Patents by Inventor Kun Lin

Kun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240254663
    Abstract: A safety strap has an outer layer, an inner layer disposed in the outer layer and a plurality of interlace strands. The inner layer has a plurality of warp strand bundles and a plurality of first weft strands woven with each other. Each of the warp strand bundles has more than one first warp strand. The outer layer is woven with a plurality of second warp strands and a plurality of second weft strands. The interlace strands continuously intertwine with the second weft strands and the first weft strands.
    Type: Application
    Filed: January 27, 2023
    Publication date: August 1, 2024
    Inventor: CHUNG-KUN LIN
  • Publication number: 20240176256
    Abstract: A substrate processing apparatus includes a substrate cleaning apparatus. Accordingly, the present application can be used for the transfer of the substrate cleaning and insertion frame, in order to achieve the effect of facilitating the transfer of the substrate to subsequent processes.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Inventor: KUN-LIN CHOU
  • Publication number: 20240151743
    Abstract: The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective tip of a respective needle includes removing respective portions from the end of the conductive body by flowing an electrolytic fluid between a conductive pattern structure and an end of the respective conductive body. Removing the respective portions with the flow of the electrons may be performed in multiple successive steps to form various needles with various sizes, shapes, and profiles (e.g., cylindrical, rectangular, triangular, trapezoidal, etc.).
    Type: Application
    Filed: February 7, 2023
    Publication date: May 9, 2024
    Inventors: Ting-Yu CHIU, Yi-Neng CHANG, Wen-Chun TU, Te-Kun LIN, Chien Fang HUANG
  • Patent number: 11973261
    Abstract: An antenna structure with wide radiation bandwidth in a reduced physical space includes a metallic housing, a first feed portion, and a second feed portion. The metallic housing includes a metallic side frame and a metallic back board. The metallic side frame defines a slot, and first and second gaps. The metallic side frame between the first gap and one end of the slot forms a first radiation portion. The second gap divides the first radiation portion into first and second radiation sections. The first feed portion feeds current and signal to the first radiation section, and the first radiation section works in a GPS mode and a WIFI 2.4 GHz mode. The second feed portion feeds current and signal to the second radiation section, and the second radiation section works in a WIFI 5 GHz mode.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: April 30, 2024
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Kun-Lin Sung, Yung-Chin Chen, Yi-Chieh Lee
  • Publication number: 20240117451
    Abstract: Positive reference spiked in collected sample for use in qualitatively and quantitatively detecting viral RNA.
    Type: Application
    Filed: March 10, 2021
    Publication date: April 11, 2024
    Inventors: Shuwei YANG, Liancheng HUANG, Feifei FENG, Longwen SU, Kun LIN, Can TANG, Chen LIANG, Yuanmei WANG, Yanqing CAI, Yilin PANG, Chuan SHEN, Zhixue YU
  • Publication number: 20240107608
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE enters a first radio resource control (RRC) connection with a first base station of a first network. The UE receives, from the first base station, an indication that enables the UE to send a first request for deactivating or releasing resources used for communications with the first base station. In response to a determination to enter a second RRC connection with a second base station of a second network, the UE sends, to the first base station, the first request for deactivating or releasing the resources. The UE enters the second RRC connection with the second base station while maintaining the first RRC connection with the first base station.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 28, 2024
    Inventors: Chun-Fan Tsai, Kun-Lin Wu, Mu-Tai Lin
  • Publication number: 20240096776
    Abstract: A package substrate is provided and includes a core board body and a first circuit structure and a second circuit structure disposed on opposite sides of the core board body, where the number of wiring layers of the second circuit structure is different from the number of wiring layers of the first circuit structure, so that the package substrate is asymmetrical. The first circuit structure and the second circuit structure are designed according to the thickness and coefficient of thermal expansion of the first dielectric layer of the first circuit structure and the second dielectric layer of the second circuit structure, so as to prevent the problem of warping from occurring to the package substrate.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Andrew C. CHANG, Min-Yao CHEN, Sung-Kun LIN
  • Publication number: 20240068601
    Abstract: A pipeline (180) provided with a silencing structure, the pipeline comprising a pipe (150) and a silencing structure (100). The pipe (150) has a uniform diameter. The silencing structure (100) comprises a main silencing pipe (210) and a baffle (220). The baffle (220) is disposed around the main silencing pipe (210) and is connected on the main silencing pipe (210), and the baffle (220) comprises an opposite first side and second side; the main silencing pipe (210) extends on the first side and/or the second side of the baffle (220); the main silencing pipe (210) of the silencing structure (100) is disposed in the pipe (150) and is connected to the pipe (150) by means of the baffle (220); and the baffle (220) is configured to be capable of stopping a fluid from flowing through the baffle (220) from the space between the pipe (150) and the main silencing pipe (210).
