Abstract: A coated substrate for an electronic device can include a substrate, a physical vapor deposition layer over the substrate, and an anti-fingerprint layer over the physical vapor deposition layer. The physical vapor deposition layer can include an alloy of gold and platinum. The anti-fingerprint layer can include an ultraviolet radiation-cured polymer mixed with an anti-fingerprint material. The anti-fingerprint material can include a silane, a fluorinated polymer, a hydrophobic polymer, or a combination thereof.

Abstract: A display having an area of non-transparent pixels, an area of transparent pixels, a camera positioned behind the transparent pixels to capture an image when light passes through the transparent pixels, and a display controller for driving the non-transparent pixels at a first brightness and driving the transparent pixels at a second brightness greater than the first brightness during image capture by the camera.

Abstract: The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.

Abstract: The manufacturing method of titanium dioxide solution includes: mixing choline chloride, urea, boric acid, and titanium tetrachloride to form a first solution, wherein a molar concentration ratio of choline chloride to urea is 1:2, a molar concentration of titanium tetrachloride is 0.2 M to 0.4 M, and weight/volume of boric acid is 5 g/300 ml to 15 g/300 ml; and heating the first solute ion to form a second solution, wherein the second solution contains carbon/nitrogen doped titanium dioxide. In the manufacturing method of the present disclosure, the deep eutectic solution formed by choline chloride and urea may be used as a solvent, and may also be used as a carbon source and/or a nitrogen source. Therefore, titanium dioxide may be doped with carbon and/or nitrogen during the formation process.

Abstract: The present disclosure describes thermal modules having solder-free thermal bonds, methods of forming the thermal modules, and electronic devices that include the thermal modules. In one example, a thermal module having a solder-free thermal bond can include an assembly of a heat pipe and a heat sink mechanically connected to the heat pipe at a bonding junction area. The bonding junction area can include a gap between the heat pipe and the heat sink at a portion of the bonding junction area. A ther-mal coating composition can coat the assembly and fill the gap. The thermal coating composition can include a cured resin and thermally conductive particles.

Abstract: Herein is described a substrate coated with a thermal management material for an electronic device, wherein the thermal management material comprises: a thermal conductive coat deposited on the substrate; and a heat insulation coat deposited on the thermal conductive coat, wherein the heat insulation coat comprises a plant root powder and a resin. A process for coating the substrate with a thermal management material, and an electronic device having a housing comprising a thermal management material is also described herein.

Abstract: The present disclosure is drawn to displays for electronic devices. In one example, the display includes a light emitting layer with an organic light emitting element. A porous substrate can be attached to the light emitting layer, wherein the porous substrate is flexible and spreads heat generated by the light emitting layer. A cover layer can be attached to a surface of the porous substrate opposite the light emitting layer.

Abstract: The present disclosure is drawn to bendable displays for electronic devices. In one example, a first display region including a glass panel that is rigid, the glass panel including a first interlocking edge. A second display region can include a plastic panel that is bendable, the plastic panel including a second interlocking edge that is shaped to inversely correspond with the first interlocking edge. An interlock zone where the first interlocking edge can be joined with the second interlocking edge such that the first display region and the second display region form a continuous display panel that is bendable at a location along the second display region.

Abstract: An example dual plate Organic Light-Emitting Field-Effect Transistor (OLET) display device includes a first plate device having a first substrate; a gate layer adjacent to the first substrate; and a dielectric layer adjacent to the gate layer. A second plate device is connected to the first plate device. The second plate device includes a second substrate; a source/drain layer adjacent to the second substrate; and a stacked active organic layer adjacent to the source/drain layer. The first plate device and the second plate device are to be independently fabricated and joined together to position the stacked active organic layer adjacent to the dielectric layer.

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, a cover comprises a substrate comprising a first metal; a second metal injection molded 10 on the surface of the substrate; a paint layer or an electrophoretic deposition layer on the second metal surface; a chamfered edge on the substrate, wherein the chamfered edge cuts through the paint layer or the electrophoretic deposition layer, the second metal, and partially through the first metal; and a hydrophobic coating.

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.

Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; insert molded plastic on at least one surface of the substrate; a passivation layer or a micro-arc oxidation layer applied on at least one surface of the substrate; a coating composition on the passivation layer or the micro-arc oxidation layer; an outmoid decoration layer on the mating composition; a chamfered edge on the substrate, wherein the chamfered edge cuts through the outmoid decoration layer, the coating composition, the passivation layer or the micro-arc oxidation layer, and partially through the substrate; and wherein the chamfered edge comprises; a transparent passivation layer, then an optional sealing layer, and then a transparent or color electrophoretic deposition coating layer.

Abstract: A foldable hinge is described herein that includes a plurality of interconnected sliding links, wherein each of the interconnected sliding links comprise at least one curved extruding prong and at least one curved rail. The at least one curved rail of a first interconnected sliding link can be coupled to the at least one curved extruding prong of a second interconnected sliding link to form a torque engine. Additionally, the interconnected sliding links can be rotatable based on a pressure applied to the interconnected sliding links. The foldable hinge can also include a plurality of shafts coupled to the plurality of interconnected sliding links, wherein each shaft is coupled to a separate interconnected sliding link.

Abstract: Described herein is a reworkable optically clear adhesive composition comprising: a hot melt adhesive present in an amount of at least about 40 wt. %; a pressure sensitive adhesive present in an amount of at 5 least about 10 wt. %; and titanium dioxide nanoparticles present in an amount of up to about 5 wt. %; wherein the weight percentage of each component is based on the total weight of solids of the adhesive composition. Also described herein is a display for an electronic device comprising the reworkable optically clear adhesive composition and a method of producing the display for an 10 electronic device.

Abstract: A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

Abstract: In example implementations, an apparatus is provided. The apparatus includes a movable light emitting diode (LED) base. A plurality of LED arrays is coupled to the movable LED base. The apparatus includes a grid that includes a plurality of walls. The grid is positioned such that each LED array of the plurality of LED arrays is adjacent to a wall of the plurality of walls.

Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.

Abstract: An electronic device can include a first electronic component, a second electronic component, and an energy dampener positioned between and in contact with the first electronic component and the second electronic component. The energy dampener in this example includes a carbon nanotube-aerogel matrix including carbon nanotubes embedded in an aerogel with a rubber composited therewith.

Abstract: A coated metal alloy substrate, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises an electrolytic sealing layer on the metal alloy substrate, and an electrophoretic deposition layer deposited on the electrolytic sealing layer.

Abstract: In example implementations, a display is provided. The display includes an organic light emitting diode (OLED). An anode is coupled to the OLED and a thin film transistor is coupled to the anode of the OLED. A cathode layer is coupled to the OLED. An electrically controllable reflective layer is coupled to the cathode layer. An electrode layer is coupled to the electrically controllable reflective layer to control an amount of reflectivity of the electrically controllable reflective layer.