Abstract: In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.

Abstract: A system may include a fingerprint scanner and a magnetic switch coupled to the fingerprint scanner. The magnetic switch may couple a lid of a computing device to abase of a computing device. The system may further include an infrared (IR) scanner coupled to the magnetic switch. Additionally, the system may include an electronic switch coupled to the IR scanner.

Abstract: In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side.

Abstract: Examples of light source distance alterations are described herein. An example device for providing light source distance alterations can include a display that includes a light source coupled to a piezo material to alter a distance between the light source and a corresponding aperture of an aperture layer.

Abstract: A lighting system may include a light guide to receive light from a light source; and a reflector plate including a frustrum structure formed on the surface of the reflector plate to receive refracted light from the light guide.

Abstract: The present disclosure provides a manufacturing method of a titanium dioxide solution and a titanium dioxide film. The manufacturing method of the titanium dioxide solution includes: mixing choline chloride, urea, boric acid, and titanium tetrachloride to form a first solution, wherein a molar concentration ratio of choline chloride to urea is 1:2, a molar concentration of titanium tetrachloride is 0.2 M to 0.4 M, and weight/volume of boric acid is 5 g/300 ml to 15 g/300 ml; and heating the first solution to form a second solution, wherein the second solution contains carbon/nitrogen doped titanium dioxide. In the manufacturing method of the present disclosure, the deep eutectic solution formed by choline chloride and urea may be used as a solvent, and may also be used as a carbon source and/or a nitrogen source. Therefore, titanium dioxide may be doped with carbon and/or nitrogen during the formation process.

Abstract: Examples of an anti-fingerprint enclosure for an electronic device have been described. In an example, the enclosure comprises an aluminum alloy substrate; a sealing layer deposited on a surface of the aluminum alloy substrate; and a magnesium fluoride sol-gel derived film deposited on the sealing layer, wherein the magnesium fluoride sol-gel derived film exhibits a refractive index of from about 1.36 to about 1.44.

Abstract: The present subject matter relates to self-healing keyboards. In an example implementation, a self-healing keyboard of an electronic device comprises a self-healing film having a self-healing layer disposed over a keyboard. The self-healing layer is composed of polyurethane, epoxy vinyl ester, epoxy, polyurethane microcapsules filled with silane compound, and a polysiloxane mixture.

Abstract: In example implementations, a display is provided. The display includes a plurality of light emitting diodes (LEDs), a thin film transistor (TFT) substrate, a liquid crystal layer, a color filter (CF) substrate, and a controller. The TFT substrate is formed over the LEDs to control emission of light from the plurality of LEDs. The liquid crystal layer is formed over the TFT substrate. The CF substrate is formed over the liquid crystal layer to control a color of the light emitted from the plurality of LEDs. The controller is communicatively coupled to the plurality of LEDs to group subsets of LEDs of the plurality of LEDs into a plurality of local dimming zones, wherein the subsets of LEDs in each one of the plurality of local dimming zones changes over time.

Abstract: In some examples, a pixel comprises a plurality of subpixels, wherein each subpixel includes a micro-motor, a rotatable substrate in which the micro-motor is embedded, and a plurality of micro-light emitting diodes (LEDs) embedded in the rotatable substrate.

Abstract: In one example, a hinge assembly is disclosed, which may include a band torque engine having at least one bearing portion and a vertical torque engine coupled to the band torque engine. The vertical torque engine may have an opening. The hinge assembly may include a first shaft received through the at least one bearing portion and the opening. The first shaft may be rotatable along an axis with respect to the band torque engine and the vertical torque engine. The hinge assembly may include a display bracket including an adaptor portion to hold the first shaft such that the first shaft rotates along with the display bracket. The band torque engine may provide a frictional torque and the vertical torque engine may compressively engage with the first shaft to provide a vertical frictional torque during rotation of the display bracket.

Abstract: An energy dampener for use in an electronic device can include a carbon nanotube-aerogel matrix, including carbon nanotubes embedded in an aerogel and a rubber composited with the carbon nanotube-aerogel matrix.

Abstract: In some examples, an organic light emitting transistor (OLET) comprises a substrate layer; a gate electrode disposed on the substrate layer; and a dielectric layer disposed on the gate electrode. The OLET further comprises a first organic semiconductor layer (OSL) disposed on the dielectric layer; a second OSL disposed on the first OSL; a third OSL disposed on the second OSL; a drain electrode disposed on the third OSL; a first source electrode partially disposed on both the first OSL and the third OSL; and a second source electrode partially disposed on both the first OSL and the third OSL, wherein a length of the first OSL is larger than lengths of both the second and third OSLs, and wherein a width of the first OSL is smaller than widths of both the second and third OSLs.

Abstract: A semiconductor composite layer can include a source electrode and a drain electrode individually comprising both a carrier mobility contributor and an amorphous phase stabilizer. The semiconductor composite layer can further include a semiconductive portion disposed between the source electrode and the drain electrode wherein the semiconductive portion comprises the carrier mobility contributor and the amorphous phase stabilizer, the semiconductivity controller comprising oxygen and an element having an electrode potential that is lower than that of both the carrier mobility contributor and the amorphous phase stabilizer.

Abstract: In one example, a device housing is described, which may include a base substrate and ion-exchanged glass beads disposed on an outer surface of the base substrate.

Abstract: Examples of hinge assemblies are described. In an example, a hinge assembly includes a first hinge element having a first shaft, a second hinge element having a second shaft, and a clip coupling the first shaft to the second shaft. The clip includes a first portion formed of c a composite material and a second portion formed of a metal.

Abstract: A dual-axis hinge assembly may include a casing defining a first slot and a second slot. Further, the dual-axis hinge assembly may include a first shaft and a second shaft received through the first and second slots, respectively. The first shaft and the second shaft may engage with a first housing and a second housing of an electronic device. Furthermore, dual-axis hinge assembly may include a foldable linkage disposed in the casing and connected between the first shaft and the second shaft. Furthermore, dual-axis hinge assembly may include an elastic member connected to the foldable linkage. The foldable linkage and the elastic member may enable the first shaft and the second shaft to slide along the first slot and the second slot to variably adjust a distance between a pivot axis of the first housing and a pivot axis of the second housing.

Abstract: In an example, a device includes a base unit, a cover unit, and a hinge assembly to couple the cover unit to the base unit The hinge assembly is moveable between a folded position and an unfolded position. The hinge assembly includes a channel, an annular holder disposed in the channel, a shaft engaged with the annular holder, and a hydraulic cylinder coupled to the shaft. The hydraulic cylinder is to move the shaft along a longitudinal axis of the shaft, based on a movement of the hinge assembly between the folded position and the unfolded position, to vary an operating torque of the hinge assembly.

Abstract: Examples of a dual injection-molded metal substrate have been described. In an example, a dual injection-molded metal substrate includes a magnesium alloy layer injection-molded on a portion of a first surface of an injection-molded aluminum alloy substrate.

Abstract: In an example implementation according to aspects of the present disclosure, a computing device includes a first member with a first display surface, and a second member rotatably connected to the first member, the second member including a second display surface. The computing device includes a sensor and a processor to receive sensor data from the sensor. Based on the sensor data, the processor is to select either a privacy mode or a sharing mode for the first display surface, and either the privacy mode or the sharing mode for the second display surface.