Abstract: A memory includes: a substrate; a transistor array including multiple transistors on a surface of the substrate, conducting channels of the transistors extending in a direction perpendicular to the surface of the substrate; and a storage layer, disposed at a side of the conducting channel of each transistor, communicated with the conducting channel of the transistor, and configured to store charges and perform charge transfer with the communicated conducting channel.

Abstract: This disclosure relates to an organic electroluminescent structure and a display device. The organic electroluminescent structure includes a base substrate; a passivation protective layer provided at a side of the base substrate, in which the passivation protective layer is provided with a plurality of inner cutting portions arranged at intervals at a side facing away from the base substrate, each of the inner cutting portions has a first surface towards the base substrate and a second surface away from the base substrate, an orthographic projection of the first surface on the base substrate is within an orthographic projection of the second surface on the base substrate, and a groove is provided between two adjacent inner cutting portions and is formed as an inner cutting structure; an anode layer including a plurality of anodes arranged at intervals; an organic light-emitting functional layer having a hole injection layer.

Abstract: A display substrate and a manufacturing method and a display device are provided. The display substrate includes: a base substrate, a first insulation layer, a first electrode pattern, a connecting electrode pattern, a second electrode, a light-emitting functional layer, and a first filling layer. The second electrode is connected with the connecting electrode pattern, the second electrode and the first electrode pattern are spaced apart from each other. The light-emitting functional layer is located between the first electrode pattern and the second electrode. The first filling layer is located between the connecting electrode pattern and the first electrode pattern. The first filling layer and the light-emitting functional layer are different layers; a portion of the first insulation layer that is located between the first electrode pattern and the connecting electrode pattern has a groove, and the first filling layer is at least partially located in the groove.

Abstract: Methods, computer program products, and/or systems are provided that perform the following operations: determining that a log multi-process debug mode is specified; obtaining a log file for debugging a source code, wherein the log file includes a plurality of log records; inserting a plurality of process identifier fields into each current log record in the log file; inserting a new log record into the log file for a created new process; and providing for performance of debugging for the source code based in part on the plurality of process identifier fields inserted into each current log record.

Abstract: The present invention relates to a method for acquiring the water leakage amount of a leakage area in a water distribution system. In the method, a hydraulic model is coupled with monitored data, and the water leakage amounts of different areas in the water distribution system are obtained through inversion by optimizing the spatial distribution of water leakage amounts. In addition to the coupling of the hydraulic model with the monitored data, virtual sectorization and pipe leakage risk assessment are used. By using a minimum difference between a simulated value and a monitored value at a pressure measurement point as a target, the water leakage amounts of different areas in the water distribution system are calculated by an optimization algorithm. Compared with the prior art, the present invention actualizes the effective identification of leakage areas in a water distribution system with a high leakage rate (i.e., with many leakage points).

Abstract: A teleconferencing system, comprising: a camera, wherein the camera is configured to capture an image data stream comprising one or more image data frames in accordance with one or more image-capture parameters; and a processor coupled to the camera, wherein the processor is configured to: receive the image data stream from the camera; determine a region of interest within an image data frame of the image data stream; identify a sub-portion of the image data frame corresponding to the region of interest; evaluate a quality of image data corresponding to the sub-portion; determine that the quality of the image data corresponding to the sub-portion is below one or more predetermined quality thresholds; update one or more of the image-capture parameters of the camera, responsive to determining that the quality of the image data corresponding to the sub-portion is below the one or more predetermined quality thresholds.

Abstract: The present disclosure discloses a semiconductor device manufacturing method and a semiconductor device, relating to the technical field of semiconductors. The method includes: providing a semiconductor substrate, the semiconductor substrate comprising a shallow trench and active areas; forming an oxygen-containing layer on exposed outer surfaces of the shallow trench and the active areas; filling a first isolation layer of a set height in the shallow trench comprising the oxygen-containing layer on its surface, the set height being lower than heights of the active areas; forming an etch stop layer on an upper surface of the first isolation layer; filling a second isolation layer on the etch stop layer in the shallow trench to form a shallow trench isolation (STI) structure; and etching the active areas and the STI structure to form wordline trenches, the bottoms of the wordline trenches in the STI structure are higher than the set height.

Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

Abstract: A thawing method for a thawing device includes: generating, by a radio frequency generation module, a radio frequency signal in a frequency range of 40 to 42 MHz; obtaining the radio frequency signal; and generating, by an upper electrode plate and a lower electrode plate, radio frequency waves of corresponding frequency in a thawing chamber according to the radio frequency signal, and thawing an object to be processed in the thawing chamber. Radio frequency waves using the above frequency range have shorter thawing time, higher temperature-uniformity and lower juice loss rate than radio frequency waves of other frequencies.

Abstract: A teleconferencing system, comprising: a camera, wherein the camera is configured to capture an image data stream comprising one or more image data frames in accordance with one or more image-capture parameters; and a processor coupled to the camera, wherein the processor is configured to: receive the image data stream from the camera; determine a region of interest within an image data frame of the image data stream; identify a sub-portion of the image data frame corresponding to the region of interest; evaluate a quality of image data corresponding to the sub-portion; determine that the quality of the image data corresponding to the sub-portion is below one or more predetermined quality thresholds; update one or more of the image-capture parameters of the camera, responsive to determining that the quality of the image data corresponding to the sub-portion is below the one or more predetermined quality thresholds.