    Type: Application
    Filed: January 6, 2022
    Publication date: February 29, 2024
    Inventors: Shengmei Yang, Kun Lin
  • Publication number: 20240058668
    Abstract: A golf club setting rack has a first fixing portion, a second fixing portion, a first cross structure, and a second cross structure. The first fixing portion and the second fixing portion are mounted on the opening frame of the golf bag. The first cross structure and the second cross structure are securely mounted on the first fixing portion and the second fixing portion. Each one of the first cross structure and the second cross structure has multiple recesses. The recesses of the first cross structure correspond to the first row compartments of the opening frame in location; the recesses of the second cross structure correspond to the second row compartments of the opening frame in location. Therefore, when multiple clubs are stored in the compartments of the golf bag, heads of the clubs may be received and constrained in the recesses of the golf club setting rack.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Inventor: Kun-Lin Shiao
  • Publication number: 20240050501
    Abstract: The invention discloses a method for forming a fungi fermentation product containing N-acetylglucosamine. The fungi fermentation product containing N-acetylglucosamine can convert cancer cells into normal cells through a mesenchymal epithelial transition mechanism. The method uses fungi as a starting material which together with a Cordyceps-related fungus is fermented to form a fermentation product which induces a mesenchymal epithelial transition to convert cancer cells into normal cells. The fungi cell wall contains chitin. The fermentation liquid is produced by fermentation of Cordyceps with chitin as the substrate. The main product is N-acetylglucosamine confirmed by an HPLC analysis. According to the experimental data, the fermentation product of N-acetylglucosamine converts cancer cells into epithelial cells that contain E-cadherin and has a square shape.
    Type: Application
    Filed: March 22, 2023
    Publication date: February 15, 2024
    Inventor: Kun-Lin Yang
  • Publication number: 20240021438
    Abstract: A manufacturing method of a package substrate is provided, the manufacturing method includes forming a first circuit layer on a first metal layer; forming a dielectric layer on the first metal layer and the first circuit layer; forming a second metal layer on the dielectric layer; forming a plurality of conductive blind vias in the dielectric layer and forming a second circuit layer on the second metal layer, where the plurality of conductive blind vias are electrically connected to the first circuit layer and the second circuit layer; and removing the first metal layer and a portion of the second metal layer simultaneously. Therefore, in the manufacturing method, the first metal layer and the second metal layer can be removed by one etching process, such that the time for manufacturing the package substrate can be greatly reduced to increase production quantity.
    Type: Application
    Filed: May 17, 2023
    Publication date: January 18, 2024
    Inventors: Andrew C. CHANG, Min-Yao CHEN, Sung-Kun LIN
  • Patent number: 11841398
    Abstract: The invention relates to a method, an apparatus and a non-transitory computer-readable storage medium for debugging a solid-state disk (SSD) device. The method is performed by a processing unit of a single-board personal computer (PC) when loading and executing a function of a runtime library, to include: receiving a request to drive a General-Purpose Input/Output (GPIO) interface (I/F), which includes a parameter required for completing a Joint Test Action Group (JTAG) command; issuing a first hardware instruction to the GPIO I/F to set a register corresponding to a GPIO test data input (TDI) pin according to the parameter carried in the request for emulating to issue the JTAG command to a solid-state disk (SSD) device, wherein the single-board PC is coupled to the SSD device through the GPIO I/F; issuing a second hardware instruction to the GPIO I/F to read a value of the register corresponding to the GPIO TDI pin; and replying with a completion message in response to the request.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: December 12, 2023
    Assignee: Silicon Motion, Inc.
