Abstract: A compressor, comprising: a housing (101) provided with a rotor accommodating cavity (105) and an exhaust cavity (180); and a pair of screw rotors (110) at least partially located in the rotor accommodating cavity (105), a compression accommodating cavity (150) being formed between teeth of the pair of screw rotors (110) and the housing (101), and the pair of screw rotors (110) having a suction end (112) and an exhaust end (113), wherein the housing (101) further comprises an unloading channel (208) and a connecting channel (308), the unloading channel (208) is provided with an unloading channel inlet (216) and an unloading channel outlet (217), the unloading channel inlet (216) can be communicated with the compression accommodating cavity (150) through the connecting channel (308), and the unloading channel outlet (217) is communicated with a suction side of the compressor; and an unloading device (109) configured to controllably open or close the connecting channel (308), such that the compression accommoda

Abstract: A transmission channel switching method is provided. The transmission channel switching method may include the following steps. An apparatus may establish a plurality of transmission channels. The apparatus may transmit data through a default transmission channel of the transmission channels, wherein the default transmission channel corresponds to the lowest power consumption. The apparatus may determine whether to switch to another transmission channel of the transmission channels according to channel quality of each transmission channel and power consumption corresponds to each transmission channel.

Abstract: A package substrate is provided, in which dielectric layers are formed on a core board, and a wiring layer is embedded in at least one of the dielectric layers, so that the wiring layer has better copper adhesion to prevent delamination problems. A method of fabricating the package substrate is also provided.

Abstract: Provided is an electronic package, in which an external connection structure is formed on a first side of a circuit structure, at least one circuit assembly electrically connected to the circuit structure and at least one electronic element electrically connected to the circuit structure are disposed on a second side of the circuit structure, and the circuit assembly and the electronic element are encapsulated by a cladding layer. The coefficients of thermal expansion (CTEs) of the circuit assembly and the cladding layer are both greater than the CTE of the circuit structure, and the CTE of the circuit structure is greater than the CTE of the external connection structure, so as to prevent the difference in CTEs between the first side and the second side of the circuit structure from being significantly changed, thereby preventing the electronic package from warpage.

Abstract: An interconnection structure (for a multi-chip interposer) includes: a first via stack at a first one amongst locations, the locations correspondingly being defined relative to first and second perpendicular directions, the via stack including vias stacked over each other in a third direction perpendicular to each of the first and second directions; a transition segment in a transition layer and overlapping and coupled to an uppermost one of the vias in the via stack at the first location, the transition segment being conductive and extending in at least the first direction or the second direction to overlap a second one of locations offset from the first location; and a first contact bump at the second location and over and coupled to the via stack.

Abstract: A temporary storage and reflow frame substrate system includes a substrate frame, a substrate loading and unloading station, a first conveying unit, and a second conveying unit. The substrate frame is suitable for loading the substrate. The substrate loading and unloading station includes a robotic arm, a feeding and discharging unit and a returning unit, the substrate frame is suitable for connecting to the feeding and discharging unit and the returning unit, the robotic arm is suitable to place the substrate into or remove the substrate from the substrate frame. The first conveying unit is connected to the feeding and discharging unit and is suitable for conveying the substrate frame. The second conveying unit is connected between the first conveying unit and the returning unit, in order to return the substrate frame to the returning unit, thereby loading and unloading the substrate at the substrate loading and unloading station.

Abstract: A composite material and a method for manufacturing the composite material are provided. The composite material includes a laminated structure formed by co-extruding a thermoplastic elastomer and a modified thermoplastic elastomer. The use of the thermoplastic elastomer and the modified thermoplastic elastomer in the composite material can significantly reduce emissions during the manufacturing process, and the manufacturing process is simple and stable, and can improve the wear resistance of the composite material.

Abstract: An electronic package is provided, in which a cover layer is embedded in a circuit structure to form a groove, and an electronic element is disposed on the cover layer in the groove. A cladding layer encapsulates the electronic element, and an external connection structure is disposed on the circuit structure and the cladding layer. Therefore, the electronic element is embedded in the groove, such that a thickness of the electronic package can be greatly reduced to meet the requirement of thinning.

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

Abstract: Disclosed in the present application are an economizer and a refrigeration system comprising same. The economizer comprises: an outer shell that internally comprises a heat exchange cavity and a gas-liquid separation cavity; and a heat exchange tube bundle provided in the heat exchange cavity. The economizer is configured to enable refrigerants from a condenser to be subjected to heat exchange in the heat exchange cavity first, and then to be subjected to gas-liquid separation in the gas-liquid separation cavity after passing through a first-stage throttling device, such that gas refrigerants flow out of a gas outlet of the gas-liquid separation cavity, and liquid refrigerants flow out of a liquid outlet of the gas-liquid separation cavity.