Abstract: The present disclosure discloses a semiconductor device manufacturing method and a semiconductor device, relating to the technical field of semiconductors. The method includes: providing a semiconductor substrate, the semiconductor substrate comprising a shallow trench and active areas; forming an oxygen-containing layer on exposed outer surfaces of the shallow trench and the active areas; filling a first isolation layer of a set height in the shallow trench comprising the oxygen-containing layer on its surface, the set height being lower than heights of the active areas; forming an etch stop layer on an upper surface of the first isolation layer; filling a second isolation layer on the etch stop layer in the shallow trench to form a shallow trench isolation (STI) structure; and etching the active areas and the STI structure to form wordline trenches, the bottoms of the wordline trenches in the STI structure are higher than the set height.

Abstract: A data processing method based on network slices comprises determining on a data plane a network slice to which a data flow belongs according to network slice resource information, an uplink port receiving the data flow, virtual local area network (VLAN) information carried by the data flow, and destination media access control (MAC) address of the data flow. The method further comprises processing and forwarding the data flow through the network slice to which the data flow belongs. In the network slice resource information, different network slices sharing a VLAN on a shared uplink port are configured with different three-layer interface MAC addresses.

Abstract: The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a substrate; a first transistor, located on the substrate; a second transistor, located above the first transistor; and a gate structure, the gate structure including a first gate layer and a second gate layer, which connected to each other, the first gate layer surrounding the first transistor and the second gate layer surrounding the second transistor; an extension direction of the first transistor and an extension direction of the second transistor are both perpendicular to the substrate.

Abstract: A semiconductor structure includes a base and conductive channel structure which includes first and second conductive channel layers and conductive buffer layer. The first conductive channel layer includes a first conductive channel, first and second doped regions on both sides of the first conductive channel; the second conductive channel layer includes a second conductive channel and third and fourth doped regions on both sides of the second conductive channel; the conductive buffer layer reduces electrical interference between the first and third doped regions. The semiconductor structure further includes a first wire layer disposed on the base extending in a direction and in contact with the second doped region; a second wire layer extending in another direction and in contact with the first and third doped regions; and a gate structure disposed around the first and second conductive channels.

Abstract: The present disclosure provides a semiconductor device and a method for manufacturing a semiconductor device. Every two first wires of a first conductive layer of the semiconductor device have a common end, and every two second wires of a second conductive layer of the semiconductor device have a common end.

Abstract: A semiconductor structure includes a base and a conductive channel structure, in which the conductive channel structure includes a base and a conductive channel structure which includes a first conductive channel layer including a first conductive channel, and a first and a second doped regions respectively located at two ends of the first conductive channel, a second conductive channel layer including a second conductive channel, and a third and a fourth doped regions respectively located at two ends of the second conductive channel and a conductive buffer layer configured to reduce electrical interference between the first and the third doped regions; a first conductive layer in contact with the second doped region; a second conductive layer nested on the conductive channel structure and in contact with the first and the third doped regions; and a gate structure arranged around the first conductive channel and the second conductive channel.

Abstract: A display substrate includes a substrate and a light-emitting device layer which includes a first electrode layer, a light-emitting functional layer, and a second electrode layer that are sequentially stacked in a direction away from the substrate. The first electrode layer includes a reflective layer, an insulating layer, and a transparent conductive layer that are sequentially stacked in the direction away from the substrate. In a red sub-pixel region, a thickness of a first portion of the insulating layer is within a range of about 1000 ? to about 2500 ?. In a green sub-pixel region, a thickness of a second portion of the insulating layer is within a range of about 500 ? to about 2000 ?. In a blue sub-pixel region, a thickness of a third portion of the insulating layer is within a range of about 1500 ? to about 3000 ?.

Abstract: An ice crushing device and a refrigerator, the ice crushing device comprising: a housing assembly comprises a housing and an ice bucket supported in the housing; a driver for driving the ice bucket to rotate, at least a portion of the driver being mounted in the housing; an ice crusher disposed in the ice bucket; the housing assembly further comprises an ice-discharging plate provided at a bottom of the ice bucket, the ice-discharging plate is provided with an ice-discharging port communicated with the ice bucket, ice cubes are discharged out of the ice-discharging port after being crushed in the ice bucket by the ice crusher, a slope is disposed on the ice-discharging plate at a position adjacent to the ice-discharging port and along a rotary ice discharge direction, and the slope is located on an ice discharge side of the ice-discharging plate and disposed uphill.

Abstract: An ice crushing device and a refrigerator are provided, the ice crushing device includes a housing assembly having a housing and an ice bucket supported in the housing; a driver for driving the ice bucket to rotate; an ice crusher disposed in the ice bucket; wherein the driver includes a motor and a gear assembly driven by the motor. The gear assembly includes a first bevel gear connected to the motor, a second bevel gear meshing with the first bevel gear, and a cylindrical gear coaxially arranged with the second bevel gear. A stop ring and a seal assembly that engage with each other are disposed between the second bevel gear and the cylindrical gear, the seal assembly matches the housing to separate the space between the second bevel gear and the cylindrical gear.

Abstract: An ice crushing device and a refrigerator are provided, the ice crushing device includes a housing assembly including a housing and an ice bucket supported in the housing; a driver for driving the ice bucket to rotate, at least a portion of the driver being mounted in the housing; an ice crusher disposed in the ice bucket; the housing assembly further includes an ice-discharging plate provided at a bottom of the ice bucket, the ice-discharging plate is provided with an ice-discharging port, wherein the housing includes a first portion that houses the ice bucket and a second portion in which the driver is mounted, a groove extending along the circumferential direction of the ice bucket is provided between the ice-discharging plate and the first portion, the groove is communicated with the ice-discharging port, and a lower edge of the ice bucket projects into the groove.