Abstract: An ice crushing device and a refrigerator are provided, the ice crushing device includes a housing assembly having a housing and an ice bucket supported in the housing; a driver for driving the ice bucket to rotate; an ice crusher disposed in the ice bucket; the housing assembly further includes an ice-discharging plate provided at a bottom of the ice bucket, the ice-discharging plate is provided with an ice-discharging port communicated with the ice bucket, wherein the driver includes a motor, a gear assembly driven by the motor, and a gear box accommodating the gear assembly, the gear box has an input end connected with the motor and an output end, wherein the gear box is mounted on the housing, and an axis of the output end is disposed in parallel with a rotation axis of the ice bucket.

Abstract: An ice crushing device and a refrigerator are provided, the ice crushing device includes a housing assembly including a housing and an ice bucket supported in the housing; a driver for driving the ice bucket to rotate; an ice crusher disposed in the ice bucket; wherein the ice crusher includes an ice cutter shaft fixed with respect to the housing, and several movable ice cutters and several fixed ice cutters disposed on the ice cutter shaft at an interval, each movable ice cutter includes three blades evenly distributed in the circumferential direction, the ice crusher further includes three ice agitating rods connected to the ice cutter shaft, the three ice-agitating rods are fixed corresponding one to one with the three blades, and at least one of the blades or one of the ice agitating rods is fixed relative to circumferential direction of the ice bucket.

Abstract: A branched air supply device includes: a shell having a peripheral wall portion, with the peripheral wall portion being provided with a plurality of air supply ports; a plurality of baffles, with each of the baffles being rotatably mounted at one of the air supply ports; a plurality of transmission assemblies, with each of the transmission assemblies being provided with a rotating member and a first transmission mechanism, and each of the first transmission mechanisms being configured to transmit a rotational motion of a corresponding rotating member to one of the baffles, so that the baffle is at rest or rotates; and a driving device having a driving source and a second transmission mechanism, with the second transmission mechanism being configured to transmit one motion, output by the driving source, to the plurality of rotating members, so that each of the rotating members is at rest or rotates.

Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

Abstract: The present disclosure relates to a narrow slit channel visualization experimental device and method under a six-degree-of-freedom motion condition. The system comprises a six-degree-of-freedom motion simulation platform, a main circulation loop, a cooling water system, an electric heating system and a bubble monitoring system, wherein the main circulation loop is composed of an S-shaped preheater, a three-surface visualization experimental section, a double-pipe condenser, a pressurizing circulating pump, a voltage stabilizer and related equipment, wherein the cooling water system is composed of the double-pipe condenser, a plate heat exchanger, a cooling tower, a cooling fan, a cooling water tank and related equipment, wherein the electric heating system is composed of a direct-current power supply, a low-voltage power controller and a transformer, and wherein the bubble monitoring system is composed of two high-speed cameras, a PIV measuring system and an electric servo module.

Abstract: A display substrate is provided, including a base and a first electrode layer. The first electrode layer includes a transparent conductive layer and a reflective layer. The transparent conductive layer includes transparent conductive units that are spaced apart, a transparent conductive unit includes a flat surface and sides on peripheries, and an included angle between the flat surface and a side is an obtuse angle. The reflective layer is located on a side of the transparent conductive layer proximate to the base. The reflective layer includes reflective units that are spaced apart; the reflective units and the transparent conductive units are in one-to-one correspondence, and a reflective unit and a corresponding transparent conductive unit are electrically connected; and an orthographic projection of the reflective unit on the base is within a range of an orthographic projection of a flat surface of the corresponding transparent conductive unit on the base.

Abstract: A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a semiconductor base, a bit line and a word line. The semiconductor base includes a substrate and an isolation structure. The isolation structure is arranged above the substrate and configured to isolate a plurality of active regions from each other. The bit line is arranged in the substrate and connected to the plurality of active regions. The word line is arranged in the isolation structure, intersects with the plurality of active regions and surrounds the plurality of active regions. The substrate is a Silicon-On-Insulator (SOI) substrate.

Abstract: A semiconductor structure includes a semiconductor base, a bit line and a word line. The semiconductor base includes a substrate and an isolation structure arranged above the substrate and configured to isolate a plurality of active regions from each other. The bit line is arranged in the substrate and connected to the plurality of active regions. The word line intersects with the plurality of active regions and surrounds the plurality of active regions.

Abstract: The present disclosure provides a display panel, including: a base substrate, a plurality of metal lead layers located on the base substrate, an insulating layer covering the plurality of metal lead layers, a driving transistor embedded on the base substrate, and a first electrode layer located on a surface of the insulating layer away from the base substrate, a binding area of the display panel including a first via hole exposing a first metal lead layer in the plurality of metal lead layers, a display area of the display panel including a second via hole penetrating the insulating layer, the first electrode layer being electrically connected to a first electrode of the driving transistor through the second via hole, and a slope angle of a sidewall of the first via hole being less than a slope angle of a sidewall of the second via hole.

Abstract: An embodiment of the present application provides a manufacturing method of a semiconductor structure, including: providing a base; forming a first mask layer with a first mask pattern on the base, and etching the base with the first mask layer as a mask to form an active region; forming a plurality of discrete bitlines on the active region; sequentially stacking a first spacer layer and a second spacer layer on a side wall of the bitline; forming a sacrificial layer between the adjacent second spacer layers; forming a second mask layer with a second mask pattern on the sacrificial layer, the first mask pattern being complementary to the second mask pattern; etching the sacrificial layer with the second mask layer and the bitline as masks to form multiple contact hole structures; and etching the first spacer layer to form a gap between the second spacer layer and the bitline.