Abstract: A vibration frequency adjustment system, comprising a vibratable component (102), at least one counterweight (401, 402), at least one drive device (407, 408), and a controller (307). The vibratable component (102) is configured to be connected to a vibration source (101). The vibration source (101) has an operating frequency range, and the vibratable component (102) has a natural vibration frequency. The at least one counterweight (401, 402) is configured to be movable along the vibratable component (102). The at least one drive device (407, 408) is configured to enable the at least one counterweight (401, 402) to be maintained at or moved to various counterweighting positions (421, 422, 423) on the vibratable component (102). The controller (307) is communicatively connected to the at least one drive device (407, 408). The vibration frequency adjustment system is used for a variable-frequency screw unit so as to reduce the vibration of an exhaust pipe.

Abstract: A method for detecting a contact force of a probe card is provided. The method includes contacting a pressure film sensor with a plurality of needles over a lower surface of the probe card. The method includes detecting the contact force of the probe card via the pressure film sensor. The method also includes adjusting a position of a push base over an upper surface of the probe card based on the detected contact force of the pressure film sensor.

Abstract: An electronic device is provided. The electronic device includes a first subscriber identity module (SIM), a second SIM, and a processor. The processor is configured to merge a first signal from the first SIM and a second signal from the second SIM and transmit the first signal and the second signal through a radio frequency front end (RFFE) transmission path concurrently, in response to a determination that the first signal and the second signal are intra-band signals and the first SIM and the second SIM share one RFFE transmission path.

Abstract: A cooling structure having a metal plating layer is provided with a substrate, a first metal plating layer and a second metal plating layer that are made of materials different from each other and formed on the substrate by different processes. The first metal plating layer is formed on the substrate by a wetting process. The second metal plating layer having a thickness ranging from 0.1 ?m to 5 ?m is formed on the first metal plating layer by a sputtering process. The second metal plating layer includes at least three blocks arranged at intervals, and at least two adjacent ones of the at least three blocks have a distance therebetween that is not equal to a distance between another two adjacent ones of the at least three blocks.

Abstract: The invention relates to a method, a non-transitory computer-readable storage medium, and an apparatus for debugging a solid-state disk (SSD) device. The method is performed by a processing unit of a single-board personal computer (PC) to include: simulating to issue a first Joint Test Action Group (JTAG) command through a General-Purpose Input/Output (GPIO) interface (I/F) to the SSD device for stopping a running of a processing unit of a flash controller in the SSD device; simulating to issue a second JTAG command through the GPIO I/F to the SSD device for forcing the SSD device to exit a sleep mode; and simulating to issue a third JTAG command through the GPIO I/F to the SSD device for reading a designated length of data from a static random access memory (SRAM) in the SSD device.

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

Abstract: The present invention relates to a composition or combination for the production of butanol and isopropanol, comprising an acetone-butanol-ethanol (ABE)-producing Clostridium strain and a genetically engineered B. subtilis strain, wherein said genetically engineered B. subtilis strain has been transformed by at least one polynucleotide molecule; the at least one polynucleotide molecule comprising a secondary alcohol dehydrogenase gene operably linked to at least one promoter. The invention also relates to methods of producing butanol and isopropanol in a co-culture, methods of producing butyrate, isopropanol and butanol in a co-culture and methods of producing esters.

Abstract: The present disclosure is directed to a fluid head that is configured to eject a first fluid (e.g., a liquid state fluid) and a second fluid (e.g., a gaseous state fluid). The fluid head is movable in a rotatable-fashion and a translatable-fashion such that the fluid head may be utilized to increase a speed and decrease a period of time for cleaning and drying a workpiece after an electro-chemical polishing (ECP) process or step. The fluid head may also be utilized to increase a speed and decrease a period of time for beveling an edge of a conductive layer on the workpiece. The present disclosure is also directed to methods for cleaning and drying the workpiece as well as beveling the conductive layer of the workpiece utilizing the fluid head.

Abstract: A cooler having an optimized coating structure for an electric vehicle power module is provided. The cooler includes a metal cooling substrate and a coating structure. The coating structure has at least a barrier layer and a function layer. The barrier layer is formed on the metal cooling substrate. The barrier layer is a nickel coating layer or a nickel alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m. The function layer is a silver/silver alloy coating layer, or a copper/copper alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m.

Abstract: An apparatus is provided. The apparatus includes a stage and a plate disposed on the stage. The apparatus further includes a pressure film sensor that is formed on the plate and configured to detect a contact force between a plurality of needles on a probe head of a probe card and the pressure film sensor. The apparatus still includes a distance detector that is configured to detect a distance between the pressure film sensor and the needles. In addition, the apparatus includes an adjustment driver that is configured to adjust the probe card based on the detected contact force of the pressure film sensor.