Abstract: Provided is a package substrate including a dielectric layer having a first surface and a second surface opposite to the first surface; an insulating layer formed on the first surface of the dielectric layer and having a plurality of grooves; a first circuit layer formed in the plurality of grooves and flush with the insulating layer; a second circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive pillars formed in the dielectric layer and electrically connected to the first circuit layer and the second circuit layer. The present disclosure further provides a method of manufacturing the package substrate.

Abstract: A golf club setting rack has a first fixing portion, a second fixing portion, a first cross structure, and a second cross structure. The first fixing portion and the second fixing portion are mounted on the opening frame of the golf bag. The first cross structure and the second cross structure are securely mounted on the first fixing portion and the second fixing portion. Each one of the first cross structure and the second cross structure has multiple recesses. The recesses of the first cross structure correspond to the first row compartments of the opening frame in location; the recesses of the second cross structure correspond to the second row compartments of the opening frame in location. Therefore, when multiple clubs are stored in the compartments of the golf bag, heads of the clubs may be received and constrained in the recesses of the golf club setting rack.

Abstract: A manufacturing method of an electronic package is provided, including: providing a circuit structure having a circuit layer; forming an insulating layer on the circuit structure, wherein the insulating layer has a plurality of first vias; forming a plurality of conductive pillars in the plurality of first vias, and disposing an electronic element on the insulating layer; forming an encapsulation layer, on the insulating layer, covering the electronic element and the plurality of conductive pillars, wherein the encapsulation layer has a plurality of second vias exposing the plurality of conductive pillars; and filling in the second vias with a plurality of conductive materials. The present disclosure further provides an electronic package.

Abstract: A traffic patterned-based modem function adjustment method includes receiving at least one traffic pattern by a user device, identifying the at least one traffic pattern by the user device for detecting a traffic mode of the user device, acquiring assisted information of the at least one traffic pattern by the user device, and adjusting at least one modem function according to the traffic mode and the assisted information. The at least one traffic pattern includes packet transmission characteristics, a radio signal status, and/or codec information of a network communicating with the user device.

Abstract: A method and system for controlling a supply voltage provided to a processor by generating a voltage setting command by a workload scheduler; and responding to the voltage setting command by instructing a voltage regulator that provides the supply voltage, at a supply voltage level, to set the supply voltage level to one of at least an idle voltage level or an active voltage level that is higher than the idle voltage level.

Abstract: A monitoring system includes a vibrating module, an acoustic emission sensor and a processing device. The vibrating module is configured to vibrate a target object. The acoustic emission sensor is configured to sense an acoustic emission signal with liquid generated by a deformation of the target object. The processing device is connected to the vibrating module and the acoustic emission sensor, and is configured to receive the acoustic emission signal and perform: dividing the acoustic emission signal into signal segments having a same time length, performing a time-frequency transformation on the signal segments to generate power spectrums, performing an average calculation on the power spectrums to generate a power spectral density, and adjusting or maintaining an operation parameter of the vibrating module according to a comparison result between a default difference value and a difference value between a maximum value of the power spectral density and a set value.

Abstract: A wafer chuck assembly is provided. In one embodiment, the chuck assembly comprises a hub, a plurality of arms mounted to the hub and a plurality of holders. Each arm extends outwardly from the hub, and each arm has a proximal end adjacent the hub and a distal end remote from the hub. Each holder is mounted at the distal end of each respective arm, and each holder has a plurality of support pins configured to support a wafer.

Abstract: A package substrate is provided, in which a plurality of grooves are formed on a dielectric layer, so that a first circuit layer is embedded in the dielectric layer and is exposed from the grooves, wherein the depths of the plurality of grooves are uniform to facilitate embedding a plurality of solder balls in the plurality of grooves and bonding the plurality of solder balls to the first circuit layer.

Abstract: Disclosed is a screw compressor (100), comprising a screw compressor housing (101), a discharge cavity (113), at least one silencing channel, and at least one adjustment piston, wherein the discharge cavity (113) is defined by at least one part of the screw compressor housing (101); the at least one part of the screw compressor housing (101) defining the discharge cavity (113) forms a wall of the discharge cavity (113); at least one hole is provided in the wall of the discharge cavity (113); the at least one adjustment piston can be inserted into the at least one hole and move therein; the at least one silencing channel is formed by the at least one hole and the at least one adjustment piston, and the at least one silencing channel is in fluid communication with the discharge cavity (113); and the position of the at least one adjustment piston in the at least one hole determines the silencing length of the at least one silencing channel.

