Patents by Inventor Kuan-Ting Wu

Kuan-Ting Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11360523
    Abstract: In one example, a hinge assembly is disclosed, which may include a first bracket, a second bracket, and a shaft to pivotally connect the first bracket and the second bracket. The shaft may have a composite neck portion. The composite neck portion may include a metal portion and a non-metallic washer fixedly attached to the metal portion.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: June 14, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei-Chung Chen, Kuan-Ting Wu
  • Patent number: 11361114
    Abstract: In an example implementation according to aspects of the present disclosure, a computing device includes a first member with a first display surface, and a second member rotatably connected to the first member, the second member including a second display surface. The computing device includes a sensor and a processor to receive sensor data from the sensor. Based on the sensor data, the processor is to select either a privacy mode or a sharing mode for the first display surface, and either the privacy mode or the sharing mode for the second display surface.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: June 14, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Alexander Wayne Clark, Kuan-Ting Wu
  • Patent number: 11353930
    Abstract: Examples herein relate to a hinge. In some examples, a hinge can include a first bracket connected to a shaft, a second bracket connected to the first bracket, a member connected to the shaft and magnetically attracted to a magnet at a first position, where the member translates relative to the magnet to a second position as the shaft rotates about an axis of the shaft, and the magnet to generate a magnetic attraction force between the member and the magnet, where the magnetic attraction force is higher at the second position than the first position.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: June 7, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei-Chung Chen, Kuan-Ting Wu, Kun-Hung Lin
  • Publication number: 20220167505
    Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.
    Type: Application
    Filed: August 8, 2019
    Publication date: May 26, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yi-Chen Chen, Kun Cheng Tsai, Kuan-Ting Wu, Ying-Hung Ku, Hsueh Chen Hung
  • Publication number: 20220162766
    Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.
    Type: Application
    Filed: August 14, 2019
    Publication date: May 26, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hslng-Hung Hsieh
  • Patent number: 11340398
    Abstract: A waveguide structure includes a first surface having a first width, a second surface having a second width, the second surface being opposite to the first surface, and a sidewall surface connecting the first surface and the second surface. The first width is greater than the second width.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: May 24, 2022
    Assignee: ARTILUX, INC.
    Inventors: Szu-Lin Cheng, Chien-Yu Chen, Han-Din Liu, Chia-Peng Lin, Chung-Chih Lin, Yun-Chung Na, Pin-Tso Lin, Tsung-Ting Wu, Yu-Hsuan Liu, Kuan-Chen Chu
  • Publication number: 20220152649
    Abstract: Examples of an alloy injection molded liquid metal substrate are described. In an example, an alloy injection molded liquid metal substrate includes a liquid metal substrate and an alloy injection molded on a first surface of the liquid metal substrate.
    Type: Application
    Filed: May 7, 2019
    Publication date: May 19, 2022
    Applicant: Hewlett-Packard Development, L.P.
    Inventors: Chi Hao Chang, Ya-Ting Yeh, Chih-Hsiung Liao, Kuan-Ting Wu
  • Patent number: 11334121
    Abstract: The present subject matter relates to hinge connectors with rotation control units. In an example, a hinge connector may couple a base unit with a cover unit of a device. The hinge connector includes hinge shaft. The rotation control unit is to control the rotation of the hinge shaft and stop a free-rotation of the hinge shaft at a predefined angle with respect to the base unit.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei-Chung Chen, Kuan-Ting Wu, Chung Hua Ku
  • Patent number: 11333860
    Abstract: An imaging lens system includes five lens elements, which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. At least one of an object-side surface and an image-side surface of the fifth lens element has at least one inflection point. The object-side surface and the image-side surface of the fifth lens element are both aspheric.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: May 17, 2022
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuan-Ting Yeh, Hung-Shuo Chen, Chien-Hsun Wu, Wei-Yu Chen
  • Publication number: 20220143770
    Abstract: The present disclosure is drawn to a cutting fluid for use in computer numerical control milling. The cutting fluid can include from about 10 wt % to about 90 wt % of a C2 to C6 alcohol; from about 0.1 wt % to about 20 wt % of a chelating agent; from about 0.5 wt % to about 15 wt % of a metal ion selected from aluminum ion, chromium ion, nickel ion, tin ion, zinc ion, or a combination thereof; and from about 8.5 wt % to about 88.5 wt % water. The cutting fluid can have a surface tension that can range from about 22 dynes/cm to about 55 dynes/cm.
