second auxiliary portions are hidden and an expanded mode in which the first and second auxiliary portions are visible on opposing horizontal ends of the primary portion. The electronic device includes first and second timing controllers (TCONs) to control pixels in the expandable display.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Hsing-Hung HSIEH, Super LIAO, Kuan-Ting WU
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Patent number: 11910538Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.Type: GrantFiled: August 8, 2019Date of Patent: February 20, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Yi-Chen Chen, Kun Cheng Tsai, Kuan-Ting Wu, Ying-Hung Ku, Hsueh Chen Hung
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Patent number: 11892728Abstract: A device comprises a display that includes an aperture layer, a plurality of light sources, and a piezo material. The aperture layer includes a plurality of apertures. The plurality of light sources is arranged to correspond to the plurality of the aperture. The piezo material is coupled to the light sources and is configured to alter a distance between the light sources and the corresponding apertures.Type: GrantFiled: October 9, 2019Date of Patent: February 6, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi-Hao Chang
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Patent number: 11887993Abstract: The present disclosure is drawn to thin-film transistors, electronic displays that include thin-film transistors, and methods of making thin-film transistors. In one example, a thin-film transistor can include a nonconductive substrate, a semiconductor layer on the nonconductive substrate, a source electrode adjacent a first side of the semiconductor layer and partially overlapping a first peripheral portion of the semiconductor layer, a drain electrode adjacent a second side of the semiconductor layer and partially overlapping a second peripheral portion of the semiconductor layer, an etch stop layer on the semiconductor layer, a gat insulator layer on the etch stop layer, and a gate electrode on the gate insulator layer. The source electrode and the drain electrode do not overlap the etch stop layer.Type: GrantFiled: May 13, 2019Date of Patent: January 30, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Super Liao
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Patent number: 11808316Abstract: An electronic device can include a first electronic component, a second electronic component, and an energy dampener positioned between and in contact with the first electronic component and the second electronic component. The energy dampener in this example includes a carbon nanotube-aerogel matrix including carbon nanotubes embedded in an aerogel with a rubber composited therewith.Type: GrantFiled: June 29, 2022Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Chung-Hua Ku, Chi Hao Chang
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Patent number: 11789548Abstract: An input mouse may include a top button, a first wall rearward of the top button to underlie a palm of a user and a second wall forming an exterior of the input mouse. The first wall is formed from a material composition comprising a first polymer encapsulating thermally conductive particles. The second wall is formed from a thermally conductive material. A solid-state Peltier heat pump has a first face thermally coupled to the first wall and a second face thermally coupled to the second wall.Type: GrantFiled: July 17, 2020Date of Patent: October 17, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hsiao-Jou Lin, Kuan-Ting Wu, Alexander Williams