    Inventors: Yu-Lin Jiang, Kun-Lin Ho
  • Patent number: 11825055
    Abstract: An optical module positioning method for an image processing device is provided. The image processing device includes a scanning platform and an optical module. The scanning platform includes a first region, a second region, a third region and a fourth region. The fourth region is arranged between the first region and the second region. The first region is arranged between the third region and the fourth region. The optical module positioning method includes the following steps. Firstly, the optical module is driven to perform a scanning operation to acquire a scanned image while the optical module is not moved. Then, by judging the color values of two ends of the scanned image, the region where the optical module is stayed can be recognized according to the associated color values.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: November 21, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventor: Kun-Lin Wu
  • Patent number: 11795018
    Abstract: A document managing method for a printing device is provided. The document managing method includes the following steps. Firstly, a printing mechanism prints a document with plural papers, and transfers the plural papers to a paper collection platform. Then, a management module manages the plural papers from two lateral sides of the plural papers. Then, a paper ejection module ejects a first portion of the plural papers at a first speed, and then ejects a second portion of the plural papers at a second speed. Consequently, the plural papers are exited from the paper collection platform. Then, the management module is separated from the two lateral sides of the plural papers, so that the plural papers fall down to a supporting tray. The first speed is faster than the second speed.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: October 24, 2023
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Kun-Lin Wu, Fang-Hsuan Kuo
  • Publication number: 20230332322
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Application
    Filed: June 23, 2023
    Publication date: October 19, 2023
    Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI
  • Patent number: 11781818
    Abstract: A heat dissipation fin includes a body and an airflow guiding structure. The body has a first surface and a second surface opposite to each other and an airflow hole penetrating the first surface and the second surface. The airflow guiding structure is obliquely joined on the first surface of the body and covers part of the airflow hole. An airflow passage is formed between the airflow guiding structure and the first surface. Part of an airflow is adapted to pass along the first surface through the airflow passage to flow away. Part of the airflow passes in a direction from the second surface through the airflow hole to flow away.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 10, 2023
    Assignee: ASROCK INC.
    Inventor: Yi Kun Lin
  • Publication number: 20230298986
    Abstract: A package substrate and the manufacturing method thereof are provided. The method includes encapsulating a circuit layer and a conductive pillar on the circuit layer with an insulating layer, and then forming a groove in the insulating layer corresponding to the conductive pillar, so as to form a routing layer in the groove, so there is no need for drilling to make blind vias. Therefore, the alignment problem of conventional circuits and conductive blind vias can be avoided.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 21, 2023
    Inventors: Min-Yao CHEN, Sung-Kun LIN, Andrew C. CHANG
  • Patent number: 11732379
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 22, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zong-Kun Lin, Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Yi-Ming Dai
  • Publication number: 20230209794
    Abstract: A temporary storage and reflow frame substrate system includes a substrate frame, a substrate loading and unloading station, a first conveying unit, and a second conveying unit. The substrate frame is suitable for loading the substrate. The substrate loading and unloading station includes a robotic arm, a feeding and discharging unit and a returning unit, the substrate frame is suitable for connecting to the feeding and discharging unit and the returning unit, the robotic arm is suitable to place the substrate into or remove the substrate from the substrate frame. The first conveying unit is connected to the feeding and discharging unit and is suitable for conveying the substrate frame. The second conveying unit is connected between the first conveying unit and the returning unit, in order to return the substrate frame to the returning unit, thereby loading and unloading the substrate at the substrate loading and unloading station.
    Type: Application
    Filed: April 21, 2022
    Publication date: June 29, 2023
    Inventor: KUN-LIN CHOU
  • Patent number: D1021576
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: April 9, 2024
    Inventor: Kun Lin