Abstract: This disclosure relates to an organic electroluminescent structure and, a fabrication method thereof, and a display device. The organic electroluminescent structure includes a base substrate; a passivation protective layer formed at a side of the base substrate, in which the passivation protective layer is formed with a plurality of inner cutting portions arranged at intervals at a side facing away from the base substrate; an anode layer including a plurality of anodes arranged at intervals, and each of the anodes is correspondingly formed on the second surface; an organic light-emitting functional layer having a hole injection layer, in which the hole injection layer includes a plurality of hole injection blocks arranged at intervals, and each of the hole injection blocks is correspondingly formed on one anode; and a cathode layer formed at a side of the organic light-emitting functional layer facing away from the anode layer.

Abstract: This disclosure relates to an organic electroluminescent structure and a fabrication method thereof, and a display device. The organic electroluminescent structure includes a base substrate; an anode layer formed on the base substrate, in which the anode layer comprises a plurality of anodes arranged at intervals; an organic light-emitting functional layer having a hole injection layer, in which the hole injection layer includes a plurality of hole injection blocks arranged at intervals, and each of the hole injection blocks is correspondingly formed on the second surface of one of the anodes; and a cathode layer formed at a side of the organic light-emitting functional layer facing away from the anode layer.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. A semiconductor structure includes a semiconductor body, bit lines and word lines. The semiconductor body includes a substrate and an isolation structure positioned above the substrate and configured to isolate a plurality of active regions, part of each of the active regions being formed from the substrate. The bit lines are positioned in the substrate and are connected to the active regions. The word lines intersect with the active regions and surround the active regions. The substrate is Silicon On Insulator (SOI) substrate.

Abstract: The present disclosure discloses a fiber reinforce plastic (FRP) composite material pile prepared by an FRP composite material. The FRP composite material pile includes: an FRP winding pipe, an FRP pultrusion hollow profile, and a connecting device. The FRP pultrusion hollow profile includes an outer ring pipe, an inner ring pipe, and a plurality of reinforcing bars. The FRP pultrusion hollow profile is pultruded at one time by pultrusion equipment, and fiber materials thereof are arranged in the longitudinal direction of the pipe. The FRP winding pipe is provided with circumferential fiber materials by taking the FRP pultrusion hollow profile as a membrane, and forms a composite pipe section with the FRP pultrusion hollow profile. The inner ring shape of the cross section of the FRP winding pipe is matched with the FRP pultrusion hollow profile. The FRP connecting device includes connecting plates, connecting bars, and connecting pins.

Abstract: Provided is a manufacturing method of a semiconductor structure, including: providing a substrate; forming a first mask layer having a first mask pattern on the substrate, and etching the substrate by using the first mask layer as a mask to form active regions; forming several discrete bitlines on the active regions; forming a sacrificial layer between adjacent bitlines; forming a second mask layer having a second mask pattern on the sacrificial layer, the first mask pattern and the second mask pattern being complementary to each other; and etching the sacrificial layer by using the second mask layer and the bitlines as masks to form a plurality of contact structures. The embodiment of the present disclosure is beneficial to reducing the manufacturing cost of the semiconductor structure.

Abstract: The technology of this application relates to a memory management method and apparatus. When garbage collection is performed by using the method, stored information about a first reference cycle is first obtained, where the first reference cycle is a cyclic reference formed by a plurality of objects, and the information about the first reference cycle includes the plurality of objects in the first reference cycle and a reference relationship between the plurality of objects. The method further includes determining that a second reference cycle exists, where information about the second reference cycle matches the information about the first reference cycle, and the information about the second reference cycle includes a plurality of objects in the second reference cycle and a reference relationship between the plurality of objects. The method further includes reclaiming memory occupied by the plurality of objects in the second reference cycle.

Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

Abstract: A display substrate and a manufacturing method thereof, and a display device. The display substrate includes: a base substrate including a display region and a peripheral region surrounding the display region; a first light emitting element in the display region of the base substrate; and a color film structure on a display side of the first light emitting element. The color film structure includes: a first color film, including only a first pixel color film located in the display region; and a second color film, including a second pixel color film located in the display region and at least partially non-overlapping with the first pixel color film, and a first frame color film located in the peripheral region and surrounding the display region.

Abstract: In accordance with some embodiments of the disclosure, an array substrate and a related liquid crystal display device are provided. The array substrate can include a plurality of pixel electrodes arranged on a base substrate, and a conductive opaque line arranged between two neighboring pixel electrodes and overlapping with each of the two neighboring pixel electrodes along a width direction of the conductive opaque line.

Abstract: The invention provides a control system for controlling an intelligent system to reduce the power consumption based on a Bluetooth device, comprising: a main control chip; the Bluetooth device connected with the main control chip; a controller connected with the Bluetooth device and the main control chip, respectively, wherein the controller is connected with a power supply and is used for controlling the on and off of the power supply circuit of the main control chip; and an isolation circuit connected among the Bluetooth device, main control chip and the controller, when the controller controls the power supply circuit to be switched off, the isolation circuit enables the Bluetooth device at an enabled state. The issues, that the cost is increased due to the fact that the single-chip microcomputer is additionally arranged to realize Bluetooth wake-up and the overall power consumption of the intelligent system is high, are overcome.