    Type: Application
    Filed: July 26, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting WU, Qingyong GUO, Chi HAO
  • Publication number: 20220148500
    Abstract: A display having an area of non-transparent pixels, an area of transparent pixels, a camera positioned behind the transparent pixels to capture an image when light passes through the transparent pixels, and a display controller for driving the non-transparent pixels at a first brightness and driving the transparent pixels at a second brightness greater than the first brightness during image capture by the camera.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Dehuei Chen
  • Publication number: 20220147100
    Abstract: A foldable computing device is described. The foldable computing device can include a power switch, a display screen unit including a first magnet, a base unit and an actuator. The base unit can include an assembly with a second magnet and a third magnet. The assembly can be at a first position that causes the first magnet of the display screen unit to attract to the second magnet of the assembly of the base unit to lock the display screen unit. The actuator can receive an electrical pulse when the power switch is selected to power on the foldable computing device and provide a motion to move the assembly to a second position, to cause the first magnet of the display screen unit to be moved away from the second magnet and repulse the third magnet of the assembly in the base unit to unlock the display screen unit.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chalam Kashyap, Hung-Sung Pan, Kuan-Ting Wu
  • Publication number: 20220145488
    Abstract: The present disclosure is drawn to a multi-color electronic housing. The multi-color electronic housing can include a metal alloy having a first portion that can be milled, plasma-treated, and can include an electrodeposited colorant thereon. The metal alloy can further have a second portion that can be milled, plasma-treated, and can include second electrodeposited colorant thereon. The first electrodeposited colorant can provide a different coloration than the second electrodeposited colorant.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hsing-Hung Hsieh
  • Publication number: 20220148484
    Abstract: In some examples, a display comprises a first side, where the first side comprises a first portion of pixels that emit light to the first side of the display and a second portion of pixels, where a first subset of the second portion of pixels emit light to the first side of the display, and a second side comprising a second subset of the second portion of pixels that emit light to the second side of the display, where the first portion of pixels has a pixel density and the second portion of pixels has a pixel density.
    Type: Application
    Filed: July 29, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Chi Hao Chang
  • Publication number: 20220147118
    Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate with an opening therethrough, and a first protective coating covering the light metal substrate. A second protective coating is on the first protective coating, and a chamfered edge is present along the opening where the chamfer cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge. In one example, a transparent passivation layer is included along the chamfered edge.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chi Hao Chang, Kuan-Ting Wu, Hui He
  • Patent number: 11327534
    Abstract: In one example, a hinge assembly is disclosed, which may include a first member and a second member rotatably connected to the first member through a mounting portion. The mounting portion may include a first surface having a first protrusion and a second surface, opposite the first surface, having a second protrusion. Further, the hinge assembly may include a first cam fixed to the first member and disposed adjacent to the first surface and a second cam fixed to the first member and disposed adjacent to the second surface. The first cam and second cam being engageable with the first protrusion and the second protrusion, respectively, to shift an axis of rotation of the second member.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: May 10, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei-Chung Chen, Kuan-Ting Wu, Kun-Hung Lin
  • Publication number: 20220137680
    Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a substrate having an opening therethrough, or an outer edge, or both. A thermoplastic insert molding can include a metal oxide dopant, the thermoplastic insert molding positioned on the substrate. A paint coating can be included on the thermoplastic insert molding. A chamfered edge can be present on the substrate at a location that defines the opening, the outer edge, or both, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge. A metal layer can be formed using laser direct structuring masking a portion of the metal oxide dopant exposed at the chamfered edge. A second metal layer can be formed over the metal layer.
    Type: Application
    Filed: July 25, 2019
    Publication date: May 5, 2022
    Applicant: Hewlett- Packard Development Company, L.P.
    Inventors: Chien-Ting Lin, Kuan-Ting Wu, Chi Hao Chang
  • Publication number: 20220129039
    Abstract: In one example, an electronic device housing may include a metal substrate defining an opening and a shock absorber in-mold molded with the metal substrate. Further, shock absorber may include a supporting portion formed on a surface of the metal substrate and a protruding portion that extends from the supporting portion through the opening. Further, the electronic device housing may include a metal layer disposed on the supporting portion.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 28, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Cheng-Han Tsai, Kuan-Ting Wu, Chong-Wei Wu, Hung-Wei Wu
  • Publication number: 20220119971
    Abstract: In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.
    Type: Application
    Filed: May 9, 2019
    Publication date: April 21, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Chienchih Chiu
  • Publication number: 20220119683
    Abstract: A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a light source, a light guide plate and a reworkable optically clear adhesive film are described. The reworkable optically clear adhesive composition has a processing temperature of between about 50° C. and about 80° C. and comprises: from about 15 wt. % to about 40 wt. % hot melt adhesive; from about 20 wt. % to about 60 wt. % optical resin; and from about 10 wt. % to about 40 wt. % UV adhesive, wherein the weight percentage of each component is based on the total weight of the reworkable optically clear adhesive composition.
    Type: Application
    Filed: July 10, 2019
    Publication date: April 21, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Super Liao, Hsing-Hung Hsieh