Abstract: A compressor, comprising: a housing (101) provided with a rotor accommodating cavity (105) and an exhaust cavity (180); and a pair of screw rotors (110) at least partially located in the rotor accommodating cavity (105), a compression accommodating cavity (150) being formed between teeth of the pair of screw rotors (110) and the housing (101), and the pair of screw rotors (110) having a suction end (112) and an exhaust end (113), wherein the housing (101) further comprises an unloading channel (208) and a connecting channel (308), the unloading channel (208) is provided with an unloading channel inlet (216) and an unloading channel outlet (217), the unloading channel inlet (216) can be communicated with the compression accommodating cavity (150) through the connecting channel (308), and the unloading channel outlet (217) is communicated with a suction side of the compressor; and an unloading device (109) configured to controllably open or close the connecting channel (308), such that the compression accommoda

Abstract: A transmission channel switching method is provided. The transmission channel switching method may include the following steps. An apparatus may establish a plurality of transmission channels. The apparatus may transmit data through a default transmission channel of the transmission channels, wherein the default transmission channel corresponds to the lowest power consumption. The apparatus may determine whether to switch to another transmission channel of the transmission channels according to channel quality of each transmission channel and power consumption corresponds to each transmission channel.

Abstract: A package substrate is provided, in which dielectric layers are formed on a core board, and a wiring layer is embedded in at least one of the dielectric layers, so that the wiring layer has better copper adhesion to prevent delamination problems. A method of fabricating the package substrate is also provided.

Abstract: Provided is an electronic package, in which an external connection structure is formed on a first side of a circuit structure, at least one circuit assembly electrically connected to the circuit structure and at least one electronic element electrically connected to the circuit structure are disposed on a second side of the circuit structure, and the circuit assembly and the electronic element are encapsulated by a cladding layer. The coefficients of thermal expansion (CTEs) of the circuit assembly and the cladding layer are both greater than the CTE of the circuit structure, and the CTE of the circuit structure is greater than the CTE of the external connection structure, so as to prevent the difference in CTEs between the first side and the second side of the circuit structure from being significantly changed, thereby preventing the electronic package from warpage.

Abstract: An interconnection structure (for a multi-chip interposer) includes: a first via stack at a first one amongst locations, the locations correspondingly being defined relative to first and second perpendicular directions, the via stack including vias stacked over each other in a third direction perpendicular to each of the first and second directions; a transition segment in a transition layer and overlapping and coupled to an uppermost one of the vias in the via stack at the first location, the transition segment being conductive and extending in at least the first direction or the second direction to overlap a second one of locations offset from the first location; and a first contact bump at the second location and over and coupled to the via stack.

Abstract: A temporary storage and reflow frame substrate system includes a substrate frame, a substrate loading and unloading station, a first conveying unit, and a second conveying unit. The substrate frame is suitable for loading the substrate. The substrate loading and unloading station includes a robotic arm, a feeding and discharging unit and a returning unit, the substrate frame is suitable for connecting to the feeding and discharging unit and the returning unit, the robotic arm is suitable to place the substrate into or remove the substrate from the substrate frame. The first conveying unit is connected to the feeding and discharging unit and is suitable for conveying the substrate frame. The second conveying unit is connected between the first conveying unit and the returning unit, in order to return the substrate frame to the returning unit, thereby loading and unloading the substrate at the substrate loading and unloading station.

Abstract: A composite material and a method for manufacturing the composite material are provided. The composite material includes a laminated structure formed by co-extruding a thermoplastic elastomer and a modified thermoplastic elastomer. The use of the thermoplastic elastomer and the modified thermoplastic elastomer in the composite material can significantly reduce emissions during the manufacturing process, and the manufacturing process is simple and stable, and can improve the wear resistance of the composite material.

Abstract: An electronic package is provided, in which a cover layer is embedded in a circuit structure to form a groove, and an electronic element is disposed on the cover layer in the groove. A cladding layer encapsulates the electronic element, and an external connection structure is disposed on the circuit structure and the cladding layer. Therefore, the electronic element is embedded in the groove, such that a thickness of the electronic package can be greatly reduced to meet the requirement of thinning.

Abstract: Disclosed in the present application are an economizer and a refrigeration system comprising same. The economizer comprises: an outer shell that internally comprises a heat exchange cavity and a gas-liquid separation cavity; and a heat exchange tube bundle provided in the heat exchange cavity. The economizer is configured to enable refrigerants from a condenser to be subjected to heat exchange in the heat exchange cavity first, and then to be subjected to gas-liquid separation in the gas-liquid separation cavity after passing through a first-stage throttling device, such that gas refrigerants flow out of a gas outlet of the gas-liquid separation cavity, and liquid refrigerants flow out of a liquid outlet of the gas-liquid separation cavity.

Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.

Abstract: A vibration frequency adjustment system, comprising a vibratable component (102), at least one counterweight (401, 402), at least one drive device (407, 408), and a controller (307). The vibratable component (102) is configured to be connected to a vibration source (101). The vibration source (101) has an operating frequency range, and the vibratable component (102) has a natural vibration frequency. The at least one counterweight (401, 402) is configured to be movable along the vibratable component (102). The at least one drive device (407, 408) is configured to enable the at least one counterweight (401, 402) to be maintained at or moved to various counterweighting positions (421, 422, 423) on the vibratable component (102). The controller (307) is communicatively connected to the at least one drive device (407, 408). The vibration frequency adjustment system is used for a variable-frequency screw unit so as to reduce the vibration of an exhaust pipe.